80S-20用户手册.pdf - 第60页

1 Introduction SIPLACE 80S-20 /F4 User Manual 1.13 Overview o f the modules - placement heads Software version SR.407.xx 01/2001 US Edition 60 1.13. 5 Desc ription of the Pick&Place he ad The Pick & Pl ace head w…

SIPLACE 80S-20/F4 User Manual 1 Introduction

Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads

1.13.4 Structure of the Pick&Place head

Fig. 1.13 - 2 Structure of the Pick&Place head.

(1) Sleeve

(2) DR axis driving mechanism

(3) Z axis driving mechanism

(4) Fine pitch vision module

1 Introduction SIPLACE 80S-20/F4 User Manual

1.13 Overview of the modules - placement heads Software version SR.407.xx 01/2001 US Edition

1.13.5 Description of the Pick&Place head

The Pick&Place head works according to the pick&place principle, which means that a compo-

nent is picked up by the nozzle with the aid of a vacuum. After optical centering with the fine pitch

or flip chip vision module, the component is turned to the correct placement angle, and inserted

into the PCB with high precision. The Pick&Place is particularly striking because of its high angu-

lar accuracy. 1

1.13.6 Technical data - Pick&Place head

Component range up to 55mm x 55mm

Max. height

Component height ≤ 13.5mm - PCB thickness

- PCB sagging

Option:

Component height ≤ 20mm - PCB thickness

- PCB sagging

Min. lead pitch 0.4mm (standard), 0.25mm (option)

Max. dimensions

up to 32mm x 32mm with single measurement

up to 55mm x 55mm with quadruple measurement

Max. weight 25 g

Programmable placement

force

1 - 10 N

Nozzle types

4xx, 5 standard nozzles including flip chip nozzle with nozzle

changer

Component centering

Fine pitch component vision module (standard)

Flip chip vision module (option)

Benchmark placement rate 1,800 components/hour

D axis resolution 0.005°

Angular accuracy ± 0.052° / 3 σ, ± 0.07° / 4 σ, ± 0.105° / 6 σ

Placement accuracy ± 37.5 µm / 3 σ, ± 50 µm / 4 σ, ± 75 µm / 6 σ

SIPLACE 80S-20/F4 User Manual 1 Introduction

Software version SR.407.xx 01/2001 US Edition 1.14 Overview of the modules - vision systems

1.14 Overview of the modules - vision systems

Every machine has 1

– a PCB vision module on the Collect&Place head,

– a fine pitch component vision module on the machine base, and

– a PCB vision module on the underside of the X-axis gantry

The vision evaluation unit is located on the machine’s control unit. The component vision module

is used to 1

– determine the precise position of the component at the nozzle, and

– the geometry of the package form.

The PCB vision module uses fiducials on the PCB to determine 1

– the position of the PCB,

– its rotational angle,

– and the PCB distortion.

Damaged PCBs or subpanels are marked with ink spots. The PCB vision module scans the ink

spots, and signals that these circuits should not be placed. 1

The PCB vision module also uses fiducials on the feeders to determine the precise component

pick-up position. This is particularly important for tiny components. 1

1.14.1 Technical data of the component vision module on the 12-segment

Collect&Place head

Max. component dimensions 0.5mm x 1.0mm to 18.7mm x 18.7mm

Component range

0402 to PLCC44

including BGA, µBGA, flip chip, TSOP, QFP

PLCC, SO to SO32, DRAM

Minimum lead pitch ≥ 0.5 mm

Field of view 24mm x 24mm

Method of illumination Front lighting (3 levels programmable as required)