IPC-T-50F_.pdf.pdf - 第55页

Pinhole (Phototool) 24.0864 A clear defect that is completely within a black pattern or in the black background of a clear pattern. Pink Ring 55.0865 A zone around a through-hole/inner-layer interface from which a copper…

Permeability 21.1803

A general term used to express various relationships

between magnetic induction and magnetizing force.

Permittivity 21.0846

see ‘‘Dielectric Constant.’’

Personality Plate 92.0234

A translator ﬁxture plate drilled to match the product under

test.

Photographic Fog 24.1470

Any unwanted increase in density on a negative-working

photographic product or a loss of density on a positive-

working product that appears on exposed and processed

glass ﬁlm or paper that is not the result of image exposure.

Photographic Image 24.0456

An image in a photomask or in an emulsion that is on a

ﬁlm or plate.

Photographic Layer 52.0850

A light-sensitive layer of material that is capable of being

exposed and processed so that it yields a visible image.

Photographic Operation 24.0851

A procedure or technique that prepares a phototool for sub-

sequent processing.

Photographic Plate 24.0852

A ‘‘soda-lime-silica’’ sheet of glass with a photographic

layer.

Photographic-Reduction Dimension 53.0255

The dimensions on an artwork master, such as the distance

between lines or between two speciﬁed points, tha indicate

the extent to which the artwork master is to be photo-

graphically reduced. (The value of the dimension refers to

the 1-to-1 scale and must be speciﬁed.)

Photomaster 24.0853

see ‘‘Artwork Master.’’

Photometry 24.0854

The measurement of the effect of the intensity and energy

of visible light on the human eye.

Photoplotting 24.0855

A photographic process whereby an image is generated by

a controlled- light beam that directly exposes a light-

sensitive material.

Photoprint 52.0856

The process of forming a circuit pattern image by harden-

ing a photosensitive polymeric material by passing light

through a photographic ﬁlm.

Photoresist 52.1472

A material that is sensitive to portions of the light spectrum

and that, when properly exposed can mask portions of a

base metal with a high degree of integrity.

Photoresist Image 52.0857

An exposed and developed image in a coating on a base

material.

Phototool 24.0858

A photographic product that is used to produce a pattern on

a material. (see also ‘‘Artwork,’’ ‘‘Artwork Master,’’ ‘‘Pro-

duction Master,’’ ‘‘Working Master.’’)

Phototooling 24.0859

The entire group of photographic products that are used to

produce an pattern on a base material.

Phototooling Aid 24.0860

A photographic product that is used to assist in the inspec-

tion of, but not the transfer of, imaged patterns.

Pick 44.0861

Filling yarn that runs crosswise to the entire width of a

fabric.

Pick-Up Force 73.1760

The force required to pick up a surface mounting compo-

nent from its packaging medium for placement on a sub-

strate.

Pick-Up Tool 73.1759

A tool used to pick up surface mount components from a

packaging medium for placement on a substrate and which

may be hand activated or a part of a pick-and-place

machine.

Pilot Hole 22.0862

see ‘‘Tooling Hole.’’

Pinhole (Material) 92.0863

An imperfection in the form of a small hole that penetrates

entirely through a layer of material. (See also ‘‘Pit’’ and

‘‘Solder Connection Pinhole.’’)

IPC-I-001024

Figure P–1 Perforated (pierced) solder terminal

IPC-T-50F June 1996

Pinhole (Phototool) 24.0864

A clear defect that is completely within a black pattern or

in the black background of a clear pattern.

Pink Ring 55.0865

A zone around a through-hole/inner-layer interface from

which a copper oxide coating has been chemically

removed.

Pit 92.0866

An imperfection in the form of a small hole that does not

penetrate entirely through a layer of foil. (See also ‘‘Pin-

hole, Material.’’)

Pitch 22.1473

The nominal center-to-center distance of adjacent conduc-

tors. (When the conductors are of equal size and their spac-

ing is uniform, the pitch is usually measured from the ref-

erence edge of the adjacent conductors.)

Pixel 25.0867

The smallest deﬁnable picture element area capable of

being displayed.

Placement Force 73.1761

The force required to deposit a surface mount component.

Plain Weave 44.0868

A fabric conﬁguration whereby each warp end goes over

one pick and under the next, and whereby each pick goes

over one warp end and under the next.

Planar-Mount Device 33.0869

see ‘‘Surface-Mount Component (SMC).’’

Plastic 40.0870

Any of a group of synthetic or natural organic materials

that may be shaped when softened and then hardened.

Plastic Deformation 40.0871

Deformation that does, or will, remain permanent after

removal of the load that caused it.

Plastic Device 30.0872

A semiconductor component wherein the package or

encapsulant is plastic.

Plate Finish, Laminating 55.1474

The surface ﬁnish, without modiﬁcation by subsequent pro-

cessing, of the metal on metal-clad base material that

results from direct contact with laminating-press plates.

