IPC-T-50F_.pdf.pdf - 第62页

IPC-I-002768 Figure R–2 Printed board viewing orientations Notes: 1. A precise definition of image tone and orientation necessitates that the orientation of the pattern and the legend be separately identified. For exampl…

Resin Smear 51.1506

Base material resin that covers the exposed edge of con-

ductive material in the wall of a drilled hole. (This resin

transfer is usually caused by the drilling operation).

Resin-Rich Area 41.1505

The location in a printed board of a signiﬁcant thickness of

unreinforced surface-layer resin that is of the same compo-

sition as the resin within the base material.

Resin-Starved Area 41.1507

The location in a printed board that does not have a suffi-

cient amount resin to completely wet out the reinforcing

material. (Evidence of this condition is often in the form of

low-gloss dry spots or exposed ﬁbers.)

Resist 52.1508

A coating material that is used to mask or protect select

areas of a pattern during manufacturing or testing from the

action of an etchant, plating, solder, etc. (See also

‘‘Negative-Acting Resist’’ and ‘‘Positive- Acting Resist.’’)

Resistance 21.1805

The restriction to the ﬂow of electrons, determined by

Ohms law; the quotient of DC voltage, applied to the

extremes of a conductor or insulator, and the current ﬂow-

ing through it.

Resistance Soldering 75.1248

Soldering by a combination of pressure and heat generated

by passing a high current through two mechanically-joined

conductors.

Resistance Welding 75.1249

Welding by a combination of pressure and heat generated

by passing a high current through two mechanically-joined

conductors.

Resistor Drift 92.1250

The change in resistance of a resistor caused by aging,

usually expressed a percent change per 1,000 hours.

Resolving Power 24.1509

The ability of a photographic system to maintain the sepa-

rate identity of parallel lines and spaces in a developed

image when their relative displacement is small.

Response Variable 91.1251

The dependent variable being studied.

Reversal Development 24.1252

The reversing of the tone of an image on a photographic

emulsion from that which can be accomplished with con-

ventional developing.

Reverse Current Cleaning 76.1253

see ‘‘Anodic Cleaning’’

Reverse Image 52.1254

The pattern of resist on a printed board that is used to allow

for the exposure of conductive areas for subsequent plat-

ing.

Reversion 96.1510

A chemical reaction in which a polymerized material par-

tially or completely degenerates to a lower polymeric state

or to the original monomer. (This is usually accompanied

by signiﬁcant changes in physical and mechanical proper-

ties.)

Rework 77.1511

The act of reprocessing noncomplying articles, through the

use of original or alternate equivalent processing, in a man-

ner that assures compliance of the article with applicable

drawings or speciﬁcations.

Ribbon Cable 37.1255

A ﬂat cable with round conductors.

Ribbon Interconnect (n.) 37.1256

A ﬂat narrow ribbon of metal used to make interconnec-

tions to lands, lead frames, etc.

Right Reading 24.1257

A phototool pattern-orientation that is the same as the art-

work master when it is viewed from the primary side of a

product. (See Figures M-2 and R-2.)

Right Reading Down 24.1512

An orientation of a phototool in which the pattern is right

and the emulsion is on the surface that is away from the

viewing surface. (See Figures M-2 and R-2.)

Right Reading Up 24.1513

An orientation of a phototool in which the pattern is right

reading and the emulsion is on the surface that is toward

the viewing surface. (See Figures M-2 and R-2.)

IPC-I-001047

Figure R–1 Resin recession

RESIN 

RECESSION

RESIN 

RECESSION

June 1996 IPC-T-50F

IPC-I-002768

Figure R–2 Printed board viewing orientations

Notes:

1. A precise definition of image tone and orientation necessitates that the orientation of the pattern and the legend be separately

identified. For example: Layer 1—Pos RR DN (Legend Corr. Read) or Layer 2—Pos RR UP (Legend Rev. Read) (There is no such

thing as wrong reading.)

2. By definition, all layer patterns are viewed from the same direction. (This view defines RR for the pattern appearance of all layers; this

is not the same as viewing the final board copper head on.)

3. Legend is usually correct reading when viewing the copper; therefore, on occasion alphanumerics must be reversed reading when

the pattern is right reading by definition.

4. Production master emulsion must be presented against the board copper in the stack up. Therefore, production master emulsion

orientation is opposite to individual copper layer orientation, i.e., if copper is RR UP by definition, corresponding production master

must be RR DN.

5. When specifying artwork tone and orientation, remember the board layup and the purpose of the artwork, i.e., file copy, artwork

master, or production master, etc.

