IPC-T-50F_.pdf.pdf - 第98页
54.0452 Etch Factor 54.0450 Etchant 54.1389 Etchback 54.0453 Etching 54.1390 Etching Indicator 54.0574 Graded W edge 54.0798 Negative Etchback 54.1294 Shadowing, Etchback 54.0953 Smear Removal 55 Lamination, Sequential D…
51.0211 Chisel-Edge Angle
51.0312 Crazing (Base Material)
51.0407 Drill Body Length
51.0408 Drill Diameter
51.0409 Drill Point Concentricity
51.0446 Epoxy Smear
51.1400 Flare
51.0544 Foil Burr
51.1415 Haloing
51.0597 Heel (Drill)
51.0601 Helix Angle
51.0618 Hook
51.0676 Land (Drill)
51.0679 Land Width (Drill)
51.1223 Land Width Angle (Drill)
51.0684 Layback
51.0712 Lip Height
51.0740 Margin Width (Drill)
51.0794 Nail Heading
51.1457 Open Point
51.1200 Overall Length
51.1229 Overlap (drill)
51.0881 Point Angle
51.0907 Primary Flare
51.0908 Primary Relief
51.0910 Primary Taper
51.1506 Resin Smear
51.1282 Secondary Relief
51.1295 Shank
51.1297 Shank Diameter
51.1296 Shank-to-Drill Body Concentricity
51.0929 Shoulder Angle
51.0998 Splay
51.1155 Web Taper
51.1156 Web Thickness
52 Imaging and Application of Resists and Inks
52.0011 Actinic Radiation
52.0113 Bleeding
52.1701 Definition
52.1448 Negative-Acting Resist
52.0845 Permanent Resist
52.0850 Photographic Layer
52.0856 Photoprint
52.1472 Photoresist
52.0857 Photoresist Image
52.1481 Positive-Acting Resist
52.0914 Printed Component
52.1600 Printed Components, Conductive Inks
52.1592 Printing
52.1508 Resist
52.1254 Reverse Image
52.1204 Screen Printing
52.0937 Silkscreening
52.0947 Skipping
52.1050 Tenting
52.1131 Usable Resolution
53 Metal Deposition Processes, including Plating
53.0002 Accelerator
53.0013 Activating
53.0014 Activating Layer
53.1322 Additive Process
53.0022 Adhesion Promotion
53.0056 Aspect Ratio (Hole)
53.0117 Blow Hole
53.0184 Catalyzing
53.0319 Critical Current Density
53.0426 Electrodeposition
53.0427 Electroless Deposition
53.0428 Electroless Plating
53.0430 Electrolytic Deposition
53.0433 Electroplating
53.0502 Film Network
53.1407 Fully Additive Process
53.0554 Fully-Electroless Process
53.0560 Galvanic Deposition
53.0561 Galvanic Displacement
53.0613 Hole Pull Strength
53.0614 Hole Void
53.0635 Immersion Plating
53.0645 Initiating
53.0656 Interlaminar Metalization
53.0753 Metalization (n.)
53.1199 Outgassing
53.1673 Overplate
53.0827 Panel Plating
53.0840 Pattern Plating
53.0255 Photographic-Reduction Dimension
53.0873 Plating (n.)
53.0874 Plating (v.)
53.0876 Plating Bar
53.1477 Plating Thief
53.0877 Plating Up
53.0875 Plating, Burned
53.0906 Pretinning
53.1261 Robber
53.1286 Seed Layer
53.1285 Seeding
53.1518 Semi-Additive Process
53.1291 Sensitizing
53.0962 Solder Coat
53.1677 Solder Levelling
53.1007 Sputtering
53.1540 Swell-and-Etch Process
53.1088 Tie Bar
53.1549 Treeing
53.1133 Vacuum Evaporation
54 Material Removal Processes, including Etching
54.1318 Abrasive Trimming
54.0010 Acid Number
54.1217 Acid Value
54.1321 Active Trimming
54.0245 Concentration Polarization
54.0248 Conducting Salt
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54.0452 Etch Factor
54.0450 Etchant
54.1389 Etchback
54.0453 Etching
54.1390 Etching Indicator
54.0574 Graded Wedge
54.0798 Negative Etchback
54.1294 Shadowing, Etchback
54.0953 Smear Removal
55 Lamination, Sequential Deposition, and Molding
Processes
55.0130 Bonding Layer
55.0176 Cap Lamination
55.1350 Clad (adj.)
55.1376 Delamination
55.0545 Foil Lamination
55.0566 Gel Time
55.1412 Glass Transition Temperature
55.0672 Laminate (n.)
55.1808 Laminate (v.)
55.0685 Layer-to-Layer Registration
55.1443 Mass Lamination
55.0748 Measling
55.1449 Nominal Cured Thickness
55.0865 Pink Ring
55.1474 Plate Finish, Laminating
55.0898 Pre-finish (n.)
55.0900 Preflow
55.1154 Weave Exposure
55.1565 Weave Texture
56 Thermal Cure/Firing Processes
56.0082 Bake Out
56.0093 Batch Oven
56.0219 Co-Firing
56.0330 Cure
56.0331 Cure Time
