IPC-T-50F_.pdf.pdf - 第18页

Circuit 21.0213 A number of electrical elements and devices that have been interconnected to perform a desired electrical function. Circuit Card 60.0214 see ‘ ‘Printed Board.’ ’ Circuitry Layer 22.0215 A layer of a print…

Chamfer (Drill) 51.0193

The angle at the end of a drill shank.

Characteristic Curve 24.1347

A plot of photographic product optical-density data versus

the logarithm of the exposure used to characterize the

response of the material to exposure and development. (See

Figure C-2.)

Characteristic Impedance 21.0194

The resistance of a parallel conductor structure to the ﬂow

of alternating current (AC), usually applied to high speed

circuits, and normally consisting of a constant value over a

wide range of frequencies.

Check List 94.1219

A compilation of the speciﬁed criteria that may be evalu-

ated during an audit or inspection.

Check Plot 94.0195

An interim drawing used for graphical data veriﬁcation.

Check Sheet 94.0196

A form that is used for data collection.

Chelate Compound 76.0197

A compound in which metal is contained as an integral part

of a ring structure.

Chelating Agent 76.0198

A compound capable of forming a chelate compound with

a metal ion.

Chemical Conversion Coating 57.0199

A protective coating produced by the chemical reaction of

a metal with a chemical solution.

Chemical Vapor Deposition 45.0202

The deposition of a ﬁlm onto the surface of a substrate by

the chemical reduction of a vapor on contact with the base

material.

Chemical Wire Stripping 37.0203

The process of removing insulation from wire using chemi-

cal compounds.

Chemically-Deposited Printed Circuit 50.0201

see ‘‘Additive Process.’’

Chemically-Deposited Printed Wiring 50.0200

see ‘‘Additive Process.’’

Chemisorption 74.1348

The formation of bonds between the surface molecules of

a metal, or other material of high surface energy, and

another gas or liquid substance in contact with it.

Chessman 74.0204

A disk, knob or lever used to manually control the position

of a bonding tool with respect to land.

Chip 35.0205

see ‘‘Die.’’

Chip Carrier 33.0208

A low-proﬁle, usually square, surface-mount component

semiconductor package whose die cavity or die mounting

area is as large fraction of the package size and whose

external connections are usually on all four sides of the

package. (It may be leaded or leadless.)

Chip-and-Wire 74.0206

An assembly method that uses discrete wires to intercon-

nect back-bonding die to lands, lead frames, etc.

Chip-on-Board (COB) 86.0207

A printed board assembly technology that places unpack-

aged semiconductor dice and interconnects them by wire

bonding or similar attachment techniques. Silicon area den-

sity is usually less than of the printed board.

Chipped Point 51.0209

A condition whereby the amount of chips on the leading

edge of a drill point exceeds an allowable value.

Chisel 74.0210

A tool used for wedge and ultrasonic bonding.

Chisel-Edge Angle 51.0211

The angle between the leading cutting edge and the inter-

section of the primary and secondary relief facets of a drill

point.

Chopped Bond 74.0212

A bond with excessive deformation such that the strength

of the bond is greatly reduced.

IPC-I-002331

Figure C–2 Typical Characteristic Curve

log E

Density

00 10 20 30 40

June 1996 IPC-T-50F

Circuit 21.0213

A number of electrical elements and devices that have been

interconnected to perform a desired electrical function.

Circuit Card 60.0214

see ‘‘Printed Board.’’

Circuitry Layer 22.0215

A layer of a printed board containing conductors, including

ground and voltage planes.

Circumferential Separation 96.1349

A crack or void in the plating extending around the entire

circumference of as plated through hole, a solder ﬁllet

around lead wire or eyelet, or the interface between a sol-

der ﬁllet and a land.

Circumferential Thermodes 74.1734

A contact tool used for inner-lead and outer-lead gang

bonding.

Clad (adj.) 55.1350

A condition of the base material to which a relatively-thin

layer or sheet of metal foil has been bonded to one or both

of its sides, e.g. ‘‘a metal-clad base material.’’

Clearance Hole 22.1811

A hole in a conductive pattern that is larger than, and

coaxial with a hole in the base material of a printed board.

(See Figure C-3.)

Clinched Lead 72.1351

A component lead that is inserted through a hole in a

printed board and is then formed in order to retain the

component in place and in order to make metal-to-metal

contact with a land prior to soldering. (See also ‘‘Partially-

Clinched Lead.’’)

Clinched-Wire Interfacial Connection 72.0217

see ‘‘Clinched-Wire Through Connection.’’

Clinched-Wire Through Connection 72.1352

A connection made by a bare wire that has been passed

through a hole in a printed board and subsequently formed

(clinched) and soldered to the conductive pattern on each

side of the board. (See Figure C-4.)

