Oxford-100-Manual.pdf - 第145页
System Manual 1 Introduction Oxford Instruments Plasma Technology Plasma lab 1.1 About this guide This guide gives information about plasma processes based on Oxford Instruments Plasma Technology's (OIPT) long exper…
Plasma
lab
Contents
Oxford
Instruments
Plasma
Technology
System
Manual
1
Introduction
3
1.1
About
this
guide
3
1.2 Health and safety 3
1.3
Terminology
3
1.4
Document
structure 3
2 The
clean
room
4
3 Processes 5
3.1
General 5
3.2
RIE
processes 6
3.2.1
RIE
operating
parameter
ranges 6
3.2.2
ICP
operating
parameter
ranges 7
3.2.3 Low-pressure strike
facility
8
3.2.4
DC
bias 8
3.2.4.1 Electronegative gas mixtures 8
3.2.4.2
ICP
sources 9
3.2.4.3
DC
bias
polarity
9
3.2.4.4
DC
bias
control
9
3.2.4.5
DC
bias
reproducibility
9
3.2.5
Arcing!
pitting
10
3.2.6 Etch process chamber cleaning recipes 10
3.2.7 Sample
cooling!
gluing
11
3.2.8
Use
of
helium
backing
for
effective
process
temperature
control
12
3.2.8.1 Scope 12
3.2.8.2 Purpose 12
3.2.8.3 Simple
Method
to
check Helium backing
12
3.2.9
Gases
with
low
vapour
pressure 14
3.2.10
Endpoint
detection
techniques 14
3.2.10.1 Optical emission spectroscopy 14
3.2.10.2 Laser
interferometry
15
3.2.10.3 Comparison
of
OES
and laser
endpoint
techniques
15
3.2.10.4 Typical
OES
endpoint
wavelengths 16
3.2.10.5
Endpoint
algorithm
examples 16
3.2.11
Gas
calibration
factors
17
3.2.12 Exhaust emissions
17
3.3
PECVD
processes 18
3.3.1
PECVD
operating
parameter
ranges 18
3.3.2
Low
frequency
matching
18
3.3.3 Premature
flaking
of
chamber
wall!
showerhead material 19
3.3.4
PECVD
particles 20
3.3.5 Enlarging
of
showerhead holes
21
3.3.6 Optical emission
endpoint
detector
for
chamber clean process
21
3.4 Process
troubleshooting
23
3.4.1
Partial process
failure
23
3.4.1.1 Example problems
23
3.4.1.2 Typical causes
23
3.4.2 Total process
failure
23
3.4.2.1 Example problems
23
3.4.2.2 Typical causes
23
4 Glossary
of
terms
25
5 OIPT
locations
worldwide
30
Process
Information
(Information
contained
in
this
document
is
confidential)
Issue
1:
December 03 Page 2
of
30 Printed: 08 January 2006 09:37
System
Manual
1
Introduction
Oxford
Instruments
Plasma
Technology
Plasma
lab
1.1
About
this
guide
This
guide
gives
information
about
plasma processes based on
Oxford
Instruments Plasma Technology's
(OIPT)
long
experience in
the
semiconductor industry.
The scope
of
the
guide
is
to
provide
a general
introduction
to
process strategies and
common
process
problems, and has
not
been prepared
for
a
particular
version
of
hardware. The
information
is
presented
to
help
users
obtain
optimum
results
from
their
specific process applications using Plasmalab systems.
To ensure
that
the
information
is
as
comprehensive and
up-to-date
as
possible,
it
has been collated
from
the
following
sources
within
OIPT:
In-house
Applications
Laboratory'
(Process Lab reports, manager's notes, customer feedback etc.).
Service
Department
(customer feedback, on-site experience etc.)
Technology
Department
(external
information
sources, design reviews, customer liaison, etc.)
1.2
Health
and
safety
For
health
and safety
information,
see
Section 1 (Health and Safety)
of
your
Plasmalab system manual.
The customer
is
always responsible
for:
(A) Delivery
of
process gases
to
the
tool.
(B)
Removal
of
exhaust gases
from
the
tool.
(C)
Maintaining
a safe system
of
work
in using and
maintaining
the
tool.
