IPC-T-50F_.pdf.pdf - 第80页
DIM Data-Information Record DIN Deutsches Institute for Normung DIP Dual-Inline Package DLA Defense Logistics Agency (DOD) DMSA Defense Manufacturers and Suppliers Associa- tion DNC Distributed (or Direct) Numerical Cont…
Appendix A
—A—
AAGR Annual Average Growth Rate
ABS Acrylonitrile-Butadiene-Styrene (Plastic)
AC Alternating Current
AEC Architecture, Engineering and Construction
AGV Automated Guided Vehicle
AI Artifical Intelligence
AIS Adhesive Interconnect System
ANOVA Analysis of Variance
ANSI American National Standards Institute
AOI Automated Optical Inspection
AOQ Average Outgoing Quality
APT Automatically Programmed Tools
AQL Acceptable Quality Level
ARINC Aeronautical Radio Incorporated
ASCII American Standard Code for Information
Interchange
ASIC Application Specific Integrated Circuit
ASTM American Society for Testing Materials
ATE Automatic Test Equipment
ATG Automatic Test Generation
ATR Air Transport Rack
AVT Accelerated Vesication Test
AWG American Wire Gauge
—B—
BDMA Benzyldimethylamine
BITE Built-In Test Equipment
BOD Biochemical Oxygen Demand
BOM Bill of Material
BT Bismaleimide Triazine
BTAB Bumped Tape-Automated Bonding
—C—
C3 Command, Control and Communicate
C4 Controlled Collapse Component Connection
CAD Computer-Aided Design
CAE Computer-Aided Engineering
CAFM Computer-Aided Facilities Management
CAGE Commercial and Government Entity
CALS Computer-Aided Acquisition and Logistic
Support (DOD)
CAM Computer-Aided Manufacturing
CAPP Computer-Aided Process Planning
CAR Computer-Aided Repair
CASE Computer-Aided Software Engineering
CAT Computer-Aided Testing
CCAPS Circuit Card Assembly and Processing System
CDA Copper Development Association
CFM Continuous Flow Manufacturing
CFM Cubic Feet per Minute
CIM Computer-Integrated Manufacturing
CISC Complex Instruction Set Computing
CITIS Contractor Integrated Technical Information
Services
CMOS Complimentary Metal-Oxide Semiconductor
CNC Computer Numerical Control
COB Chip-on-Board
COD Consumed Oxygen Demand
Cp Capability Performance
CPL Capability Performance, Lower
CPU Capability Performance, Upper
CPU Central Processing Unit (Computer)
CRT Cathode-Ray Tube
CSG Constructive Solids Geometry
CTE Coefficient of Thermal Expansion
—D—
DAB Designated Audit Body
DATC Design Automation Technical Committee (IEEE)
DBMS Database Management System
DC Direct Current
DCAS Defense Contract Administration Service
DCMA Defense Contract Management Agency
DCMC Defense Contract Management Command
DESC Defense Electronics Supply Center
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DIM Data-Information Record
DIN Deutsches Institute for Normung
DIP Dual-Inline Package
DLA Defense Logistics Agency (DOD)
DMSA Defense Manufacturers and Suppliers Associa-
tion
DNC Distributed (or Direct) Numerical Control
DOD Department of Defense
DOD Dissolved Oxygen Demand
DOS Disc Operating System
DRC Design Rule Checking
DRM Drawing Requirements Manual
DVM Digital Voltmeter
DXF Data Exchange Format
—E—
ECAD Electronic Computer-Aided Design
ECCB Electronic Components Certification Board
ECL Emitter-Coupled Logic
ECM Electronic Countermeasures
ECN Engineering Change Notice
ECO Engineering Change Order
EDA Electronic Design Automation
EDIF Electronic Design Interchange Format
EDM Electro-Discharge Machining
EIA Electronic Industries Association
EIS Engineering Information System
EMC Electromagnetic Compatibility
EMF Electro-Motive Force
EMI Electromagnetic Interference
EMP Electromagnetic Pulse
EMPF Electronics Manufacturing Productivity Facility
EPR Ethylene-Propylene (Copolymer) Resin
EPT Ethylene-Propylene Terepolymer
ESD Electrostatic Discharge
ESR Equivalent Series Resistance
