80S-20用户手册.pdf - 第59页

SIPLACE 80S -20/F4 User Manual 1 Introduction Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads 59 1.13.4 Structure of the P ick & Place head 1 Fig. 1.13 - 2 St ructure of t…

1 Introduction SIPLACE 80S-20/F4 User Manual

1.13 Overview of the modules - placement heads Software version SR.407.xx 01/2001 US Edition

– The component vision camera creates an image of the current component.

– The precise position of the component is also determined.

– The package form of the current component is compared against the programmed package

form in order to identify it. Any components that cannot be identified are rejected.

– The turning station turns the component to the required placement angle.

1.13.2 Description of the 12-segment Collect&Place head

– The 12-segment Collect&Place head works using the "Collect & Place" principle, i.e. the com-

ponents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,

are placed gently and accurately on the PCB with the aid of blast air. The vacuum in the noz-

zles is also checked several times to determine whether the components were picked up and

set down correctly.

– The "adaptive" sensor stop mode of the Z-axis compensates for any irregularity of the

PCB-surface when the components are set down.

– Defective components are rejected, and are reworked during a repair cycle.

1.13.3 Technical data of the 12-segment Collect&Place head

Component range 0402 to 18.7mm x 18.7mm including BGA, µBGA,

flip chip, TSOP, QFP, PLCC, SO to SO32, DRAM

Max. height 6 mm

Min. lead pitch 0.5 mm

Min. dimensions 0.5 mm x 1.0 mm

Max. dimensions 18.7 mm x 18.7 mm

Max. weight 2 g

Max. travel of z axis 16 mm

Programmable placement force 2.4 to 5.0 N

Nozzle types 7xx

Angular accuracy ± 0.525° / 3 σ, ± 0.70° / 4 σ, ± 1.05° / 6 σ

Placement accuracy ± 67.5 µm / 3 σ, ± 90 µm / 4 σ, ± 135 µm / 6 σ

SIPLACE 80S-20/F4 User Manual 1 Introduction

Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads

1.13.4 Structure of the Pick&Place head

Fig. 1.13 - 2 Structure of the Pick&Place head.

(1) Sleeve

(2) DR axis driving mechanism

(3) Z axis driving mechanism

(4) Fine pitch vision module

1 Introduction SIPLACE 80S-20/F4 User Manual

1.13 Overview of the modules - placement heads Software version SR.407.xx 01/2001 US Edition

1.13.5 Description of the Pick&Place head

The Pick&Place head works according to the pick&place principle, which means that a compo-

nent is picked up by the nozzle with the aid of a vacuum. After optical centering with the fine pitch

or flip chip vision module, the component is turned to the correct placement angle, and inserted

into the PCB with high precision. The Pick&Place is particularly striking because of its high angu-

lar accuracy. 1

1.13.6 Technical data - Pick&Place head

Component range up to 55mm x 55mm

Max. height

Component height ≤ 13.5mm - PCB thickness

- PCB sagging

Option:

Component height ≤ 20mm - PCB thickness

- PCB sagging

Min. lead pitch 0.4mm (standard), 0.25mm (option)

Max. dimensions

up to 32mm x 32mm with single measurement

up to 55mm x 55mm with quadruple measurement

Max. weight 25 g

Programmable placement

force

1 - 10 N

Nozzle types

4xx, 5 standard nozzles including flip chip nozzle with nozzle

changer

Component centering

Fine pitch component vision module (standard)

Flip chip vision module (option)

Benchmark placement rate 1,800 components/hour

D axis resolution 0.005°

Angular accuracy ± 0.052° / 3 σ, ± 0.07° / 4 σ, ± 0.105° / 6 σ

Placement accuracy ± 37.5 µm / 3 σ, ± 50 µm / 4 σ, ± 75 µm / 6 σ