IPC-T-50F_.pdf.pdf - 第71页

Supporting Plane 44.1032 A planar structure that is a part of a packaging and inter- connecting structure in order to provide mechanical sup- port, thermo-mechanical constraint, thermal conduction and/or electrical chara…

Statistical Process Control (SPC) 91.1536

The use of statistical techniques to analyze a process or its

output so as to be able to take appropriate action in order

to achive and maintain a state of statistical control and to

improve process capability.

Statistical Quality Control (SQC) 91.1017

The use of statistical techniques to document and assure

end product compliance with requirements.

Step Scale 24.1537

A series of regularly-spaced tones that range from black,

through intermediate shades of gray, to white that is used

as a reference scale for exposure control in a photo-

fabrication process.

Step Soldering 75.1019

The making of solder connections by sequentially using

solder alloys with successively-lower melting tempera-

tures.

Step Wedge 24.1020

see ‘‘Step Scale.’’

Step-and-Repeat 24.1018

The successive exposure of a single image in order to pro-

duce a multiple-image production master.

Stitch Bond 74.1021

A bond made with a capillary-type bonding tool whereby

the wire is not formed into a ball prior to bonding.

Straight-Through Lead 72.1022

A component lead that extends through a hole and is termi-

nated without subsequent forming.

Strain Relief (Connector) 37.1023

A receptacle connector device that prevents the disturbance

of the contact and cable terminations.

Stress Corrosion Cracking 95.1024

Spontaneous cracking produced by the combined action of

corrosion and residual or applied static stress.

Stress Relief 36.1025

The portion of a component lead or wire lead that is

formed in such a way as to minimize mechanical stresses

after the lead is terminated.

Stringing 73.1026

The forming of a ‘‘tail’’ of adhesive as the dispensing tool

pin or needle is withdrawn from the deposited adhesive.

Stripback 44.1027

Broken ﬁlaments along a yarn strand that are pushed back

and protrude above the ﬁber plane.

Stripline 21.1028

A transmission-line conﬁguration that consists of a conduc-

tor that is positioned equidistant between, and parallel to,

ground planes with a dielectric among them.

Structurally-Similar Construction 90.1029

Material combinations and materials whose construction

details will not affect test results at the primary stage of

manufacture.

Stub 21.1030

A branch of the main signal line of a signal net that is usu-

ally used to reach a load that is not on the direct signal

path.

Stud-Mount Termination 30.1031

see ‘‘Straight-Through Lead.’’

Subgroup 91.0140

A subset of a population that is analyzed dependently in

order to eliminate assignable causes of variation.

Subnet 21.1206

A single source and a single target point that, together with

associated vias, lands, and preplaced items, are completely

connected by route segments within one net.

Substrate 41.1207

see ‘‘Base Material.’’

Substrate Bending Test 92.1771

A test applied to a substrate to determine its resistance to

bending and the effects of bending to the substrate and any

components mounted on the substrate.

Subsurface Corrosion 96.1208

Formation of isolated particles of corrosion products

beneath a metal surface.

Subtractive Process 50.1209

The fabricating of a conductive pattern by the selective

removal of unwanted portions of a conductive foil.

Sum of Squares 91.1210

The variation contributed by a factor. (See also ‘‘Pure Sum

of Squares.’’)

Support Ring 36.1033

Dielectric material that is used to hold beam leads in place

relative to one another outside of a packaged device.

Supported Hole 22.1211

A hole in a printed board that has its inside surfaces plated

or otherwise reinforced.

IPC-T-50F June 1996

Supporting Plane 44.1032

A planar structure that is a part of a packaging and inter-

connecting structure in order to provide mechanical sup-

port, thermo-mechanical constraint, thermal conduction

and/or electrical characteristics. (It may be either internal

or external to the packaging and interconnecting structure.)

(See also ‘‘Constraining Core.’’)

Surface Insulation Resistance (SIR) 92.1538

The electrical resistance of an insulating material between

a pair of contacts, conductors or grounding devices in vari-

ous combinations, that is determined under speciﬁed envi-

ronmental and electrical conditions.

Surface Mounting 73.1035

The electrical connection of components to the surface of a

conductive pattern that does not utilize component holes.

Surface Mount Device (SMD) 30.1772

See ‘‘Surface Mount Component (SMC)‘‘.

Surface Tension 75.1036

The natural, inward, molecular-attraction force that inhibits

the spread of a liquid at its interface with a solid material.

Surface-Mount Component (SMC) 30.1034

A leaded or leadless device (part) that is capable of being

attached to a printed board by surface mounting.

Surge 21.1037

A transient variation in the current and/or potential at a

point in a circuit.

Swaged Lead 72.1539

A component lead wire that extends through a hole in a

printed board and its lead extension is ﬂattened (swaged) to

secure the component to the board during manufacturing

operations.

Swell-and-Etch Process 53.1540

The surface treatment of a base material in order to pro-

mote the adhesion of an electroless metal deposit by soft-

ening the surface with a solvent and then exposing the sur-

face to an oxidizing solution in order to create a

microporous surface.

