IPC-T-50F_.pdf.pdf - 第40页

Inductance 21.1802 The property of a conductor that allows it to store energy in a magnetic ﬁeld induced by a current ﬂowing through it. The unit to measure is henry . Infrared Reflow (IR) 75.1751 Remelting of solder usi…

Hydrophilic Matter 76.0623

see ‘‘Polar Matter.’’

Hydrophilic Solvent 76.0624

see ‘‘Polar Solvent.’’

Hydrophobic Matter 76.0625

see ‘‘Nonpolar Matter.’’

Hydrophobic Solvent 76.0626

see ‘‘Nonpolar Solvent.’’

Hydrotrope 76.0627

A chemical that can increase the aqueous solubility of

slightly-soluble organic chemicals.

Hydrotrophe 76.0628

see ‘‘Hydrotrope.’’

Hypersorption 76.0629

The process by which activated carbon selectively absorbs

less-volatile components from a gaseous mixture while the

more-volatile components are unaffected.

Hypotheses Test 91.0630

An objective method to determine and quantify, within

known levels of risk, whether or not a hypothesis is either

accepted or rejected.

Icicle 75.0631

see ‘‘Solder Projection.’’

Identical Processing 91.0632

Fabrication that is conducted under conditions that have

demonstrated the capability to produce measurable

attributes within a narrow band of variability.

Illuminance 24.0633

Luminous ﬂux striking a surface.

Illumination 24.0634

see ‘‘Illuminance.’’

Immersion Attitude 75.1749

The positioning of an object when immersed in a solder

bath.

Immersion Conditions 95.1750

Test conditions resulting when a surface mounting device

package leads are immersed into a solder bath to check

resistance to soldering temperatures.

Immersion Plating 53.0635

The chemical deposition of a thin metallic coating over

certain basis metals that is achieved by a partial displace-

ment of the basis metal.

Impedance 21.1801

The resistance to the ﬂow of current, represented by an

electrical network of combined resistance, capacitance and

inductance reaction, in a conductor as seen by an AC

source of varying time voltage. The unit of measure is

ohms.

In-Circuit Testing 92.0636

The application of test signals directly to a device’s input

terminals and sensing the results directly from the device’s

output terminals.

Inclusions 90.0637

Foreign particles, metallic or nonmetallic, that may be

entrapped in an insulating material, conductive layer, plat-

ing, base material, or solder connection.

Indentation 45.0638

see ‘‘Dent.’’

Independent of Size 22.0639

The concept that requires the tolerance of form or position

to vary independent of, and without regard to, feature size.

Index Edge 22.0640

see ‘‘Locating Edge.’’

Index Edge Marker 22.0641

see ‘‘Locating Edge Marker.’’

Indexing Hole 22.0642

see ‘‘Tooling Hole.’’

Indexing Notch 22.0643

see ‘‘Locating Notch.’’

Indexing Slot 22.0644

see ‘‘Locating Slot.’’

Individual Test Pattern (ITP) 24.1791

A single test pattern designed and intended to serve a spe-

ciﬁc evaluation technique for determining a particular

aspect(s) of a manufacturer or manufacturing process capa-

bility.

Individual Test Specimen (ITS) 92.1790

A single test specimen that contains an individual test pat-

tern (ITP) and is used to determine a particular aspect(s) of

a manufacturer or manufacturing process capability.

June 1996 IPC-T-50F

Inductance 21.1802

The property of a conductor that allows it to store energy

in a magnetic ﬁeld induced by a current ﬂowing through it.

The unit to measure is henry.

Infrared Reflow (IR) 75.1751

Remelting of solder using infrared heating as the primary

source of energy.

Initiating 53.0645

see ‘‘Activating.’’

Inner-Lead Bond (ILB) 74.0646

The connection between a conductor on a bonding tape and

a bare die. (See also ‘‘Outer-Lead Bond.’’)

Innerlayer Connection 22.1427

A conductor that connects conductive patterns on internal

layers of a multilayer printed board, e.g. a plated-through

hole. (See also ‘‘Interfacial Connection.’’)

Inorganic Flux 75.0647

An aqueous ﬂux solution of inorganic acids and halides.

(See also ‘‘Acid Flux.’’)

Input Vector 92.0648

A set of logic values to be applied to the complete set of

input test points at any one point in time.

Insert (Connector) 37.1420

The element that holds connector contacts in their proper

arrangement and electrically insulates the contacts from

one another and from the connector shell.

Inspection Facility 92.1421

The combination of equipment, personnel, and procedure

resources that perform inspection measurements and evalu-

ations for the purpose of ascertaining the conformance of a

product to applicable speciﬁcations.

Inspection Lot 92.1422

A collection of units of product that are identiﬁed and

treated as a unique entity from which a sample is drawn

and inspected in order to determine conformance with

acceptability criteria.

Inspection Overlay 91.0649

A positive or negative transparency that is made from the

production master and that is used as an inspection aid.

Inspection Personnel 92.0650

Those individuals that inspect products for the purpose of

ascertaining the conformance of a product to applicable

speciﬁcations.

