IPC-T-50F_.pdf.pdf - 第84页

14. ENVIRONMENTAL Contains terms related to managing the environmental ef f luent material discharge, handling or reclamation activ- ity and all waste (both benign and hazardous) processing and disposition. 15. FINANCIAL…

Appendix B

Principles and Use of the Classification Code

Deﬁnitions of Classiﬁcation Code Descriptors for catego-

rizing of Terms and Deﬁnitions needed to describe Man-

agement, Design, Fabrication, Assembly and Testing issues

of electronic printed board assemblies.

BACKGROUND

The Classiﬁcation Code (CC) used in this Publication

builds on the principles of widely acknowledged concepts

that have been Internationally accepted. The CC allows for

the arrangement of terms according to various topics

related to the elements and practices needed to produce

electronic products.

Speciﬁcally intended to accommodate Interconnecting

Structure design, fabrication, assembly and test, the pri-

mary emphasis is on Printed Board and Printed Board

Assembly products used in Electronic Packaging disci-

plines. Also included are the terminology for the processes,

the materials, and component descriptions, along with busi-

ness administration issues, necessary to adequately deﬁne

the products and services being performed.

There are nine Segments to the classiﬁcation code. These

are:

1. Administration

2. Engineering and Design for Electronic Packaging

3. Components for Electronic Packaging

4. Materials for Electronic Packaging

5. Fabrication Processes for Interconnecting Structures

6. Types and Performance of Interconnecting Structures

for Electronic Packaging

7. Assembly Processes for Interconnecting Structures

8. Types and Performance of Interconnecting Structure

Assemblies for Electronic Packaging

9. Quality and Reliability for Electronic Packaging,

Fabrication and Assembly

The ﬁrst part of the Classiﬁcation Code consists of three

digits which are available for categorizing terminology and

information related to the nine segments. The ﬁrst digit

describes the classiﬁcation code segment as outline above;

the second digit is for a particular topic within a segment,

and the third digit is not standardized and is optional for

users of the system or speciﬁcation developers allowing for

more detailed apportionment of a topic. Thus, a Classiﬁca-

tion Code of ‘‘44X’’ would signify:

4.. Segment (Materials for Electronic Packaging)

.4. Topic (Reinforcement/Constraining Core/Heat Dis-

sipation Materials)

..X Optional

The second part of the CC numbering scheme is a four

digit unique identiﬁcation number that is assigned to a spe-

ciﬁc term and its deﬁnition. These numbers are assigned in

sequence of need, starting with the number 0001. Terms are

assigned to a Segment and Topic without duplication of the

unique identiﬁcation number. If a general term is used in

the industry which can be applied to more than one Topic

or Segment, the deﬁnition shall be enhanced to make it

clear that the term belongs to only one Segment Topic.

An example is the term ‘‘void.’’ This term might have three

unique numbers and deﬁnitions. One is for a void in

printed board laminate, one is for a void in artwork emul-

sion, and one is for a void in a solder joint.

The number assigned to each term in IEC publication 194

shall be designated by the two digit Segment/Topic

descriptor, followed by a period (.), followed by a four

digit number that is assigned as the unique descriptor for

each term; i.e., 44.0173, 56.2574 etc.

Wherever possible, if a term is applicable in several areas

it is assigned to the two digit general topic designator (i.e.

20,30).

The system has the capability for identifying almost ten

thousand terms and their deﬁnitions. If the number is

exceeded at some time in the future, the four digit ﬁeld will

be increased by one digit by adding a zero (0) at the front

of each existing number.

The following paragraphs describe the standardized Classi-

ﬁcation Codes:.

1. ADMINISTRATION

10. GENERAL (ADMINISTRATION ISSUES)

Contains general terms needed to describe administrative

functions that cross many boundaries in running a com-

pany, managing a product, or supervising a process.

11. DATA PROCESSING

Contains terms related to software and hardware used in

processing data that fall under administrative responsibility

and/or functions.

12. PERSONNEL

Contains terms dealing with personnel issues and includes

such items as industrial medicine, safety, beneﬁts, care, etc.

13. FACILITIES

Contains terms related to the building or plant performing

electronic packaging functions. Included are the require-

ments for utilities such as light, temperature/humidity con-

trol, sprinklers, etc. and any office equipment necessary for

the administration of the site operation.

June 1996 IPC-T-50F

14. ENVIRONMENTAL

Contains terms related to managing the environmental

effluent material discharge, handling or reclamation activ-

ity and all waste (both benign and hazardous) processing

and disposition.

