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PlasmalabSystem 100 Oxford Instruments Plasma Technology System Manual 5.4.5 Automatic process run An automatic process run as described in this sub-section can be carried out by a user logged on as a Manager. See sub-se…
System
Manual
Oxford
Instruments
Plasma
Technology
PiasmaiabSystem100
Continue
button:
Close
the
alert
dialogue
box
-
the
alert
banner
remains displayed
on
the
menu
bar.
5.4.4
Note
that
option
buttons
that
are
not
available (i.e.
Accept
and Cancel
due
to
user
'logged
on'
status and
Next
when
there
is
only
one
active alert) are greyed out.
The
alert
message usually contains an adequate description
of
the
detected event.
If
it
is
a
service
fault
(water
flow,
purge
gas etc.)
then
verify
that
the
service
is
available
to
the
machine
as
soon
as
possible. Depending
on
the
nature
of
the
service,
the
system may
allow
the
machine
to
continue
to
operate,
so
that
the
current
process can be completed. Do
not
start
a
new
process
before
checking
the
service.
The red alerts are
often
due
to
a process
setpoint
being
out
of
tolerance
for
too
long.
In
these
cases,
the
process
is
halted
by
the
system.
If
it
is
authorised
to
resume processing
with
a
parameter
deviation
then:
1)
Check
the
most recent process
log
to
find
the
process
time
remaining.
2)
Construct a
new
process
with
a
modified
process
time
and check
the
'Ignore
tolerance'
option.
Note
that
this removes
illl
tolerance checking. The machine should
be
monitored
by an
operator
for
further
deviations
when
operated
in this
condition.
Pumping
down
1)
On
the
Pump
Control
page, select
the
SET
BASE
PRESSURE
button,
then
enter
the
required
process chamber base pressure
if
different
from
the
default.
2)
Ensure
that
the
Automatic
load
lock/transfer chamber's lid
is
closed.
(Automatic
load
lock/transfer chamber lid open/closed status
is
shown in
the
panel adjacent
to
the
mimic).
3)
Click on each
dry
pump/rotary
vane
pump
mimic
to
start
the
pump.
4)
Select
the
Evacuate
button
for
the
process chamber. The relevant valves
will
operate
and
the
process chamber
will
be
pumped
down.
5)
Select
the
Evacuate
button
for
the
Automatic
load lock. You
will
be
prompted
to
enter
a
wafer
identity
-
either
enter
the
identity
and click OK,
or
click Cancel
(to
pump
down
without
a
wafer
in
the
Automatic
load lock). The relevant valves
will
operate
and
the
Automatic
load lock
will
be
pumped
down.
NOTE:
Turning
off
any
rotary
vane
pump
will
cause all process and
pumping
actions using
that
pump
to
stop.
6)
To achieve a
low
base pressure
in
the
system,
pump
for
at
least
12
hours.
Where
chambers
or
process heaters are
part
of
the
system, raise
the
temperatures
of
these
near
their
maximum
values
for
the
first
six hours
of
pumping
to
assist out-gassing,
then
return
the
temperature
to
ambient.
WARNING
PARTS
OF
THE EQUIPMENT
MAY
BE
TOO HOT TO TOUCH DURING CHAMBER
HEATING.
Printed: 22-Mar-06. 10:42
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PlasmalabSystem100
Oxford
Instruments
Plasma
Technology
System
Manual
5.4.5
Automatic
process run
An
automatic
process
run
as
described
in
this sub-section can be carried
out
by
a user
logged
on
as
a Manager.
See
sub-section 5.4.6, page 5-17
for
details
of
a single
button
automatic
process run,
which
can be carried
out
by
any user.
1)
Insert
the
wafer
into
the
Automatic
load lock.
(If
necessary,
vent
the
Automatic
load
lock
by
selecting
the
STOP
button
then
the
VENT
button).
2)
Close
the
Automatic
load lock's lid.
3)
Select
the
relevant EVACUATE
button.
A
dialogue
box
will
be displayed
allowing
entry
of
a
Wafer
Identity,
if
any.
4)
Check
that
the
system has
pumped
down
to
base pressure. (The process chamber
message panel should display 'Base Pressure reached'.)
5)
Ensure
that
the
Automatic
load lock
is
at
the
required
pressure. (Check
the
relevant
panel
on
the
Pump Control page). Green
'ready
for
transfer'
indicators (...
~)
are
displayed on each chamber mimic
when
it
is
available
for
vacuum transfer.
