80S-20用户手册.pdf - 第58页

1 Introduction SIPLACE 80S-20 /F4 User Manual 1.13 Overview o f the modules - placement heads Software version SR.407.xx 01/2001 US Edition 58 – The c omponent vision camera c reates an i mage of the curre nt compon ent.…

SIPLACE 80S-20/F4 User Manual 1 Introduction

Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads

1.13 Overview of the modules - placement heads

1.13.1 Structure of the 12-segment Collect&Place head

Fig. 1.13 - 1 Structure of the 12-segment Collect&Place head

All the components are inserted with the same cycle time. Before the component is inserted, it is

measured by the optoelectronic vision module. 1

(1) Star with 12 sleeves (2) Motor for "Reject" valve adjustment drive

(3) Turning station (4) Component vision module

(5) Z axis driving mechanism (6) Star motor

1 Introduction SIPLACE 80S-20/F4 User Manual

1.13 Overview of the modules - placement heads Software version SR.407.xx 01/2001 US Edition

– The component vision camera creates an image of the current component.

– The precise position of the component is also determined.

– The package form of the current component is compared against the programmed package

form in order to identify it. Any components that cannot be identified are rejected.

– The turning station turns the component to the required placement angle.

1.13.2 Description of the 12-segment Collect&Place head

– The 12-segment Collect&Place head works using the "Collect & Place" principle, i.e. the com-

ponents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,

are placed gently and accurately on the PCB with the aid of blast air. The vacuum in the noz-

zles is also checked several times to determine whether the components were picked up and

set down correctly.

– The "adaptive" sensor stop mode of the Z-axis compensates for any irregularity of the

PCB-surface when the components are set down.

– Defective components are rejected, and are reworked during a repair cycle.

1.13.3 Technical data of the 12-segment Collect&Place head

Component range 0402 to 18.7mm x 18.7mm including BGA, µBGA,

flip chip, TSOP, QFP, PLCC, SO to SO32, DRAM

Max. height 6 mm

Min. lead pitch 0.5 mm

Min. dimensions 0.5 mm x 1.0 mm

Max. dimensions 18.7 mm x 18.7 mm

Max. weight 2 g

Max. travel of z axis 16 mm

Programmable placement force 2.4 to 5.0 N

Nozzle types 7xx

Angular accuracy ± 0.525° / 3 σ, ± 0.70° / 4 σ, ± 1.05° / 6 σ

Placement accuracy ± 67.5 µm / 3 σ, ± 90 µm / 4 σ, ± 135 µm / 6 σ

SIPLACE 80S-20/F4 User Manual 1 Introduction

Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads

1.13.4 Structure of the Pick&Place head

Fig. 1.13 - 2 Structure of the Pick&Place head.

(1) Sleeve

(2) DR axis driving mechanism

(3) Z axis driving mechanism

(4) Fine pitch vision module