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Plasma lab 2 The clean room Oxford Instruments Plasma Technology System Manual It is recommended that the OIPT process tool(s) are installed in a 'clean room' that meets the following requirements: • HEPA filte…

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System
Manual
1
Introduction
Oxford
Instruments
Plasma
Technology
Plasma
lab
1.1
About
this
guide
This
guide
gives
information
about
plasma processes based on
Oxford
Instruments Plasma Technology's
(OIPT)
long
experience in
the
semiconductor industry.
The scope
of
the
guide
is
to
provide
a general
introduction
to
process strategies and
common
process
problems, and has
not
been prepared
for
a
particular
version
of
hardware. The
information
is
presented
to
help
users
obtain
optimum
results
from
their
specific process applications using Plasmalab systems.
To ensure
that
the
information
is
as
comprehensive and
up-to-date
as
possible,
it
has been collated
from
the
following
sources
within
OIPT:
In-house
Applications
Laboratory'
(Process Lab reports, manager's notes, customer feedback etc.).
Service
Department
(customer feedback, on-site experience etc.)
Technology
Department
(external
information
sources, design reviews, customer liaison, etc.)
1.2
Health
and
safety
For
health
and safety
information,
see
Section 1 (Health and Safety)
of
your
Plasmalab system manual.
The customer
is
always responsible
for:
(A) Delivery
of
process gases
to
the
tool.
(B)
Removal
of
exhaust gases
from
the
tool.
(C)
Maintaining
a safe system
of
work
in using and
maintaining
the
tool.
1.3
Terminology
Material
presented
within
this
guide
is
aimed
at
users
who
have
knowledge
of
plasma processes and
the
terms used. However,
if
you
come across an
unfamiliar
term, please
refer
to
Section 4 (Glossary
of
Terms).
1.4
Document
structure
The
text
in
this
document
is
logically
divided
into
general
information
and specific
information
relevant
to
the
main
process types
(RIE
and
PECVD)
and
is
generally
applicable
to
all Plasmalab systems.
Where
information
is
only
applicable
to
a specific system, e.g.
the
Plasmalab 80
Plus
RIE.
this
is
stated.
1 The
Application
Laboratory
is
a
purpose-built
clean
room
facility
housing examples
of
all
of
our
Plasmalab systems
for
research and
development
purposes.
Each
of
these systems
is
installed in
accordance
with
our
standard
installation
data documents supplied
to
customers
for
each system type.
Process
Information
(Information
contained
in
this
document
is
confidential)
Printed: 08 January 2006 09:37 Page 3
of
30
Issue
1:
December
03
Plasma
lab
2 The clean
room
Oxford
Instruments
Plasma
Technology
System
Manual
It
is
recommended
that
the
OIPT
process tool(s) are installed in a 'clean
room'
that
meets
the
following
requirements:
•
HEPA
filtered
air
conditioning
system, ideally
laminar
flow.
• Clean
room
walls/ceiling/flooring
constructed
from
low
particulate
materials.
•
Work
areas shall remain free
from
waste materials.
• Covered waste containers shall be
provided
and
emptied
regularly.
• Gangways shall remain clear
at
all times.
•
Access
to
H&S
/
COSHH
data sheets shall be
maintained
at
all times.
•
Access
to
fire
protection
equipment
shall be
maintained
at
all times
..
•
Appropriate
warning
labels shall be provided
where
required.
• Samples shall be covered
where
practicable,
particularly
at
the
end
of
a
working
shift.
• No
eating
/drinking
or
smoking shall be
permitted
in
the
clan
room/laboratory.
• Restricted
access
shall
be
maintained
and a list
of
authorised persons shall be displayed outside
the
processing areas.
All
other
persons
entering
the
area shall be escorted
at
all times.
• Items
entering
the
processing area shall be inspected
for
cleanliness
prior
to
entry.
• Non-essential items shall be precluded
from
the
processing areas.
• Non-essential
equipment
or
documentation
shall
not
be stored
on
the
floor
area.
