IPC-T-50F_.pdf.pdf - 第99页
61 Rigid Printed Boards (Organic) 61.1587 Metal Core Printed Board 61.1577 Rigid Double-sided Printed Board 61.1578 Rigid Multilayer Printed Board 61.1571 Rigid Printed Board 61.1576 Rigid Single-sided Printed Board 61.1…
54.0452 Etch Factor
54.0450 Etchant
54.1389 Etchback
54.0453 Etching
54.1390 Etching Indicator
54.0574 Graded Wedge
54.0798 Negative Etchback
54.1294 Shadowing, Etchback
54.0953 Smear Removal
55 Lamination, Sequential Deposition, and Molding
Processes
55.0130 Bonding Layer
55.0176 Cap Lamination
55.1350 Clad (adj.)
55.1376 Delamination
55.0545 Foil Lamination
55.0566 Gel Time
55.1412 Glass Transition Temperature
55.0672 Laminate (n.)
55.1808 Laminate (v.)
55.0685 Layer-to-Layer Registration
55.1443 Mass Lamination
55.0748 Measling
55.1449 Nominal Cured Thickness
55.0865 Pink Ring
55.1474 Plate Finish, Laminating
55.0898 Pre-finish (n.)
55.0900 Preflow
55.1154 Weave Exposure
55.1565 Weave Texture
56 Thermal Cure/Firing Processes
56.0082 Bake Out
56.0093 Batch Oven
56.0219 Co-Firing
56.0330 Cure
56.0331 Cure Time
56.0332 Curing Agent
56.0508 Fire (v.)
56.0509 Firing Sensitivity
56.0517 Fissuring
56.0557 Fused Coating
56.1676 Fusing
56.0467 Fusing Fluid
56.1408 Fusing Flux
56.1409 Fusing Oil
56.0577 Green Strength
56.0586 Hardeners
56.0593 Heat of Fusion
56.0660 Intumescence
56.0703 Levelling
56.0704 Levelling Flux
56.0705 Levelling Oil
56.0890 Post Curing
56.0902 Preheat (v.)
56.1483 Preheating (v.)
56.1304 Radiant Flux
56.1305 Radiant Intensity
56.1306 Radiator, Focused
56.1307 Radiator, Nonfocused
57 Cleaning and Chemical Treatment Processes
57.0042 Anodic Cleaning
57.0185 Cathodic Cleaning
57.0199 Chemical Conversion Coating
57.0366 Desmear
57.0832 Passivation
57.1009 Stabilization Period
59 Other (Interconnecting Structure Fabrication
Processes)
59.0186 Cation Exchange
59.0187 Cationic Reagent
6 Type and Performance of Interconnecting Structures
60 General (Interconnecting Structure Type and
Performance)