6. In manual designs the artwork is usually prepared at an enlarged scale with tapes and other drafting aids. The artwork master is

produced from the artwork by photographic reduction.

7. In semi-automated designs, there may be no artwork by definition. Typically, an enlarged color-coded printed wiring layout on a

gridded format is prepared for subsequent digitizing and photoplotting. This procedure may yield intermediate phototools which can

be photographically processed into an artwork master or it may directly yield an artwork master, working master, or production

master.

8. In fully automated systems, there is usually no artwork or printed wiring layout prepared. A computerized procedure from a form of

the electrical schematic by total computerization or a combination of computer and interactive design procedures. This procedure

may yield intermediate phototools or the artwork master, working master, or production master directly.

Multilayer

Printed

Boards

Corresponding

Registered

Production

Master

L3 - RR

L4 - RR UP (Legend Rev. Read)

L4 - RR DN

(Legend Rev. Read)

Emulsion

L1 - RR UP

(Legend Corr. Read)

L1 - RR UP

(Legend 

Corr. 

Read)

Viewing Primary Side

Copper

Substrate Base Material

Substrate

Base Material

COPPER

EMULSION

▼ ▼

▼

L2 - RR UP

▼

L3 - RR DN

▼

Copper

▼

Viewing Component Side

▼

L2 - RR

IPC-T-50F June 1996

Rigid Double-sided Printed Board 61.1577

Double-sided printed board, either printed circuit or printed

wiring, using rigid base materials only.

Rigid Multilayer Printed Board 61.1578

Multilayer printed board, either printed circuit or printed

wiring, using rigid base materials only.

Rigid Printed Board 61.1571

A printed board using rigid base materials only.

Rigid Single-sided Printed Board 61.1576

Single-sided printed board, either printed circuit or printed

wiring, using rigid base materials only.

Rigid-flex Double-sided Printed Board 63.1584

Double-sided printed board, either printed circuit or printed

wiring, using combinations of rigid and ﬂexible base mate-

rials.

Rigid-Flex Printed Board 63.1258

A printed board with both rigid and ﬂexible base materials.

Rise Time 21.1259

The time required for a signal voltage to increase (switch)

from 10 to 90 % of its ﬁnal voltage level after a level

change has been initiated.

Risk Management Factor (RMF) 94.1777

The maximum tolerable percentage of possible defects

within a lot (group) of units, based on appoximately 95 %

conﬁdence level.

Roadmap 26.1260

A printed nonconductive pattern that delineates the compo-

nents and circuitry on a printed board in order to aid in

servicing and repairing the ﬁnal assembly.

Robber 53.1261

see ‘‘Plating Thief.’’

Rosin 46.1514

A hard, natural resin, consisting of abietic and primaric

acids and their isomers, some fatty acids and terpene

hydrocarbons, that is extracted from pine trees and subse-

quently reﬁned.

Rosin Flux 46.1262

Rosin in an organic solvent or rosin as a paste with activa-

tors.

Rosin Solder Connection 75.1515

A solder connection that has practically the same appear-

ance as does a cold solder connetion, but that also shows

evidence of entrapped rosin separating the surfaces to be

joined. (See also ‘‘Cold Solder Connection’’).

Rotational Error 25.1263

The angular misalignment of a functional pattern with

respect to the X and Y axes.

Router (CAD) 22.1264

A computer program that automatically determines paths

between points to be interconnected.

Routing Mark 25.1265

An artwork feature that is used to deﬁne the periphery of a

printed board.

Roving 44.1266

A collection of parallel strands of ﬁlaments assembled with

or without an intentional twist.

Rubber Banding 22.1267

A technique for displaying a straight line with one endpoint

ﬁxed and the other end following the commands of a

manual data input device.

Run (n.) 91.1268

A consecutive number of points that consistently increase

or decrease, or that are consistently above or below the

central line of a SPC control chart.

Run Chart 91.1269

A graphic representation of plotted values of some statistic

gathered from a process characteristic and a central line

that can be analyzed for runs.

Run Time 92.1271

The time elapsed while a unit is in an inspection or testing

machine.

Runout 24.1270

The sum of the cumulative-pitch error across a number of

functional patterns on a step-and-repeat phototool.

Runtime System 11.1272

The collection of software programs required to perform

the actual testing and diagnosis of a unit under test.

Sacrificial Protection 45.1274

The preferential corrosion of a metal coating in order to

protect the substrate metal.

Sacrificial-Foil Laminate 31.1273

A base material with a treated-metal foil which is subse-

quently removed, for the purpose of impressing a

microporous topography on the surface of the base mate-

rial.

Sagging 74.1275

see ‘‘Wire Sag.’’

June 1996 IPC-T-50F