Inspection Rate 92.0651

The number of features per unit of time that can be evalu-

ated at speciﬁed false-alarm and escape-rate settings.

Instrument Bus 21.1423

Four common lines or channels to which any analog test

instrument can be connected via a multiplexer and any unit

under test circuit mode that can be connected via a scanner.

Insufficient Solder Connection 97.1424

A solder connection that is characterized by the incomplete

coverage of one or more of the surfaces of the connected

metals and/or by the presence of incomplete solder ﬁllets.

Insulation Resistance 21.1425

The electrical resistance of an insulating material that is

determined under speciﬁc conditions between any pair of

contacts, conductors, or grounding devices in various com-

binations.

Insulator 40.1813

A material with a high resistance to the ﬂow of electrical

current. (See also ‘‘Dielectric.’’)

Integrated Circuit 30.1426

A combination of inseparable associated circuit elements

that are formed in place and interconnected on or within a

single base material to perform a microcircuit function.

Inter-Test Time (ITT) 92.0652

The duration between two successive driver strobes.

Interface Resistance 37.0653

see ‘‘Contact Resistance.’’

Interfacial Connection 22.0654

A conductor that connects conductive patterns on both

sides of a printed board, e.g. a plated-through hole. (See

also ‘‘Interlayer Connection.’’)

Intergranular Corrosion 76.0655

Corrosion that occurs preferentially at grain boundaries.

Interlaminar Metallization 53.0656

Metal through-migration that is the result of metal deposi-

tion or migration along delaminated areas of the interior of

a laminate.

Interlayer Connection 22.1614

An electrical connection between two or more layers of

conductive patterns on or in a printed board.

IPC-T-50F June 1996

Intermetallic Compound, Solder 75.1428

An intermediate layer in a wetted solder connection

between the wetted surface and the solder, consisting of the

solution of at least one constituent of the wetted surface

and at least one constituent of the solder.

Intermittent Fault 97.0657

A fault whose effect on a circuit appears and disappears at

irregular intervals.

Internal Layer 22.0658

A conductive pattern that is contained entirely within a

multilayer printed board.

Interstitial Via 22.0659

see ‘‘Blind Via’’ and ‘‘Buried Via.’’

Intumescence 56.0660

The foaming or swelling of a material when it is exposed

to high surface temperatures or ﬂames.

Ion Exchange 76.0661

A reversible chemical reaction between a solid and a ﬂuid

by means of which ions are interchanged from one sub-

stance to another.

Ionic Cleanliness 76.0663

The degree of surface cleanliness with respect to the num-

ber of ions or weight of ionic matter per unit square of sur-

face.

Ionizable (Ionic) Contamination 76.1222

A polar (ionic) compound, usually a processing residue,

that dissolves in water as free ions. (This includes ﬂux

activators, ﬁnger prints, etching or plating salts, etc., that

decrease the resistivity of water when they are dissolved in

it.)

J-Leads 36.1752

The preferred surface mount lead form used on PLCC’s, so

named because the lead departs the package body near its

Z axis centerline, is formed down then rolled under the

package. Leads so formed are shaped like the letter ‘‘J.’’

Job Set 25.0664

A group of one or more data-information modules.

Jumper Wire 37.0665

A discrete electrical connection that is part of the original

design and is used to bridge portions of the basic conduc-

tive pattern formed on a printed board. (See also ‘‘Hay-

wire.’’)

Junction Temperature 35.0666

The temperature of the region of a transition between the

p-type and n-type semiconductor material in a transistor or

diode element.

Just-in-Time (JIT) 17.1429

Production control techniques that minimize inventory by

delivering parts and material to a manufacturing facility

just before they are incorporated into a product.

Kerf 77.0667

A laser-beam or abrasive-jet cut (slit) in a ﬁlm component

as a part of the trimming operation.

Key 37.0668

A device that assures that the coupling of two components

can occur in only one position.

Keying (n.) 37.1430

A device that is used in addition to, or in lieu of, a polar-

ization feature to assure that the coupling of identical mat-

ing components can occur in only one position.

Keying (v.) 37.1431

The use of a device in addition to, or in lieu of, a polariza-

tion feature to assure that the coupling of identical mating

components can occur in only one direction.

Keying Slot 22.1432

A slot in a printed board that permits the printed board

assembly to be plugged into its mating connector and pre-

vents the board from being plugged into any other connec-

tor. (See also ‘‘Polarizing Slot.’’)

Keyway 37.0669

A general term that encompasses both keying slots and

polarizing slots.

Known Good Board (KGB) 92.0671

A correctly fabricated printed board that serves as a stan-

dard unit by which others can be compared.

Known Good Assembly (KGA) 92.0670

A correctly operating printed board assembly that serves as

a standard unit by which others can be compared.

L Cut 77.1433

A trim notch in a ﬁlm component that is created by a cut

that starts perpendicular to the component’s major axis and

then turns ninety degrees to complete the trimming opera-

tion.

June 1996 IPC-T-50F