IPC-T-50F_.pdf.pdf - 第100页
74.0235 Compliant Bond 74.0275 Contact Angle (Bonding) 74.031 1 Cratering 74.0336 Cut-Of f 74.0376 Die Bonding 74.0379 Dif fusion Bond 74.0418 Edge Short 74.0432 Electron-Beam Bonding 74.0454 Eutectic Die Attach 74.0469 …
61 Rigid Printed Boards (Organic)
61.1587 Metal Core Printed Board
61.1577 Rigid Double-sided Printed Board
61.1578 Rigid Multilayer Printed Board
61.1571 Rigid Printed Board
61.1576 Rigid Single-sided Printed Board
61.1521 Sequentially-Laminated Multilayer Printed
Board
62 Flexible Printed Boards (Organic)
62.1581 Flexible Double-sided Printed Board
62.1582 Flexible Multilayer Printed Board
62.1579 Flexible Printed Board
62.0525 Flexible Printed Circuit
62.0526 Flexible Printed Wiring
62.1580 Flexible Single-sided Printed Board
63 Flex-Rigid Printed Boards (Organic)
63.1570 Flex-Rigid Double-sided Printed Board
63.0524 Flex-Rigid Printed Board
63.1584 Rigid-Flex Double-sided Printed Board
63.1258 Rigid-Flex Printed Board
64 Discrete Wiring Boards (Organic)
64.0390 Discrete-Wiring Board
64.0391 Discrete-Wiring Board Assembly
67 Hybrid/Multichip Module Interconnecting Structures
67.0818 Overlap (Film)
7 Assembly Processes for Interconnection Structures
70 General (Assembly Process Issues)
70.1731 Bar Code Marking
70.0090 Basic Wettability
70.0149 Bridging, Electrical
70.0239 Component Mounting
70.0279 Contact Resistance
70.0291 Conveyor, Edge
70.0292 Conveyor, Mesh
70.0293 Conveyor, Secondary
70.0435 Elongation
70.1452 Mixed Component-Mounting Technology
70.1757 Mixed Technology
70.1763 Processability
70.1770 Stand-Off
71 Component Handling, Storage and Preparation
71.1762 Preconditioning
71.1541 Taped Component
71.1089 Tinning
71.1146 Waffle Pack
72 Through-Hole Mounting of Components
72.0063 Automated Component Insertion
72.1351 Clinched Lead
72.0217 Clinched-Wire Interfacial Connection
72.1352 Clinched-Wire Through Connection
72.1467 Partially-Clinched Lead
72.1022 Straight-Through Lead
72.1539 Swaged Lead
72.1085 Through-Hole Mounting
73 Surface Mounting of Components
73.1733 Centering Force
73.0406 Drawbridged Component
73.0457 Excising
73.0697 Lead Projection
73.1760 Pick-Up Force
73.1759 Pick-Up Tool
73.1761 Placement Force
73.0951 Slump
73.1001 Spread
73.1012 Staking,Adhesive (v.)
73.1026 Stringing
73.1035 Surface Mounting
73.1093 Tombstoned Component
73.1775 Vacuum Head
74 Bare Chip Placement and Attachment
74.0021 Adhesion Layer
74.0039 Angled Bond
74.0048 Area Array Tape Automated Bonding
74.0055 Aspect Ratio (Film)
74.0073 Back Bonding
74.0079 Back Mounting
74.0083 Ball Bond
74.0085 Barrier Metal
74.0120 Bond
74.0123 Bond Deformation
74.0126 Bond Envelope
74.0125 Bond Enhancement Treatment
74.0133 Bond Interface
74.0134 Bond Land
74.0135 Bond Lift-off
74.0136 Bond Schedule
74.0137 Bond Separation
74.0138 Bond Site
74.0141 Bond Surface
74.0121 Bond-to-Bond Distance
74.0122 Bond-to-Die Distance
74.1342 Bondability
74.0128 Bonding Area
74.0129 Bonding Island
74.0131 Bonding Tool
74.0132 Bonding Wire
74.0127 Bonding, Die