60.1319 Access Hole
60.0041 Annular Ring
60.0084 Bare Board
60.0118 Board
60.0139 Bond Strength
60.1218 Bow (Sheet, Panel, or Printed Board)
60.0148 Breakout
60.0156 Bulge
60.0177 Card
60.0214 Circuit Card
60.0252 Conductor Base Spacing
60.0253 Conductor Base Width
60.1363 Conductor Spacing
60.1364 Conductor Width
60.0402 Double-Sided Printed Board
60.0451 Etched Printed Boards
60.1699 Hole Breakout
60.0707 Lifted Land
60.1227 Multilayer Printed Board
60.0786 Multilayer Printed Circuit Board
60.0788 Multilayer Printed Wiring Board
60.1179 Nick (n.)
60.1181 Nodule
60.0810 One-Sided Board
60.0816 Overhang
60.0823 Packaging and Interconnecting Assembly
60.1461 Packaging and Interconnection Structure
60.1487 Printed Circuit Board
60.1488 Printed Wiring
60.1489 Printed Wiring Board
60.0912 Printed Circuit
60.1485 Printed Board (PB)
60.1490 Production Board
60.1504 Resin Recession
60.0945 Single-Sided Printed Board
60.1013 Stamped Printed Wiring
60.1553 Twist
60.1116 Two-sided Board
60.1147 Warp
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61 Rigid Printed Boards (Organic)
61.1587 Metal Core Printed Board
61.1577 Rigid Double-sided Printed Board
61.1578 Rigid Multilayer Printed Board
61.1571 Rigid Printed Board
61.1576 Rigid Single-sided Printed Board
61.1521 Sequentially-Laminated Multilayer Printed
Board
62 Flexible Printed Boards (Organic)
62.1581 Flexible Double-sided Printed Board
62.1582 Flexible Multilayer Printed Board
62.1579 Flexible Printed Board
62.0525 Flexible Printed Circuit
62.0526 Flexible Printed Wiring
62.1580 Flexible Single-sided Printed Board
63 Flex-Rigid Printed Boards (Organic)
63.1570 Flex-Rigid Double-sided Printed Board
63.0524 Flex-Rigid Printed Board
63.1584 Rigid-Flex Double-sided Printed Board
63.1258 Rigid-Flex Printed Board
64 Discrete Wiring Boards (Organic)
64.0390 Discrete-Wiring Board
64.0391 Discrete-Wiring Board Assembly
67 Hybrid/Multichip Module Interconnecting Structures
67.0818 Overlap (Film)
7 Assembly Processes for Interconnection Structures
70 General (Assembly Process Issues)
70.1731 Bar Code Marking
70.0090 Basic Wettability
70.0149 Bridging, Electrical
70.0239 Component Mounting
70.0279 Contact Resistance
70.0291 Conveyor, Edge
70.0292 Conveyor, Mesh
70.0293 Conveyor, Secondary
70.0435 Elongation
70.1452 Mixed Component-Mounting Technology
70.1757 Mixed Technology
70.1763 Processability
70.1770 Stand-Off
71 Component Handling, Storage and Preparation
71.1762 Preconditioning
71.1541 Taped Component
71.1089 Tinning
71.1146 Waffle Pack
72 Through-Hole Mounting of Components
72.0063 Automated Component Insertion
72.1351 Clinched Lead
72.0217 Clinched-Wire Interfacial Connection
72.1352 Clinched-Wire Through Connection
72.1467 Partially-Clinched Lead
72.1022 Straight-Through Lead
72.1539 Swaged Lead
72.1085 Through-Hole Mounting
73 Surface Mounting of Components
73.1733 Centering Force
73.0406 Drawbridged Component
73.0457 Excising
73.0697 Lead Projection
73.1760 Pick-Up Force
73.1759 Pick-Up Tool
73.1761 Placement Force
73.0951 Slump
73.1001 Spread
73.1012 Staking,Adhesive (v.)
73.1026 Stringing
73.1035 Surface Mounting
73.1093 Tombstoned Component
73.1775 Vacuum Head
74 Bare Chip Placement and Attachment
74.0021 Adhesion Layer
74.0039 Angled Bond
74.0048 Area Array Tape Automated Bonding
74.0055 Aspect Ratio (Film)
74.0073 Back Bonding
74.0079 Back Mounting
74.0083 Ball Bond
74.0085 Barrier Metal
74.0120 Bond
74.0123 Bond Deformation
74.0126 Bond Envelope
74.0125 Bond Enhancement Treatment