ETPC Electrolytic Tough-Pitch Copper
—F—
FAA Federal Aviation Administration
FAR Failure Analysis Report
FCC Federal Communications Commission
FCC Flat-Conductor Cable
FEA Finite-Element Analysis
FEM Finite-Element Modeling
FEP Fluorinated Ethylene-Propylene (Teflon)
FET Field-Effect Transistor
FPT Fine-Pitch Technology
FSCM Federal Stock Code for Manufacturers
—G—
GaAs Gallium Arsenide
GBIB General Purpose Interface Bus
GMA Gas Metal Arc (Welding)
GTA Gas Tungsten Arc (Welding)
—I—
I/O Input/Output (Terminations)
IC Integrated Circuit
ICAM Integrated Computer-Aided Manufacturing
IDC Insulation-Displacement Connection
IEC International Electrotechnical Commission
IECQ International Electronic Component Qualifica-
tion System
IEEE Institute of Electrical and Electronic Engineers
IEPS International Electronic Packaging Society
IGES Integrated Graphics Exchange System
ILB Inner-Lead Bonding (TAB)
IPC Institute for Interconnecting and Packaging
Electronic Circuits
IR Infrared
ISHM International Society for Hybrid Microelectron-
ics
ISO International Standards Organization
ITT Inter-Test Time
—J—
JEDEC Joint Electronic Device Engineering Council
JIT Just-in-Time (Manufacturing)
—K—
KGB Known Good Board
—L—
LAN Local Area Network
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LCCC Leadless Ceramic Chip Carrier
LDA Logic Design Automation
LED Light-Emitting Diode
LIF Low Insertion Force
LMC Least Material Condition
LRU Lowest Replaceable Unit
LSI Large Scale Integration (Integrated Circuit)
—M—
MA Mechanical Advantage
MAC Maximum Allowable Concentration
MAP Manufacturing Automation Protocol
MATS Material Transport Segment
MCAD Mechanical Computer Aided Design
MCAE Mechanical Computer-Aided Engineering
MCM Multichip Module
MDA Methylenedianiline
MEK Methyl-Ethyl Ketone
MELF Metal Electrode Face (Discrete Leadless
Component)
MIBK Methyl-Isobutyl Ketone
MIR Moisture Insulation Resistance
MITI Ministry of International Trade and Industry
(Japan)
MLPWB Multilayer Printed Wiring Board
MMC Maximum Material Condition
MOS Metal-Oxide Semiconductor
MRP Material Requirement Planning
MRP II Manufacturing Resource Planning
MSI Medium Scale Integration (Integrated Circuit)
MTBF Mean Time Between Failures
MTTR Mean Time To Repair
—N—
NADCAP
National Aerospace and Defense Contractors
Accreditation Procedures
NASA National Aviation and Space Administration
NBR Nitrile Butadiene-Acrylonitrile Rubber
NBS National Bureau of Standards
NC Numerical Control
NDT Non-Destructive Testing
NECQ National Electronics Component Qualification
System
NEMA National Electrtical Manufacturers Association
NIST National Institute for Science and Technology
NMR Normal-Mode Rejection
NSA National Secutity Agency
—O—
OEM Original Equipment Manufacturer
OFHC Oxygen-Free High-Conductivity Copper
OLB Outer-Lead Bonding (TAB)
OSHA Occupational Safety Hazards Act
OSI Open Systems Interconnection
—P—
P&IA Packaging and Interconnecting Assembly
P&IS Packaging and Interconnecting Structure
PBX Private Branch Exchange
PC Personal Computer
PCB Printed Circuit Board
PDES Product Data Exchange Specification
PDL Page Description Language
PGA Pin Grid Array (Leaded Component Package)
PHIGS Programmer’s Hierarchical Interface Graphics
Standard
PLCC Plastic Leaded Chip Carrier
PLD Programmable Logic Device
PPM Parts Per Million
PPS Polyphenylene Sulfide (Plastic)
PRT Planar Resistor Technology
PSI Pounds Per Square Inch
PT Positional Tolerance
PTFE Polytetrafluoroethylene (Teflon)
PTH Plated-Through Hole
PVC Polyvinyl Chloride
PWA Printed Wiring Assembly
PWB Printed Wiring Board
—Q—
QML Qualified Manufacturers List
QPL Qualified Products List
QTA Quick Turn Around
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