IPC-T-50F_.pdf.pdf - 第96页
44.0146 Bow (Fabric) 44.0273 Constraining Core 44.0298 Coronizing 44.0315 Creel 44.0355 Denier 44.0423 E Glass 44.0442 End Missing 44.0487 Feather Length 44.0496 Fill 44.0497 Filler 44.0506 Finished Fabric 44.0516 Fish E…
37.0329 Cup Solder Terminal
37.0405 Drain Wire
37.0412 Edge-Board Connector
37.0466 Eyelet
37.0486 FCC System
37.0518 Fixed Contact
37.0522 Flat Cable
37.0533 Floating Bushing
37.1405 Fork Contact
37.0583 Guide Pin
37.0588 Haywire
37.0589 Header (Connector)
37.0602 Hermaphroditic Contact
37.0606 High-Voltage Wire
37.0619 Hook Solder Terminal
37.1420 Insert (Connector)
37.0653 Interface resistance
37.0665 Jumper Wire
37.0668 Key
37.1430 Keying (n.)
37.1431 Keying (v.)
37.0669 Keyway
37.0683 Latch (Connector)
37.0731 Machined Contact
37.0739 Margin (Flat Cable)
37.0809 One-Piece Connector
37.0813 Open-Entry Contact
37.1469 Perforated (Pierced) Solder Terminal
37.0880 Plug Connector
37.0889 Post
37.0905 Pressfit Contact
37.1313 Receptacle Connector
37.1242 Removable Contact
37.1255 Ribbon Cable
37.1256 Ribbon Interconnect (n.)
37.1239 Scoop-Proof Connectors
37.1299 Sheet-Metal Contact
37.0954 Socket Contact
37.0980 Solder Terminal
37.0992 Spade Contact
37.1014 Standoff Solder Terminal
37.1023 Strain Relief (connector)
37.1051 Terminal
37.1552 Turret Solder Terminal
37.1115 Two-Piece Contact
37.1167 Wiping Action
37.1567 Wire Stripping
4 Materials for Electronic Packaging
40 General (Material Issues)
40.0035 Amorphous Polymer
40.1727 Absorption Coefficients
40.1334 Base Material
40.0091 Basis Material
40.0183 Catalyst (Resin)
40.0221 Coefficient of Thermal Expansion
40.0250 Conductivity (Electrical)
40.0316 Creep
40.0326 Crosslink
40.0328 Crystalline Polymer
40.0377 Dielectric
40.0383 Dimorphism
40.1800 Flat Conductor
40.1813 Insulator
40.0870 Plastic
40.0871 Plastic Deformation
40.1479 Polymer
40.0884 Polymerize
40.1246 Resin
40.1071 Thermoplastic
40.1544 Thermoset
41 Rigid Printed Board Substrate Materials (Organic)
41.1320 Adhesive-Coated Catalyzed Laminate
41.1323 Adhesive-Coated Uncatalyzed Laminate
41.1343 B-Stage
41.0069 B-Staged Material
41.0070 B-Staged Resin
41.0111 Bismaleimide
41.0112 Bismaleimide Triazine
41.1339 Blank
41.0114 Blends
41.0152 Brominated Epoxy
41.0170 Butter Coat
41.0171 C-Staged Resin
41.0374 Dicyanidiamide
41.0393 Dispersant (Organosol)
41.0394 Disperse Phase (Suspension)
41.0395 Dispersing Agent
41.1743 Epoxy Glass Substrate
41.0445 Epoxy Novolac
41.0555 Functionality, Resin or Curing Agent
41.0673 Laminate Thickness
41.1609 Metal-Clad Base Material
41.0752 Metal-Clad Laminate
41.0819 Oxide Transfer
41.1463 Panel
41.0903 Preimpregnated Bonding Sheet
41.0904 Prepreg
41.1505 Resin-Rich Area
41.1507 Resin-Starved Area
41.1207 Substrate
41.1142 Volume Ratio (Composite)
42 Flexible Printed Board Substrate Materials (Org.)
42.0303 Cover Coat
42.0304 Cover Lay (Flexible Circuit)
42.0305 Cover Layer
43 Inorganic Substrates for Interconnecting Structures
43.1730 Alumina Substrate
44 Reinforcement/Constraining Core/Heat Dissipation
Materials
44.0045 Aramid
44.0099 Beaming
44.0105 Bias (Fabric)
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44.0146 Bow (Fabric)
44.0273 Constraining Core
44.0298 Coronizing
44.0315 Creel
44.0355 Denier
44.0423 E Glass
44.0442 End Missing
44.0487 Feather Length
44.0496 Fill
44.0497 Filler
44.0506 Finished Fabric
44.0516 Fish Eye
44.0528 Flexural Strength
44.0531 Float
44.0565 Gelation Particle
44.0569 Glass Binder
44.0575 Grading Frame
44.0578 Greige
44.0591 Heat Cleaning
44.0596 Heavy Mark (Fabric)
44.0702 Leno End Out
44.0708 Light Mark (Fabric)
44.0723 Loom Beam
44.0741 Mark (Fabric)
44.0769 Mis-Pick
44.1464 Para-aramid
44.0834 Passive Base Material
44.0861 Pick
44.0868 Plain Weave
44.0878 Plied Yarn
44.1202 Quill
44.1230 Reed
44.1266 Roving
44.1516 Satin Weave
44.1284 Section Beam
44.1288 Selvage
44.0930 Shuttle
44.0948 Sizing
44.0999 Split (Fabric)
44.1027 Stripback
44.1032 Supporting Plane
44.1047 Tear (Fabric)
44.1049 Tenter Frame
44.1112 Trumeter
44.1127 Unfil
44.1149 Warp Size
44.1148 Warper
44.1564 Waste (Fabric)
44.1153 Waviness
45 Conductive Materials (Foil, Film or Plating)
45.0054 As-Fired
45.0088 Base Metal
45.0092 Basis Metal
45.0180 Carrier (Foil)
45.0202 Chemical Vapor Deposition