15. FINANCIAL/PURCHASING

Contains terms related to accounting practices and financial

methodology for administrating salaries, customer

accounts, purchasing philosophies, and similar departmen-

tal functions or activities.

16. INVENTORY/SHIPPING

Contains terms related to the movement, storage, and han-

dling of materials, parts and products both into and out-of

the facility including the documentation and control system

used to manage accounting, movement, disposition, and

dispersement.

17. CUSTOMER/VENDOR RELATIONS

Contains terms dealing with the management approach to

customer problems or customer satisfaction as well as ven-

dor selection or vendor rating policies.

18. [RESERVED FOR FUTURE EXPANSION]

19. OTHER (ADMINISTRATION ISSUES)

Contains terms related to unique administration issues not

easily identiﬁed by the assigned topics. Caution is sug-

gested when using the topic ‘‘OTHER,’’ as terms contained

in this topic should be unique and have little bearing to

one-another.

2. ENGINEERING AND DESIGN FOR ELECTRONIC

PACKAGING

20. GENERAL (ENGINEERING AND DESIGN ISSUES)

Contains terms needed to describe engineering and design

principles or strategies which cross the boundaries of

design for fabrication,assembly and test, as well as the

automation tools needed to accomplish a smooth transition

of information ﬂow.

21. ENGINEERING

Contains terms associated with engineering design.

Includes, but is not limited to such items as engineering

work station (CAE) software and methods and hardware

technology, propagation delay analysis, cross talk analysis,

dielectric loss predictions, impedance control analysis,

boolean logic conversion, direct data transfer, thermal dis-

sipation predictions, etc.

22. PRINTED BOARD AND PRINTED BOARD ASSEMBLY

DESIGN

Contains terms related to printed board and printed board

assembly. Includes, but is not limited to computer aided

design (CAD) equipment and software algorithms, such

items as design rule checks, direct input from CAE work

stations, gate assignment or gate swapping, ﬁxed grid snap-

in, force ﬁeld component manipulation, heat sensitivity

analysis, multi-directional conductor routing etc.

23. SUBASSEMBLY DESIGN

Contains terms associated with subassembly design of clus-

ters of components intended to serve an electrical or elec-

tromechanical function. Includes, but is not limited to com-

puter automation tools (CAE/CAD), small printed circuits,

hybrids, multichip modules and other product designs, and

relates to all layout principles and technical evaluations

performed by the computer hardware/software.

24. PHOTOTOOL GENERATION AND PHOTOGRAPHIC

PROCESSES

Contains terms related to phototools used in the process of

producing circuit feature, both passive and active, as well

as the materials and equipment used to produce the photo-

graphic image transfer action. Includes both contact and

off-contact techniques, direct and indirect (laser pixel trans-

fer) technologies.

25. ELECTRONIC PRODUCTION DATA GENERATION

Contains terms needed to describe the methodologies

involved with techniques and data formats that convert

design data into manufacturing numerical control tools.

Includes software and hardware, as well as the transfer

media, such as modems, magnetic discs/tapes,CD roms,

and direct cable linkages.

26. TECHNICAL DOCUMENTATION

Contains terms related to hard copy and electronic media

that deﬁnes detail and assembly drawings, speciﬁcation

control drawings, technical manuals, speciﬁcations, stan-

dards, lists of materials, and any other information needed

to provide logistic support or control for electrotechnical

equipment for its entire life cycle.

27. [RESERVED FOR FUTURE EXPANSION]

28. [RESERVED FOR FUTURE EXPANSION]

29. OTHER (ENGINEERING AND DESIGN ISSUES)

Contains terms related to unique engineering and design

philosophies and techniques which are not easily identified

by assigned topics. Caution is suggested when using the

topic ‘‘OTHER’’ as terms contained in this topic should be

unique and have little bearing to one-another.

3. COMPONENTS FOR ELECTRONIC PACKAGING

30. GENERAL (COMPONENT DESCRIPTION ISSUES)

Contains terms needed to describe the physical, mechanical

and electrical component properties which cross the bound-

aries of package style and mounting characteristics for

IPC-T-50F June 1996

electronic, electromechanical and mechanical components

used in developing electronic assemblies.