Synthetic Activated Flux 75.1038

A highly-activated organic ﬂux whose post-soldering resi-

dues are soluble in halogenated solvents.

Synthetic Resin 75.1039

A synthetic organic polymer or a chemically-treated natu-

ral resin.

System Effective Color Temperature 24.1040

The effective color temperature measured using an optical

system’s light source to illuminate the target area.

Tab 22.1042

see ‘‘Printed Contact.’’

TAB 75.1041

see ‘‘Tape Automated Bonding.’’

Tail, Bonding 75.1043

The free end of wire extending beyond the bond impres-

sion of a wire bond from the heel.

Tail Pull 75.1044

The removal of excess wire after a wedge or ultrasonic

bond is made.

Tape 75.1045

see ‘‘Carrier Tape.’’

Tape Automated Bonding 75.1046

A ﬁne-pitch technology that provides interconnections

between die and base materials with conductors that are on

a carrier tape.

Taped Component 71.1541

A component that is attached to a continuous tape in order

to facilitate the use of automatic component incoming

inspection, lead forming, assembling and testing.

Tear (Fabric) 44.1047

A large rip in a fabric that is usually caused by excessive

tension being applied during processing or caused by a

weakness in the fabric.

Temperature Profile 75.1048

The depiction of the temperature that a selected point

traverses as it passes through the reﬂow process.

Tenter Frame 44.1049

A machine test maintains fabric width during drying by

means of clips running on two parallel endless chains.

Tenting 52.1050

The covering of holes in a printed board and the surround-

ing conductive pattern with a resist.

Terminal 37.1051

A metallic device that is used for making electrical connec-

tions. (See also ‘‘Solder Terminal.’’)

Terminal Area 22.1052

see ‘‘Land.’’

Terminal Clearance Hole 22.1053

see ‘‘Access Hole.’’

June 1996 IPC-T-50F

Terminal Hole 22.1054

see ‘‘Component Hole.’’

Terminal Pad 22.1055

see ‘‘Land.’’

Terminations 22.1773

To connect a line to a terminal, distributing frame, switch

or matrix.

Terpenes 76.1774

(Turpentine). A solvent used in cleaning electrical assem-

blies.

Test Board 92.1683

A printed board or discrete-wiring board that is deemed to

be suitable for determining the acceptability of a group of

boards that were, or will be, produced with the same fabri-

cation processes. (See also ‘‘Capability Test Board.’’)

Test Coupon 92.1820

A portion of quality conformance test circuitry that is used

for a speciﬁc test, or group of related tests, in order to

determine the acceptability of a product.

Test Language 92.1057

A high-level language used to write a test program.

Test Master 92.1058

Artwork that contains speciﬁed anomalies or degrees of

defect that an inspection or testing system should be

capable of detecting.

Test Pattern 92.1059

A pattern that is used for inspection or testing purposes.

Test Point 92.1060

A special point of access to an electrical circuit that is used

for electrical testing purposes.

Test Program 92.1061

The set of instructions to a tester that controls the unit

under test.

Test Set 92.1062

The unique combination of test programs and test ﬁxtures

that control the unit under test.

Test Step 92.1063

The application of a single input vector.

Testing Personnel 92.1056

Those individuals that test products for the purpose of

ascertaining the conformance of a product to applicable

speciﬁcations.

Tetrafunctional Resins 75.1064

Materials that have four reactive groups per molecule.

Thermal Coefficient of Expansion (TCE) 21.1065

see ‘‘Coefficient of Thermal Expansion (CTE).’’

Thermal Conductivity 20.1066

The property of a material that describes the rate at which

heat will be conducted through a unit area of the material

for a given driving force.

Thermal Expansion Mismatch 20.1067

The absolute difference between the thermal expansion of

two components or materials. (See also ‘‘Coefficient of

Thermal Expansion (CTE).’’)

Thermal Relief 22.1068

The crosshatching of a ground or voltage plane that mini-

mizes blistering or warping during soldering operations.

Thermal Shunt 30.1069

see ‘‘Heatsink.’’

Thermal Zone 50.1542

A metal-integrity evaluation zone that extends a speciﬁed

distance beyond the ends of the lands in a microsection of

a vertical portion of a plated-through hole. (Unless other-

wise speciﬁed, the extended distance is 0.08 mm [0.003-

inch].)

Thermocompression Bonding 74.1543

The joining together of two materials without an interme-

diate material by the application of pressure and heat in the

absence of electrical current.

Thermode 75.1070

A contact heating element that is used to generate reﬂow

soldering heat.

Thermoplastic 40.1071

A plastic that can be repeatedly softened and reshaped,

without any signiﬁcant change in inherent properties, by

exposure to heat and hardened by cooling.

Thermoset 40.1544

A plastic that undergoes a chemical reaction when exposed

to elevated temperatures that leads to it having a relatively

infusable or crosslinked stated that cannot be softened or

reshaped by subsequent heating.

Thermosonic Bonding 74.1072

Terminations made by combining thermocompression and

ultrasonic bonding principles.

IPC-T-50F June 1996