74.0133 Bond Interface
74.0134 Bond Land
74.0135 Bond Lift-off
74.0136 Bond Schedule
74.0137 Bond Separation
74.0138 Bond Site
74.0141 Bond Surface
74.0121 Bond-to-Bond Distance
74.0122 Bond-to-Die Distance
74.1342 Bondability
74.0128 Bonding Area
74.0129 Bonding Island
74.0131 Bonding Tool
74.0132 Bonding Wire
74.0127 Bonding, Die
74.0155 Bugging Height
74.0159 Bump (Die)
74.0160 Bumped Die
74.0161 Bumped Tape
74.0162 Bumped Wafer
74.0167 Burn-Off
74.0175 Capillary
74.0189 Centerwire Break
74.1348 Chemisorption
74.0204 Chessman
74.0206 Chip-and-Wire
74.0210 Chisel
74.0212 Chopped Bond
74.1734 Circumferential Thermodes
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74.0235 Compliant Bond
74.0275 Contact Angle (Bonding)
74.0311 Cratering
74.0336 Cut-Off
74.0376 Die Bonding
74.0379 Diffusion Bond
74.0418 Edge Short
74.0432 Electron-Beam Bonding
74.0454 Eutectic Die Attach
74.0469 Face Bonding
74.0491 Feature Window
74.0512 First Bond
74.0513 First Radius
74.0514 First Search
74.0520 Flag
74.0521 Flame-Off
74.0530 Flip Chip
74.0529 Flip-Chip Mounting
74.0532 Floating-Annulus Tape-Automated Bonding
74.0547 Foot Length
74.0551 Frame Pitch
74.0562 Gang Bonding
74.0598 Heel, Bonding
74.0620 Horn
74.0646 Inner-Lead Bond (ILB)
74.0680 Lap Shear Strength
74.0692 Lead Frame
74.0756 Microbond
74.0770 Mislocated Bond
74.0793 Nailhead Bond
74.0796 Neckbreak
74.0804 Off Bond
74.1198 Outer-Lead Bond (OLB)
74.0831 Partial Lift
74.1312 Rebond
74.1275 Sagging
74.1280 Scrubbing
74.1281 Search Height
74.1283 Second Bond
74.1290 Semiconductor Carrier
74.0943 Single-Point Bonding
74.0952 Smeared Bond
74.0961 Solder Bump
74.0983 Solid-State Bond
74.1003 Sprocket
74.1021 Stitch Bond
74.1543 Thermocompression Bonding
74.1072 Thermosonic Bonding
74.1095 Torsional Strength
74.1100 Transfer-Bump Tape Automated Bonding
74.1119 Ultrasonic Bonding
74.1157 Wedge Bond
74.1158 Wedge Tool
74.1168 Wire Bonding
74.1169 Wire Sag
74.1172 Wobble Bond
75 Joining Techniques
75.1681 Condensation Soldering
75.1326 Contact Angle (Soldering)
75.0289 Controlled Collapse, Component Connection
75.0288 Controlled Collapse Soldering
75.1736 Convected Energy
75.0300 Corrosive Flux
75.1382 Dip Soldering
75.1386 Drag Soldering
75.0410 Dross
75.1391 Eutectic (n.)
75.1392 Eutectic (v.)
75.1393 Excess Solder Connection
75.0498 Fillet, Adhesive
75.0499 Fillet, Solder
75.0536 Flow Soldering
75.0538 Flux
75.0540 Flux Activation Temperature
75.0541 Flux Activity
75.1745 Fluxing
75.1746 Forced Gas Convention Soldering
75.1404 Foreign Material (Soldering)
75.0564 Gas Blanket
75.0585 Hand Soldering
75.0587 Hard Wiring
75.0592 Heat Column
75.1416 Heatsink Tool
75.1748 Hot Plate Reflow Soldering
75.0631 Icicle
75.1749 Immersion Attitude
75.1751 Infra-Red Reflow (IR)
75.0647 Inorganic Flux
75.1428 Intermetallic Compound, Solder
75.1753 Laser Soldering
75.0687 Leaching, Metalization (v.)
75.0691 Lead Extension
75.0737 Manual Soldering
75.1678 Mass Soldering
75.0749 Mechanical Wrap
75.0780 Muffle
75.1183 Nonactivated Flux
75.1189 Nonwetting (Solder)
75.1194 Open Time
75.0817 Overheated Solder Connection
75.1465 Parallel-Gap Soldering
75.1466 Parallel-Gap Welding
75.0836 Paste Flux
75.0835 Paste, Soldering
75.0886 Porosity (Solder)
75.0899 Preferred Solder Connection
75.0926 Pulse Soldering
75.1500 Reflow Soldering
75.1235 Reflow Spike
75.1247 Resin Flux
75.1248 Resistance Soldering
75.1249 Resistance Welding
75.1515 Rosin Solder Connection
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