31. DISCRETE & I/C THROUGH-HOLE COMPONENT

PACKAGES

Contains terms related to the performance and packaging

styles for axial leaded and radial leaded passive and active

components intended for through-hole mounting and cov-

ers any lead forming criteria necessary for proper assembly

or stress relief. Includes, but is not limited to, resistors,

capacitors, transistor, single- and dual-inline packages, pin

grid arrays, chokes, transformers, relays, connectors, con-

nector sockets, etc.

32. DISCRETE SURFACE MOUNT COMPONENT PACK-

AGES

Contains terms related to performance and package styles

for discrete (single function) components, both leaded and

leadless, intended for surface mounting. Includes, but is not

limited to, chip resistors/capacitors, tantalum capacitors,

metallized face components, small outline transistors,

diodes, coils, chokes, test points, connectors sockets, etc.

33. I/C PACKAGE TYPES FOR SURFACE MOUNTING

Contains terms related to performance and package styles

for components that provide integrated logic (multiple)

functions in a single semiconductor chip and encapsulated

to protect the chip from the environment so that the com-

pleted component is ready for surface mounting after lead

forming or other lead/termination preparation. Includes, but

is not limited to small outline I/C’s, ceramic ﬂat packs,

plastic quad packs, leaded and leadless chip carriers, thin

small outline packages, encapsulate TAB, special ﬁber

optic devices etc.

34. GRID ARRAY PACKAGES

Contains terms related to performance and package styles

for components that provide high lead count capability in

leads or terminations and are integrated logic (multiple)

functions in a single semiconductor encapsulated to protect

the chip from the environment ready for mounting.

Includes, but is not limited to ball, post and pad grid arrays.

35. BARE DIE AND CHIP SCALE COMPONENTS

Contains terms related to bare die or enhanced die (chip

scale) component descriptions covering performance

requirements and process details necessary to deﬁne bond-

ing site characteristics, and other metallizations involved in

the interconnecting methodology for the un-protected die.

36. COMPONENT AND COMPONENT LEAD/

TERMINATION MATERIAL PROPERTIES

Contains terms necessary to deﬁne materials used in the

manufacture of component packages. Includes, but is not

limited to, encapsulating or hermetically sealing materials,

metals used to form leads or terminations, plating materi-

als, plastics, conductive/non-conductive adhesives etc.

37. COMPONENTS FOR WIRING AND CABLING

Contains terms related to the electronic, and electrome-

chanical components ,wiring, wiring harnesses, and

cabling. Includes heat dissipation characteristics, power

consumption, tolerances and performance variation.

38. [RESERVED FOR FUTURE EXPANSION]

39. OTHER (COMPONENT DESCRIPTION ISSUES)

Contains terms related to unique physical, mechanical, and

electrical properties of electronic, electromechanical, and

mechanical components which are not easily identiﬁed by

assigned topics. Caution is suggested when using the topic

‘‘OTHER,’’ as terms contained in this topic should be

unique and have little bearing to one-another.

4. MATERIALS FOR ELECTRONIC PACKAGING

40. GENERAL (MATERIAL ISSUES)

Contains terms needed to describe materials, their charac-

teristics, storage and handling requirements which cross the

boundaries of those properties used as a part of the com-

pleted interconnecting structure or interconnecting struc-

ture assembly. Process consumable materials are not

included in this segment and their terms are covered in the

topic to which they apply.

41. RIGID PRINTED BOARD SUBSTRATE MATERIALS

(ORGANIC)

Contains terms related to laminated, clad and unclad, mate-

rials used in the manufacture of rigid printed boards.

Includes, but is not limited to, phenolic, epoxy (multifunc-

tional, tetrafunctional, BT resins), cyanate esters, PTFE

(teﬂon), polyimide etc., reinforced by paper, glass (matt,

ﬁber and woven cloth), etc. (see 44.).

42. FLEXIBLE PRINTED BOARD SUBSTRATE MATERI-

ALS (ORGANIC)

Contains terms related to, clad and unclad, materials used

in the manufacture of ﬂexible and rigid/ﬂex printed boards.

Includes, but is not limited to, polyimide ﬁlm (extruded

and cast), polyester ﬁlms, PTFE (unreinforced) etc. as well

as the acrylic, epoxy, and other adhesives.

43. INORGANIC SUBSTRATES USED FOR INTERCON-

NECTING STRUCTURES

Contains terms related to the substrate materials used for

designing and manufacturing printed boards and other

interconnecting structures that need the thermal or dimen-

sional stability properties of inorganic materials. Included,

but not limited to, Alumina, Beryllia, Glass, Porcelainized

invar, Copper molybdenum, etc.

June 1996 IPC-T-50F