1.3
Terminology
Material
presented
within
this
guide
is
aimed
at
users
who
have
knowledge
of
plasma processes and
the
terms used. However,
if
you
come across an
unfamiliar
term, please
refer
to
Section 4 (Glossary
of
Terms).
1.4
Document
structure
The
text
in
this
document
is
logically
divided
into
general
information
and specific
information
relevant
to
the
main
process types
(RIE
and
PECVD)
and
is
generally
applicable
to
all Plasmalab systems.
Where
information
is
only
applicable
to
a specific system, e.g.
the
Plasmalab 80
Plus
RIE.
this
is
stated.
1 The
Application
Laboratory
is
a
purpose-built
clean
room
facility
housing examples
of
all
of
our
Plasmalab systems
for
research and
development
purposes.
Each
of
these systems
is
installed in
accordance
with
our
standard
installation
data documents supplied
to
customers
for
each system type.
Process
Information
(Information
contained
in
this
document
is
confidential)
Printed: 08 January 2006 09:37 Page 3
of
30
Issue
1:
December
03
Plasma
lab
2 The clean
room
Oxford
Instruments
Plasma
Technology
System
Manual
It
is
recommended
that
the
OIPT
process tool(s) are installed in a 'clean
room'
that
meets
the
following
requirements:
•
HEPA
filtered
air
conditioning
system, ideally
laminar
flow.
• Clean
room
walls/ceiling/flooring
constructed
from
low
particulate
materials.
•
Work
areas shall remain free
from
waste materials.
• Covered waste containers shall be
provided
and
emptied
regularly.
• Gangways shall remain clear
at
all times.
•
Access
to
H&S
/
COSHH
data sheets shall be
maintained
at
all times.
•
Access
to
fire
protection
equipment
shall be
maintained
at
all times
..
•
Appropriate
warning
labels shall be provided
where
required.
• Samples shall be covered
where
practicable,
particularly
at
the
end
of
a
working
shift.
• No
eating
/drinking
or
smoking shall be
permitted
in
the
clan
room/laboratory.
• Restricted
access
shall
be
maintained
and a list
of
authorised persons shall be displayed outside
the
processing areas.
All
other
persons
entering
the
area shall be escorted
at
all times.
• Items
entering
the
processing area shall be inspected
for
cleanliness
prior
to
entry.
• Non-essential items shall be precluded
from
the
processing areas.
• Non-essential
equipment
or
documentation
shall
not
be stored
on
the
floor
area.
• Prior
to
entering
the
processing rooms, protective
clothing
shall be
worn
and shall
constitute
at
least over-shoes,
coat
and hat. These shall be made available
within
the
laboratory
access
room
and
will
be replaced
at
a
controlled
frequency. A bench shall
be
provided
to
aid dressing
with
protective
clothing. The bench area
immediately
adjacent
to
the
entry
door
to
the
laboratory
shall
contain
a tack
mat
to
further
prevent
contamination
ingress. Over shoes must
not
come
into
contact
with
the
area
that
has been used
for
day shoes.
• Cleaning
of
the
processing areas shall be
performed
with
suitably
filtered
vacuum
equipment.
• A cleaning
programme
shall be established and evidence
of
compliance
maintained
for
audit
purposes.
•
All
samples
in
current
use
or
in
temporary
storage
within
the
area shall be
identified.
•
Non-conforming
samples shall be
identified
and physically segregated
from
acceptable
work.
• Gloves shall be
worn
when
handling
unprotected
samples.
• Unused
tooling
/
equipment
shall be stored in a
manner
to
prevent
damage and
deterioration.
•
It
shall remain
the
responsibility
of
the
users
to
ensure
that
tooling
/
equipment
remains suitable
for
its
intended
purpose.
For Health & Safety guidelines,
refer
to
Section 1 (Health & Safety)
of
your
Plasmalab system manual.
For services required,
refer
to
OIPT
Services Specifications and
the
relevant
Installation Data
document
for
your
Plasmalab system.
Process
Information
(Information
contained
in
this
document
is
confidential)
Issue
1: December 03 Page 4
of
30 Printed:
OB
January 2006 09:37