74.0155 Bugging Height
74.0159 Bump (Die)
74.0160 Bumped Die
74.0161 Bumped Tape
74.0162 Bumped Wafer
74.0167 Burn-Off
74.0175 Capillary
74.0189 Centerwire Break
74.1348 Chemisorption
74.0204 Chessman
74.0206 Chip-and-Wire
74.0210 Chisel
74.0212 Chopped Bond
74.1734 Circumferential Thermodes
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74.0235 Compliant Bond
74.0275 Contact Angle (Bonding)
74.0311 Cratering
74.0336 Cut-Off
74.0376 Die Bonding
74.0379 Diffusion Bond
74.0418 Edge Short
74.0432 Electron-Beam Bonding
74.0454 Eutectic Die Attach
74.0469 Face Bonding
74.0491 Feature Window
74.0512 First Bond
74.0513 First Radius
74.0514 First Search
74.0520 Flag
74.0521 Flame-Off
74.0530 Flip Chip
74.0529 Flip-Chip Mounting
74.0532 Floating-Annulus Tape-Automated Bonding
74.0547 Foot Length
74.0551 Frame Pitch
74.0562 Gang Bonding
74.0598 Heel, Bonding
74.0620 Horn
74.0646 Inner-Lead Bond (ILB)
74.0680 Lap Shear Strength
74.0692 Lead Frame
74.0756 Microbond
74.0770 Mislocated Bond
74.0793 Nailhead Bond
74.0796 Neckbreak
74.0804 Off Bond
74.1198 Outer-Lead Bond (OLB)
74.0831 Partial Lift
74.1312 Rebond
74.1275 Sagging
74.1280 Scrubbing
74.1281 Search Height
74.1283 Second Bond
74.1290 Semiconductor Carrier
74.0943 Single-Point Bonding
74.0952 Smeared Bond
74.0961 Solder Bump
74.0983 Solid-State Bond
74.1003 Sprocket
74.1021 Stitch Bond
74.1543 Thermocompression Bonding
74.1072 Thermosonic Bonding
74.1095 Torsional Strength
74.1100 Transfer-Bump Tape Automated Bonding
74.1119 Ultrasonic Bonding
74.1157 Wedge Bond
74.1158 Wedge Tool
74.1168 Wire Bonding
74.1169 Wire Sag
74.1172 Wobble Bond
75 Joining Techniques
75.1681 Condensation Soldering
75.1326 Contact Angle (Soldering)
75.0289 Controlled Collapse, Component Connection
75.0288 Controlled Collapse Soldering
75.1736 Convected Energy
75.0300 Corrosive Flux
75.1382 Dip Soldering
75.1386 Drag Soldering
75.0410 Dross
75.1391 Eutectic (n.)
75.1392 Eutectic (v.)
75.1393 Excess Solder Connection
75.0498 Fillet, Adhesive
75.0499 Fillet, Solder
75.0536 Flow Soldering
75.0538 Flux
75.0540 Flux Activation Temperature
75.0541 Flux Activity
75.1745 Fluxing
75.1746 Forced Gas Convention Soldering
75.1404 Foreign Material (Soldering)
75.0564 Gas Blanket
75.0585 Hand Soldering
75.0587 Hard Wiring
75.0592 Heat Column
75.1416 Heatsink Tool
75.1748 Hot Plate Reflow Soldering
75.0631 Icicle
75.1749 Immersion Attitude
75.1751 Infra-Red Reflow (IR)
75.0647 Inorganic Flux
75.1428 Intermetallic Compound, Solder
75.1753 Laser Soldering
75.0687 Leaching, Metalization (v.)
75.0691 Lead Extension
75.0737 Manual Soldering
75.1678 Mass Soldering
75.0749 Mechanical Wrap
75.0780 Muffle
75.1183 Nonactivated Flux
75.1189 Nonwetting (Solder)
75.1194 Open Time
75.0817 Overheated Solder Connection
75.1465 Parallel-Gap Soldering
75.1466 Parallel-Gap Welding
75.0836 Paste Flux
75.0835 Paste, Soldering
75.0886 Porosity (Solder)
75.0899 Preferred Solder Connection
75.0926 Pulse Soldering
75.1500 Reflow Soldering
75.1235 Reflow Spike
75.1247 Resin Flux
