80S-20用户手册.pdf - 第57页
SIPLACE 80S -20/F4 User Manual 1 Introduction Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads 57 1.13 Overv iew of the modules - placement heads 1.13.1 Structure of the 12-seg…
1 Introduction SIPLACE 80S-20/F4 User Manual
1.12 Overview of the modules - gantry Software version SR.407.xx 01/2001 US Edition
56
1.12.3 Technical data of the X axis
1.12.4 Structure of the Y axis
The y axis essentially consists of the following main modules: 1
– DC servomotor
– Y axis toothed belt
– Y axis guide system
– Y axis measuring system
1
Each y axis is driven by a DC servomotor. An anti-crash circuit prevents the paths of the gantries
meeting. 1
1.12.5 Technical data of the Y axis
Driving mechanism DC servomotor/toothed belt
Max. speed 2.0 m/sec.
Travel path 620 mm
Distance measuring system Linear metal scale
Scale length 646 mm
Resolution 2.5 µm
Driving mechanism DC servomotor/toothed belt
Max. speed 2.5 m/sec.
Path of the gantries 910 mm
Distance measuring system Linear metal scales
Scale length 970 mm
Resolution 2.5 µm
SIPLACE 80S-20/F4 User Manual 1 Introduction
Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads
57
1.13 Overview of the modules - placement heads
1.13.1 Structure of the 12-segment Collect&Place head
1
Fig. 1.13 - 1 Structure of the 12-segment Collect&Place head
All the components are inserted with the same cycle time. Before the component is inserted, it is
measured by the optoelectronic vision module. 1
(1) Star with 12 sleeves (2) Motor for "Reject" valve adjustment drive
(3) Turning station (4) Component vision module
(5) Z axis driving mechanism (6) Star motor
1 Introduction SIPLACE 80S-20/F4 User Manual
1.13 Overview of the modules - placement heads Software version SR.407.xx 01/2001 US Edition
58
– The component vision camera creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement angle.
1.13.2 Description of the 12-segment Collect&Place head
– The 12-segment Collect&Place head works using the "Collect & Place" principle, i.e. the com-
ponents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,
are placed gently and accurately on the PCB with the aid of blast air. The vacuum in the noz-
zles is also checked several times to determine whether the components were picked up and
set down correctly.
– The "adaptive" sensor stop mode of the Z-axis compensates for any irregularity of the
PCB-surface when the components are set down.
– Defective components are rejected, and are reworked during a repair cycle.
1.13.3 Technical data of the 12-segment Collect&Place head
Component range 0402 to 18.7mm x 18.7mm including BGA, µBGA,
flip chip, TSOP, QFP, PLCC, SO to SO32, DRAM
Max. height 6 mm
Min. lead pitch 0.5 mm
Min. dimensions 0.5 mm x 1.0 mm
Max. dimensions 18.7 mm x 18.7 mm
Max. weight 2 g
Max. travel of z axis 16 mm
Programmable placement force 2.4 to 5.0 N
Nozzle types 7xx
Angular accuracy ± 0.525° / 3 σ, ± 0.70° / 4 σ, ± 1.05° / 6 σ
Placement accuracy ± 67.5 µm / 3 σ, ± 90 µm / 4 σ, ± 135 µm / 6 σ