Closed-Entry Contact 37.0218

A type of female connector contact that prevents the entry

of an oversized mating part. (See also ‘‘Open-Entry Con-

tact.’’)

Co-Firing 56.0219

The simultaneous processing of thick-ﬁlm circuit elements

during one ﬁring cycle.

Coaxial Cable 37.0220

A cable in the form of a central wire surrounded by a con-

ductor tubing or sheathing that serves as a shield and

return.

Coefficient of Thermal Expansion (CTE) 40.0221

The linear dimensional change of a material per unit

change in temperature. (See also ‘‘Thermal Expansion Mis-

match.’’)

Cohesion Failure 96.0222

The rupture of an adhesive bond such that the separation

appears to be within the adhesive.

Coined Lead 22.0223

The end of a round lead that has been formed to have par-

allel surfaces that approximate the shape of a ribbon lead.

Cold Hand Cleaning 76.0224

Cleaning with a soft brush and rinsing in a small open tank

of chlorinated solvent or isopropanol. (Propan-2-01.)

Cold Machine Cleaning 76.0225

Cleaning with a chlorinated solvent and an inline brush or

wave cleaner.

IPC-I-001035

Figure C–3 Clearance hole

Conductive Pattern

Clearance Hole

IPC-I-001027

Figure C–4 Clinched-wire through connection

Solder

Lead

Conductive

Pattern

▼

IPC-T-50F June 1996

Cold Solder Connection 97.0226

A solder connection that exhibits poor wetting, and that is

characterized by a greyish porous appearance. (This is due

to excessive impurities in the solder, inadequate cleaning

prior to soldering, and/or the insufficient application of heat

during the soldering process.) (See alse ‘‘Rosin Solder

Connection.’’)

Color Temperature 24.1355

A measure of the energy distribution over the visible spec-

tral range of a light source with a continuous spectrum,

expressed in degrees Kelvin (K). (See also ‘‘Effective

Color Temperature.’’)

Comb Pattern 22.0227

A set of interdigitated comblike arrays of uniformly-spaced

conductors.

Comment Record 25.0228

A record that provides, or refers to, additional descriptive

material that further clariﬁes the control of a data set.

Common Cause 91.0229

A source of variation that affects all the individual values

of the output of a process.

Compensated Artwork 24.0230

Production master or artwork data that has been enlarged

or reduced in order to meet the needs of subsequent pro-

cessing requirements.

Compensation Circuit 21.0231

An electrical circuit that alters the functioning of another

circuit to which it is applied to achieve desired perfor-

mance.

Compiler 11.0232

A software module that analyzes and converts programs

from a high-level language to binary machine codes.

Complex Ion 76.0233

An ion composed of two or more ions or radicals that are

capable of an independent existence.

Compliant Bond 74.0235

A bond that uses an elastically- and/or plastically-

deformable member to impart the required energy to the

lead.

Component 30.0236

An individual part or combination of parts that, when

together, perform a design function(s). (See also ‘‘Discrete

Component.’’)

Component Density 22.0237

The quantity of components on a unit area of printed board.

Component Hole 20.0238

A hole that is used for the attachment and/or electrical con-

nection of component terminations, including pins and

wires, to a printed board.

Component Lead 30.1356

The solid or stranded wire or formed conductor that

extends from a component to serve as a mechanical or

electrical connector, or both. (See also ‘‘Component Pin.’’)

Component Mounting 70.0239

The act of attaching components to a printed board, the

manner in which they are attached, or both.

Component Mounting Orientation 22.1357

The direction in which the components on a printed board

or other assembly are lined up electrically with respect to

the polarity of polarized components, with respect to one

another, and/or with respect to the board outline.

Component Pin 30.0240

A component lead that is not readily formable without

being damaged. (See also ‘‘Component Lead.’’)

Component Side 22.0241

see Primary Side .

Component Thermal Masses 30.1735

The ability of a part to absorb or retain heat energy, usu-

ally relative to its overall size and weight.

Composite (Phototool) 24.0242

A photograph that consists of a combination two separate

(aligned) images.

Composite Record 25.1358

A collection of records that make up an electrical pattern

that is used repeatedly in a design. (The deﬁnition and

relationship of such records are covered and referred to as

‘‘subroutine deﬁnition’’ and ‘‘subroutine deﬁnition call.’’)

Composite Test Pattern (CTP) 24.1792

A grouping of individual test patterns into speciﬁc arrange-

ments, to reﬂect control and precision capability of a manu-

facturer or manufacturing process.

Compression Seal 36.0243

A tight joint made between an component package and its

leads that is formed as heated metal cools and shrinks

around a glass insulator.

Computer Numerical Control (CNC) 11.0244

A system that utilizes a computer and software as the pri-

mary numerical control technique. (See also ‘‘Numerical

Control.’’)

June 1996 IPC-T-50F