75.1248 Resistance Soldering
75.1249 Resistance Welding
75.1515 Rosin Solder Connection
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75.0959 Solder Ball
75.1767 Solder Bath
75.0960 Solder Bridging
75.0963 Solder Connection
75.0964 Solder Connection Pinhole
75.0966 Solder Embrittlement
75.0967 Solder Fillet
75.1766 Solder Meniscus
75.0974 Solder Plug
75.0975 Solder Projection
75.0979 Solder Spatter
75.0981 Solder Webbing
75.0982 Solder Wicking
75.0957 Solder-Paste Flux
75.0958 Solderability
75.0968 Soldering
75.0970 Soldering Flux
75.1768 Soldering Iron
75.0971 Soldering Iron Tip
75.1529 Soldering Oil (Blanket)
75.0969 Soldering-Ability
75.1530 Solderless Wrap
75.0997 Specific Solderability
75.1533 Staking, Mechanical
75.1019 Step Soldering
75.1036 Surface Tension
75.1038 Synthetic Activated Flux
75.1039 Synthetic Resin
75.1041 TAB
75.1044 Tail Pull
75.1043 Tail, Bonding
75.1045 Tape
75.1046 Tape Automated Bonding
75.1048 Temperature Profile
75.1064 Tetrafunctional Resins
75.1070 Thermode
75.1101 Transfer Soldering
75.1121 Ultrasonic Soldering
75.1557 Vapor-Phase Soldering
75.1150 Water-Soluble Organic Flux
75.1152 Wave Soldering
75.1159 Wetting, Solder
75.1162 Wicking
75.1166 Wipe Soldering
75.1170 Wire Wrap
75.1568 Working Time
76 Cleaning and Conformal Coating Processes
76.0031 Aliphatic Solvents
76.0032 Alkaline Cleaner
76.0110 Biocide
76.0153 Bubble Effect
76.0154 Buffer Material
76.0197 Chelate Compound
76.0198 Chelating Agent
76.0224 Cold Hand Cleaning
76.0225 Cold Machine Cleaning
76.0233 Complex Ion
76.0263 Conformal Coating
76.0283 Contamination Host Material
76.0299 Corrosion (Chemical/Electrolytic)
76.0313 Crazing (Conformal Coating)
76.1371 Critical Humidity
76.0322 Critical Solution Temperature
76.0372 Dibasic Acid
76.1221 Dilution Ratio
76.0384 Diphase Cleaning
76.0386 Direct Cleaning
76.0387 Direct Current Cleaning
76.0429 Electrolytic Cleaning
76.0437 Emulsifying Agent
76.0438 Emulsifying Oil
76.0439 Emulsion
76.0440 Encapsulant
76.1744 Ethanol
76.0455 Eutrophication
76.1317 Exchange Reaction
76.0460 Exfoliation
76.0463 Extraction, Liquid-Liquid
76.0476 Fatty Acid
76.0477 Fatty Ester
76.0495 Filiform Corrosion
76.1397 Final Seal
76.1401 Flash Distillation
76.0534 Flocculant
76.0535 Flocculation
76.0542 Flux Characterization
76.0543 Flux Residue
76.1402 Flux-Spatter Test
76.1410 Galvanic Corrosion
76.0584 Halide Content
76.0603 Heterocyclic
76.0615 Homocyclic
76.0616 Homologous Series
76.0617 Homopolymer
76.0621 Hydrocarbon Tolerance
76.0622 Hydrolytic Stability
76.0623 Hydrophilic Matter
76.0624 Hydrophilic Solvent
76.0625 Hydrophobic Matter
76.0626 Hydrophobic Solvent
76.0627 Hydrotrope
76.0628 Hydrotrophe
76.0629 Hypersorption
76.0655 Intergranular Corrosion
76.0661 Ion Exchange
76.0663 Ionic Cleanliness
76.1222 Ionizable (Ionic) Contamination
76.0725 Loop Height
76.0724 Loop Wire
76.1225 Lyophilic
76.0730 Lyophobic
76.1814 Mealing
76.1758 Montreal Protocol
76.1187 Nonionic Contaminant
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