Oxford-100-Manual.pdf - 第143页

System Manual Oxford Instruments Plasma Technology Plasma lab Process Guide Plasma lab Process Information (Information contained in this document is confidential) Printed: 08 January 2006 09:37 Page 1 of 30 Issue 1: Dec…

100%1 / 362
Plasma
lab
System
100
Oxford
Instruments
Plasma
Technology
System
Manual
7.1
About
this
Section
This Section contains
the
GIPT
'Process Guide' document.
Note
that
this
document
includes a
Glossary
of
Terms.
Issue
1:
December
03
Process
Guide and Glossary
Page 7-2
of
2
Printed:
25
May
200510:16
System
Manual
Oxford
Instruments
Plasma Technology
Plasma
lab
Process
Guide
Plasma
lab
Process
Information
(Information
contained
in
this
document
is
confidential)
Printed: 08 January 2006 09:37 Page 1
of
30
Issue
1:
December
03
Plasma
lab
Contents
Oxford
Instruments
Plasma
Technology
System
Manual
1
Introduction
3
1.1
About
this
guide
3
1.2 Health and safety 3
1.3
Terminology
3
1.4
Document
structure 3
2 The
clean
room
4
3 Processes 5
3.1
General 5
3.2
RIE
processes 6
3.2.1
RIE
operating
parameter
ranges 6
3.2.2
ICP
operating
parameter
ranges 7
3.2.3 Low-pressure strike
facility
8
3.2.4
DC
bias 8
3.2.4.1 Electronegative gas mixtures 8
3.2.4.2
ICP
sources 9
3.2.4.3
DC
bias
polarity
9
3.2.4.4
DC
bias
control
9
3.2.4.5
DC
bias
reproducibility
9
3.2.5
Arcing!
pitting
10
3.2.6 Etch process chamber cleaning recipes 10
3.2.7 Sample
cooling!
gluing
11
3.2.8
Use
of
helium
backing
for
effective
process
temperature
control
12
3.2.8.1 Scope 12
3.2.8.2 Purpose 12
3.2.8.3 Simple
Method
to
check Helium backing
12
3.2.9
Gases
with
low
vapour
pressure 14
3.2.10
Endpoint
detection
techniques 14
3.2.10.1 Optical emission spectroscopy 14
3.2.10.2 Laser
interferometry
15
3.2.10.3 Comparison
of
OES
and laser
endpoint
techniques
15
3.2.10.4 Typical
OES
endpoint
wavelengths 16
3.2.10.5
Endpoint
algorithm
examples 16
3.2.11
Gas
calibration
factors
17
3.2.12 Exhaust emissions
17
3.3
PECVD
processes 18
3.3.1
PECVD
operating
parameter
ranges 18
3.3.2
Low
frequency
matching
18
3.3.3 Premature
flaking
of
chamber
wall!
showerhead material 19
3.3.4
PECVD
particles 20
3.3.5 Enlarging
of
showerhead holes
21
3.3.6 Optical emission
endpoint
detector
for
chamber clean process
21
3.4 Process
troubleshooting
23
3.4.1
Partial process
failure
23
3.4.1.1 Example problems
23
3.4.1.2 Typical causes
23
3.4.2 Total process
failure
23
3.4.2.1 Example problems
23
3.4.2.2 Typical causes
23
4 Glossary
of
terms
25
5 OIPT
locations
worldwide
30
Process
Information
(Information
contained
in
this
document
is
confidential)
Issue
1:
December 03 Page 2
of
30 Printed: 08 January 2006 09:37