• Prior
to
entering
the
processing rooms, protective
clothing
shall be
worn
and shall
constitute
at
least over-shoes,
coat
and hat. These shall be made available
within
the
laboratory
access
room
and
will
be replaced
at
a
controlled
frequency. A bench shall
be
provided
to
aid dressing
with
protective
clothing. The bench area
immediately
adjacent
to
the
entry
door
to
the
laboratory
shall
contain
a tack
mat
to
further
prevent
contamination
ingress. Over shoes must
not
come
into
contact
with
the
area
that
has been used
for
day shoes.
• Cleaning
of
the
processing areas shall be
performed
with
suitably
filtered
vacuum
equipment.
• A cleaning
programme
shall be established and evidence
of
compliance
maintained
for
audit
purposes.
•
All
samples
in
current
use
or
in
temporary
storage
within
the
area shall be
identified.
•
Non-conforming
samples shall be
identified
and physically segregated
from
acceptable
work.
• Gloves shall be
worn
when
handling
unprotected
samples.
• Unused
tooling
/
equipment
shall be stored in a
manner
to
prevent
damage and
deterioration.
•
It
shall remain
the
responsibility
of
the
users
to
ensure
that
tooling
/
equipment
remains suitable
for
its
intended
purpose.
For Health & Safety guidelines,
refer
to
Section 1 (Health & Safety)
of
your
Plasmalab system manual.
For services required,
refer
to
OIPT
Services Specifications and
the
relevant
Installation Data
document
for
your
Plasmalab system.
Process
Information
(Information
contained
in
this
document
is
confidential)
Issue
1: December 03 Page 4
of
30 Printed:
OB
January 2006 09:37
System
Manual
3 Processes
3.1
General
Oxford
Instruments
Plasma Technology
Plasma
lab
Recommendations
for
all systems,
Le.
etch & deposition.
Day-to-day
operation
•
It
is
strongly
recommended
that
the
tools
are
left
switched
on
and
pumping
continuously (i.e.
do
not
switch
off
system
or
pumps). This ensures
the
maximum
lifetime
for
system and pumps and
optimum
process
repeatability.
•
Datalogging
of
each
run
is
strongly
recommended
to
allow
the
system
to
maintain
full
records
of
all process runs. Items
to
monitor
regularly
via datalogs are
as
follows:
o
APC
valve
angle
during
process -
if
this
is
different
from
original/earlier
data
it
indicates
MFC
and/or
pumping
problems.
o
RF
reflected
power
during
process - indicates
matching
or
striking
problems.
o
DC
bias readings
without
a
wafer
in chamber
(for
etch
tools
only). This may
identify
faulty
generator,
loss
of
power
in
matching
unit
or
shorting
of
electrode.
o
RF
Automatch
capacitor positions
(if
available) -
for
checking
reliability
of
RF
matching.
Weekly
checks
• Leak-up
rate
-
APC
closed, measure
rate
of
pressure rise: should be <1mTorr/minute.
• Partial pressure checks -
APC
fully
open, measure pressure versus
flow
for
all
MFCs
individually:
see
relevant
calibration
graph. This
will
identify
problems
with
MFCs
or
pumping.
• Fill rates
(if
possible), i.e. measure
rate
of
pressure rise
with
APC
closed (can be
performed
using
leak check software,
if
present),
for
each gas
at
a range
of
flow
rates, and in
particular
at
the
flow
rates
of
the
processes in
use.
This may
not
be possible
for
very
high
flow
rates (i.e.
deposition
processes) and
is
not
recommended
for
flammable
or
pyrophoric
gases.
This
will
identify
problems
with
MFCs
or
APC/gate valve
seals.
•
Pumpdown
times
from
vent
to
moderate
pressure e.g. 50mTorr. For example, this
would
be
typically 18
to
20 seconds
for
a roots!
rotary
system (e.g. standard
deposition
tool). This
will
identify
problems
with
pumping
performance. For load locked chambers, this check
would
be
performed
less
frequently,
e.g.
only
when
the
chamber
is
vented
for
maintenance.
Process
Information
(Information
contained
in
this
document
is
confidential)
Printed: 08
January
200609:37
Page 5
of
30
Issue
1:
December 03