IPC-T-50F_.pdf.pdf - 第78页
Wiring Elementary 21.1171 see ‘ ‘Elementary Diagram.’ ’ Wobble Bond 74.1172 A thermocompression multicontact bond made by rocking a bonding tool on a beam lead. Working Master 24.1173 A 1-to-1 scale pattern that is used …
Waste (Fabric) 44.1564
A lump or collection of yarn or filament that is woven into
a fabric where accumulated contamination off the loom has
found its way into the fabric.
Water-Soluble Flux 75.1150
An organic chemical soldering flux that is soluble in water.
Wave Soldering 75.1152
A process wherein an assembled printed board is brought
in contact with the surface of a continuously flowing and
circulating mass of solder.
Wave Length Spectrum 21.1776
The distance between three consecutive nodes of a wave,
equal to 360 electrical degrees. It is equal to the velocity of
propagation divided by the frequency when both are in the
same units.
Waveguide 21.1151
A tube used to transmit microwave-frequency electromag-
netic wave energy.
Waviness 44.1153
Alternating thick and thin locations in cloth that is woven
under varying tension that prevents the even placement of
picks.
Weave Exposure 55.1154
A base material surface condition in which unbroken fibers
of woven glass cloth are not completely covered by resin.
Weave Texture 55.1565
A surface condition of base material in which a weave pat-
tern of glass cloth is apparent although the unbroken fibers
of the woven cloth are completely covered with resin.
Web Taper 51.1155
The constant increase in web thickness from the drill point
to the opposite end of the flute where the flute carry-out
starts.
Web Thickness 51.1156
The distance between the bottom of adjacent flutes.
Wedge Bond 74.1157
A wire bond made with a wedge tool. (See also ‘‘Ball
Bond.’’)
Wedge Tool 74.1158
A bonding tool in the general form of a wedge, with or
without a guide hole to position wire under its bonding
face. (See also ‘‘Capillary.’’)
Wetting Balance 92.1160
An instrument that is used to measure wetting performance
and solderability.
Wetting, Solder 75.1159
The formation of a relatively uniform, smooth, unbroken,
and adherent film of solder to a basis metal.
Whisker 92.1161
A slender acicular (needle-shaped) metallic growth that is
between a conductor and a land.
White Spot 92.1566
A white or translucent subsurface discoloration at unfrac-
tured glass knuckles of woven polytetrafluoroethylene
(PTFE) material after it has been processed. (See also
‘‘Crazing’’ and ‘‘Measling.’’)
Wicking 75.1162
The capillary absorption of a liquid along the fibers of a
base material. (See also ‘‘Solder Wicking.’’)
Window 94.1163
A range of values within which evaluation parameters are
defined.
Window (Carrier Tape) 36.1164
An opening in the dielectric of a carrier tape that exposes
the conductors for bonding purposes.
Window (Process) 94.1165
A range of values within which evaluation parameters are
defined.
Wipe Soldering 75.1166
The forming of a joint by applying semifluid solder and
shaping the joint by rubbing with a greased cloth pad.
Wiping Action 37.1167
The sliding action that occurs when connector contacts are
mated.
Wire Bonding 74.1168
Microbonding between a die and base material, lead frame,
etc.
Wire Sag 74.1169
The failure of a wire to form the desired loop between its
bonds.
Wire Stripping 37.1567
The removal of a predetermined portion of insulation from
an insulated wire without affecting the mechanical or elec-
trical characteristics of the conductors or the remaining
insulation.
Wire Wrap 75.1170
see ‘‘Solderless Wrap.’’
June 1996 IPC-T-50F
73
Wiring Elementary 21.1171
see ‘‘Elementary Diagram.’’
Wobble Bond 74.1172
A thermocompression multicontact bond made by rocking
a bonding tool on a beam lead.
Working Master 24.1173
A 1-to-1 scale pattern that is used to reproduce the produc-
tion master.
Working Time 75.1568
The maximum period of time that an adhesive can be
exposed to ambient conditions with its chemical and physi-
cal properties remaining within satisfactory limits for
proper dispensing and bonding. (See also ‘‘Open Time.’’)
Wrinkles 76.1569
Ridges, creases or furrows in a coating or resist that are
formed after the material has adhered to a metal, such as
solder, that subsequently melts and resolidifies.
Wrought Foil 45.1174
A metal foil that is formed by the rolling of cast metal.
X
X Axis 26.1175
The horizontal or left-to-right direction in a two-
dimensional system of coordinates. (This axis is perpen-
dicular to the Y axis.)
Y
Y Axis 26.1303
The vertical or bottom-to-top direction in a two-
dimensional system of coordinates.
Z
Z Axis 26.1809
The Axis perpendicular to the plane formed by the X and
Y datum reference. This axis usually represents the thick-
ness of the boards.
IPC-T-50F June 1996
74
Appendix A
—A—
AAGR Annual Average Growth Rate
ABS Acrylonitrile-Butadiene-Styrene (Plastic)
AC Alternating Current
AEC Architecture, Engineering and Construction
AGV Automated Guided Vehicle
AI Artifical Intelligence
AIS Adhesive Interconnect System
ANOVA Analysis of Variance
ANSI American National Standards Institute
AOI Automated Optical Inspection
AOQ Average Outgoing Quality
APT Automatically Programmed Tools
AQL Acceptable Quality Level
ARINC Aeronautical Radio Incorporated
ASCII American Standard Code for Information
Interchange
ASIC Application Specific Integrated Circuit
ASTM American Society for Testing Materials
ATE Automatic Test Equipment
ATG Automatic Test Generation
ATR Air Transport Rack
AVT Accelerated Vesication Test
AWG American Wire Gauge
—B—
BDMA Benzyldimethylamine
BITE Built-In Test Equipment
BOD Biochemical Oxygen Demand
BOM Bill of Material
BT Bismaleimide Triazine
BTAB Bumped Tape-Automated Bonding
—C—
C3 Command, Control and Communicate
C4 Controlled Collapse Component Connection
CAD Computer-Aided Design
CAE Computer-Aided Engineering
CAFM Computer-Aided Facilities Management
CAGE Commercial and Government Entity
CALS Computer-Aided Acquisition and Logistic
Support (DOD)
CAM Computer-Aided Manufacturing
CAPP Computer-Aided Process Planning
CAR Computer-Aided Repair
CASE Computer-Aided Software Engineering
CAT Computer-Aided Testing
CCAPS Circuit Card Assembly and Processing System
CDA Copper Development Association
CFM Continuous Flow Manufacturing
CFM Cubic Feet per Minute
CIM Computer-Integrated Manufacturing
CISC Complex Instruction Set Computing
CITIS Contractor Integrated Technical Information
Services
CMOS Complimentary Metal-Oxide Semiconductor
CNC Computer Numerical Control
COB Chip-on-Board
COD Consumed Oxygen Demand
Cp Capability Performance
CPL Capability Performance, Lower
CPU Capability Performance, Upper
CPU Central Processing Unit (Computer)
CRT Cathode-Ray Tube
CSG Constructive Solids Geometry
CTE Coefficient of Thermal Expansion
—D—
DAB Designated Audit Body
DATC Design Automation Technical Committee (IEEE)
DBMS Database Management System
DC Direct Current
DCAS Defense Contract Administration Service
DCMA Defense Contract Management Agency
DCMC Defense Contract Management Command
DESC Defense Electronics Supply Center
June 1996 IPC-T-50F
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