Plated-Through Hole (PTH) 22.1475

A hole with plating on its walls that makes an electrical

connection between conductive patterns on internal layers,

external layers, or both, of a printed board.

Plated-Through Hole Structure Test 92.1476

The visual examination of the metallic conductors and

plated-through holes of a printed board after the dielectric

material has been dissolved away.

Plating (n.) 53.0873

The chemical or electrochemical deposited metal on a sur-

face.

Plating (v.) 53.0874

Chemical or electrochemical deposition of metal on all or

part of the conductive pattern, base material and/or through

holes.

Plating Bar 53.0876

The conductive path that temporarily interconnects areas of

a conductive pattern that are to be electroplated. (See also

‘‘Bus Bar.’’)

Plating, Burned 53.0875

A rough, dull electrodeposit that was caused by excessive

plating current density.

Plating Thief 53.1477

A racking device, or nonfunctional pattern on a panel, that

is used to help achieve a more uniform current density on

plated parts during an electroplating process.

Plating Up 53.0877

The electrochemical deposition of a conductive material on

a base material that takes place after the base material has

been made conductive.

Plied Yarn 44.0878

Yarn with two or more twisted yarns.

Plotting 24.0879

The mechanical converting of X-Y position information

into a visual pattern, such as artwork.

Plug Connector 37.0880

The unmounted half of a two-piece connector pair that

mates with a receptacle connector.

Point Angle 51.0881

The included angle between the two primary cutting edges

of a drill.

Poisson Distribution 91.1478

A discrete probability distribution for attributes data that is

particularly applicable when there are many opportunities

for the occurence of an event but a low probability on each

trial.

Polar Matter 76.0883

A substance that can dissolve in water and hydrophillic

solvents.

June 1996 IPC-T-50F

Polar Solvent 76.1815

A liquid that is ionized to the extent that it is electrically

conductive, that can dissolve noppolar compounds (such as

hydrocarbons and resins), but cannot dissolve polar com-

pounds (such as inorganic salts).

Polarizing Slot 22.0882

A slot in the edge of a printed board that is used to assure

the proper insertion and location of the board in a mating

connector. (See also ‘‘Keying Slot.’’)

Polymer 40.1479

A compound of high molecular weight that is derived from

either the joining together of many small similar or dis-

similar molecules or by the condensation of many small

molecules by the elimination of water, alcohol, or some

other solvent.

Polymer Reversion 76.1480

The irreversible softening or liquifaction of a polymer as

the result of hydrolysis due to the bombardment of the

polymer with vapor molecules that contain an active

hydroxyl group.

Polymerize 40.0884

To form a polymer or polymeric compound.

Polymerized Rosin 76.0885

Rosin that has reacted with itself during the course of a

soldering operation.

Porosity (Solder) 75.0886

A solder coating with an uneven surface and a spongy

appearance that may contain a concentration of small pin-

holes and pits.

Positional Tolerance 22.0887

The amount that a feature is permitted to vary from its

true-position location.

Positive (n.) 24.0888

An artwork, artwork master, or production master in which

the pattern being fabricated is opaque to light and the other

areas are transparent.

Positive-Acting Resist 52.1481

A resist that is decomposed (softened) by light and which,

after exposure and development, is removed from those

areas of surface that were under the transparent areas of a

production master.

Post 37.0889

see ‘‘Terminal.’’

Post Curing 56.0890

Heat aging in order to stabilize material through stress

relieving.

Postprocessing 25.0891

Manipulating data after it has been generated or run

through a batch process.

Postprocessor 25.1482

A software procedure or program that interprets data and

formats it into data that is readable by a numerically-

controlled machine or by other computer programs.

Potting Compound 47.0892

A material, usually organic, that is used for the encapsula-

tion of components and wires.

Power of Source 24.0896

see ‘‘Radiant Intensity’’

Power Plane 22.0897

see ‘‘Voltage Plane.’’

Power Dissipation 21.0893

The energy used by an electronic device in the perfor-

mance of its function.

Power Factor 21.0894

The cosine of the angle of phase difference between current

and the voltage applied.

Power of Experiment 91.0895

The probability of rejecting the results of the null hypoth-

esis when it is false and of accepting the alternative

hypothesis when it is true.

Power Plane Inductance 21.1804

The ractive component inductance, in response to AC

noise, seen on a DC backplane system.

Preconditioning 71.1762

Preparation of a component or assembly for processing or

testing.

Preferred Solder Connection 75.0899

A solder connection that is smooth, bright, and feathered-

out to a thin edge in order to indicate proper solder ﬂow

and wetting action. Also no bare metal is exposed within

the solder connection and there are no sharp protrusions of

solder or the evidence of contamination, e.g., embedded

foreign material.

Pre-finish (n.) 55.0898

A coupling agent that is applied on a ﬁber in order to

improve compatibility with resins.

Preflow 55.0900

see ‘‘Stabilization Period.’’

IPC-T-50F June 1996