45.0249 Conductive Foil
45.0358 Dent
45.0425 Electrodeposited Foil
45.0500 Film
45.0501 Film Conductor
45.0546 Foil Profile
45.0638 Indentation
45.1459 Outgrowth
45.1274 Sacrificial Protection
45.1545 Thick Film
45.1079 Thin Film
45.1080 Thin Foil
45.1174 Wrought Foil
46 Component Attachment Materials (Conductive/
Nonconductive)
46.0009 Acid Flux
46.0008 Acid-Core Solder
46.0012 Activated Rosin Flux
46.0015 Activator
46.1728 Adhesive
46.0044 Aqueous Flux
46.0539 Flux-Cored Solder
46.1514 Rosin
46.1262 Rosin Flux
46.0956 Solder
46.0965 Solder Cream
46.1818 Solder Paste
47 Coating and Permanent Masting Materials
47.0107 Binder
47.0742 Mask
47.0892 Potting Compound
47.0973 Solder Mask
47.1674 Solder Resist
49 Other (Material Issues)
49.0068 Azeotrope
49.1330 Azeotrope Mixture (Azeotrope)
49.0847 Copolymerize
49.1082 Thixotropic Ratio
49.1083 Thixotropy
5 Fabrication Processes for Interconnection Structures
50 General (Interconnection Structure Fab Processes)
50.0201 Chemically-Deposited Printed Circuit
50.0200 Chemically-Deposited Printed Wiring
50.1788 Delivered Panel (DP)
50.0771 Misregistration
50.1646 Multiple Printed Panel
50.1786 Production Printed Board (PPB)
50.1787 Production Panel (PP)
50.1240 Registration
50.1209 Subtractive Process
50.1542 Thermal Zone
51 Mechanical Processes
51.0081 Back Taper(s)
51.1341 Body Land Clearance
51.0181 Carry-Out
51.0193 Chamfer (Drill)
51.0209 Chipped Point
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51.0211 Chisel-Edge Angle
51.0312 Crazing (Base Material)
51.0407 Drill Body Length
51.0408 Drill Diameter
51.0409 Drill Point Concentricity
51.0446 Epoxy Smear
51.1400 Flare
51.0544 Foil Burr
51.1415 Haloing
51.0597 Heel (Drill)
51.0601 Helix Angle
51.0618 Hook
51.0676 Land (Drill)
51.0679 Land Width (Drill)
51.1223 Land Width Angle (Drill)
51.0684 Layback
51.0712 Lip Height
51.0740 Margin Width (Drill)
51.0794 Nail Heading
51.1457 Open Point
51.1200 Overall Length
51.1229 Overlap (drill)
51.0881 Point Angle
51.0907 Primary Flare
51.0908 Primary Relief
51.0910 Primary Taper
51.1506 Resin Smear
51.1282 Secondary Relief
51.1295 Shank
51.1297 Shank Diameter
51.1296 Shank-to-Drill Body Concentricity
51.0929 Shoulder Angle
51.0998 Splay
51.1155 Web Taper
51.1156 Web Thickness
52 Imaging and Application of Resists and Inks
52.0011 Actinic Radiation
52.0113 Bleeding
52.1701 Definition
52.1448 Negative-Acting Resist
52.0845 Permanent Resist
52.0850 Photographic Layer
52.0856 Photoprint
52.1472 Photoresist
52.0857 Photoresist Image
52.1481 Positive-Acting Resist
52.0914 Printed Component
52.1600 Printed Components, Conductive Inks
52.1592 Printing
52.1508 Resist
52.1254 Reverse Image
52.1204 Screen Printing
52.0937 Silkscreening
52.0947 Skipping
52.1050 Tenting
52.1131 Usable Resolution
53 Metal Deposition Processes, including Plating
53.0002 Accelerator
53.0013 Activating
53.0014 Activating Layer
53.1322 Additive Process
53.0022 Adhesion Promotion
53.0056 Aspect Ratio (Hole)
53.0117 Blow Hole
53.0184 Catalyzing
53.0319 Critical Current Density
53.0426 Electrodeposition
53.0427 Electroless Deposition
53.0428 Electroless Plating
53.0430 Electrolytic Deposition
53.0433 Electroplating
53.0502 Film Network
53.1407 Fully Additive Process
53.0554 Fully-Electroless Process
53.0560 Galvanic Deposition
53.0561 Galvanic Displacement
53.0613 Hole Pull Strength
53.0614 Hole Void
53.0635 Immersion Plating
53.0645 Initiating
53.0656 Interlaminar Metalization
53.0753 Metalization (n.)
53.1199 Outgassing
53.1673 Overplate
53.0827 Panel Plating
53.0840 Pattern Plating
53.0255 Photographic-Reduction Dimension
53.0873 Plating (n.)
53.0874 Plating (v.)
53.0876 Plating Bar
53.1477 Plating Thief
53.0877 Plating Up
53.0875 Plating, Burned
53.0906 Pretinning
53.1261 Robber
53.1286 Seed Layer
53.1285 Seeding
53.1518 Semi-Additive Process
53.1291 Sensitizing
53.0962 Solder Coat
53.1677 Solder Levelling
53.1007 Sputtering
53.1540 Swell-and-Etch Process
53.1088 Tie Bar
53.1549 Treeing
53.1133 Vacuum Evaporation
54 Material Removal Processes, including Etching
54.1318 Abrasive Trimming
54.0010 Acid Number
54.1217 Acid Value
54.1321 Active Trimming
54.0245 Concentration Polarization
54.0248 Conducting Salt
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