6)
Select
the
Process menu,
then
the
Recipe
option.
Click
on
the
Load
button
then
select
the
required
recipe.
7)
Click
on
the
Run
button.
This
will
start
wafer
transfers and
wafer
processing.
NOTES:
a)
You can pause
the
process
at
any
time
by selecting
the
PAUSE
button.
This
will
cause
the
Step Time and
the
plasma
power
to
stop
with
the
current
step
time
indicated. Re-starting
the
process
will
cause
the
process
to
continue
from
the
time
it
was paused. If,
during
the
pause
period,
you
change any
of
the
process parameters, e.g. gas demand,
pressure etc.,
you
must press
the
START
button
for
the
changes made
to
come
into
effect, this
will
cause
the
step
timer
to
continue
from
the
time
it
was paused.
b) You can stop
the
process
at
any time;
the
message 'Process Complete'
will
be displayed,
if
required,
you
can
then
run
the
same
or
another
process.
WARNING
CONTACT WITH TOXIC GASES
CAN
CAUSE DEATH OR SERIOUS INJURY.
WHERE
ANY
PROCESS GAS IS TOXIC,
DO
NOT TRANSFER A WAFER
FROM
THE
PROCESS CHAMBER TO THE LOAD LOCK UNTIL ALL PROCESS
GAS
HAS BEEN
PUMPED OUT.
ENSURE THAT THE AUTOMATIC VENT SEQUENCE IS ALLOWED TO COMPLETE.
IF THESE PRECAUTIONS ARE NOT CARRIED OUT, THERE COULD
BE
A
HAZARD
IN
THE
LOAD
LOCK.
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Printed: 22-Mar-06, 10:42
System
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Oxford
Instruments
Plasma Technology
PlasmalabSystem
100
5.4.6
8)
When
the
'Process
Complete'
message
is
displayed, select
the
Pump Control page
and
move
the
wafer
from
the
process chamber
to
the
Automatic
load lock using
the
same
method
as
the
transfer
in.
9)
Open
the
Automatic
load
lock's lid and remove
the
wafer.
10)
If
required,
the
system can
now
be vented,
see
sub-section 5.4.9 page 5-20.
Single
button
automatic
process run
A single
button
automatic
process
run
allows a
complete
process
to
be run automatically. The
run
starts
by
pumping
the
system
down,
carrying
out
the
process and
then
venting
the
system. The
automatic
process run can be carried
out
by a user
logged
on
at
any
access
level,
e.g. Manager, User etc
..
Before
starting
an
automatic
process run,
the
rotary
vanelroots/dry pumps must be started.
It
is
suggested
that
once
the
system
is
powered
up,
the
Manager
logs on, starts
the
pumps,
evacuates
the
process chamber and
then
re-Iogs
on
for
the
User
or
Production
Operator
to
carry
out
the
automatic
process run(s).
When
the
pumps have started and
the
User
or
Production
Operator
is
logged
on, carry
out
the
automatic
process
run
using
the
following
steps.
1) Insert
the
wafer
into
the
Automatic
load lock.
(If
necessary,
vent
the
Automatic
load
lock
by
selecting
the
STOP
button
then
the
VENT
button).
2)
Close
the
Automatic
load
lock's lid.
3)
In
PC
2000, select
the
System menu and
then
the
Recipe
option.
The Recipe page
is
displayed.
4)
Load
the
required
recipe.
5)
Select
the
Run
button.
You
will
be
prompted
enter
a
wafer
identity;
enter
the
wafer
identity
and select
the
OK
button.
The
following
sequence
will
be
automatically
carried
out:
i) The
automatic
load lock
will
start
to
evacuate and
the
Process
page
is
displayed.
ii)
When
the
automatic
load lock reaches base pressure,
the
wafer
will
be
transferred
into
the
process chamber.
iii)
When
the
wafer
has been transferred
into
the
process chamber,
the
recipe
will
start.
iv)
When
all
of
the
process steps have completed,
the
Pump Control page
is
displayed,
the
wafer
will
be transferred
into
the
automatic
load lock and
then
the
automatic
load lock
will
vent.
6)
When
the
vent
sequence
is
completed, open
the
automatic
load lock's lid and
remove
the
wafer.
To process
another
wafer,
repeat
the
above steps
from
Step 1).
If
running
the
same recipe,
Step 4 can be skipped
otherwise
load
another
recipe.
Printed: 22-Mar-06, 10:42
Operating
Instructions
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5-17
of
52
UC
Davis 94-721001
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1:
March 06