56.0332 Curing Agent
56.0508 Fire (v.)
56.0509 Firing Sensitivity
56.0517 Fissuring
56.0557 Fused Coating
56.1676 Fusing
56.0467 Fusing Fluid
56.1408 Fusing Flux
56.1409 Fusing Oil
56.0577 Green Strength
56.0586 Hardeners
56.0593 Heat of Fusion
56.0660 Intumescence
56.0703 Levelling
56.0704 Levelling Flux
56.0705 Levelling Oil
56.0890 Post Curing
56.0902 Preheat (v.)
56.1483 Preheating (v.)
56.1304 Radiant Flux
56.1305 Radiant Intensity
56.1306 Radiator, Focused
56.1307 Radiator, Nonfocused
57 Cleaning and Chemical Treatment Processes
57.0042 Anodic Cleaning
57.0185 Cathodic Cleaning
57.0199 Chemical Conversion Coating
57.0366 Desmear
57.0832 Passivation
57.1009 Stabilization Period
59 Other (Interconnecting Structure Fabrication
Processes)
59.0186 Cation Exchange
59.0187 Cationic Reagent
6 Type and Performance of Interconnecting Structures
60 General (Interconnecting Structure Type and
Performance)
60.1319 Access Hole
60.0041 Annular Ring
60.0084 Bare Board
60.0118 Board
60.0139 Bond Strength
60.1218 Bow (Sheet, Panel, or Printed Board)
60.0148 Breakout
60.0156 Bulge
60.0177 Card
60.0214 Circuit Card
60.0252 Conductor Base Spacing
60.0253 Conductor Base Width
60.1363 Conductor Spacing
60.1364 Conductor Width
60.0402 Double-Sided Printed Board
60.0451 Etched Printed Boards
60.1699 Hole Breakout
60.0707 Lifted Land
60.1227 Multilayer Printed Board
60.0786 Multilayer Printed Circuit Board
60.0788 Multilayer Printed Wiring Board
60.1179 Nick (n.)
60.1181 Nodule
60.0810 One-Sided Board
60.0816 Overhang
60.0823 Packaging and Interconnecting Assembly
60.1461 Packaging and Interconnection Structure
60.1487 Printed Circuit Board
60.1488 Printed Wiring
60.1489 Printed Wiring Board
60.0912 Printed Circuit
60.1485 Printed Board (PB)
60.1490 Production Board
60.1504 Resin Recession
60.0945 Single-Sided Printed Board
60.1013 Stamped Printed Wiring
60.1553 Twist
60.1116 Two-sided Board
60.1147 Warp
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61 Rigid Printed Boards (Organic)
61.1587 Metal Core Printed Board
61.1577 Rigid Double-sided Printed Board
61.1578 Rigid Multilayer Printed Board
61.1571 Rigid Printed Board
61.1576 Rigid Single-sided Printed Board
61.1521 Sequentially-Laminated Multilayer Printed
Board
62 Flexible Printed Boards (Organic)
62.1581 Flexible Double-sided Printed Board
62.1582 Flexible Multilayer Printed Board
62.1579 Flexible Printed Board
62.0525 Flexible Printed Circuit
62.0526 Flexible Printed Wiring
62.1580 Flexible Single-sided Printed Board
63 Flex-Rigid Printed Boards (Organic)
63.1570 Flex-Rigid Double-sided Printed Board
63.0524 Flex-Rigid Printed Board
63.1584 Rigid-Flex Double-sided Printed Board
63.1258 Rigid-Flex Printed Board
64 Discrete Wiring Boards (Organic)
64.0390 Discrete-Wiring Board
64.0391 Discrete-Wiring Board Assembly
67 Hybrid/Multichip Module Interconnecting Structures
67.0818 Overlap (Film)
7 Assembly Processes for Interconnection Structures
70 General (Assembly Process Issues)
70.1731 Bar Code Marking
70.0090 Basic Wettability
70.0149 Bridging, Electrical
70.0239 Component Mounting
70.0279 Contact Resistance
70.0291 Conveyor, Edge
70.0292 Conveyor, Mesh
70.0293 Conveyor, Secondary
70.0435 Elongation
70.1452 Mixed Component-Mounting Technology
70.1757 Mixed Technology
70.1763 Processability
70.1770 Stand-Off
71 Component Handling, Storage and Preparation
71.1762 Preconditioning
71.1541 Taped Component
71.1089 Tinning
71.1146 Waffle Pack
72 Through-Hole Mounting of Components
72.0063 Automated Component Insertion
72.1351 Clinched Lead
72.0217 Clinched-Wire Interfacial Connection
72.1352 Clinched-Wire Through Connection
72.1467 Partially-Clinched Lead
72.1022 Straight-Through Lead
72.1539 Swaged Lead
72.1085 Through-Hole Mounting
73 Surface Mounting of Components
73.1733 Centering Force
73.0406 Drawbridged Component
73.0457 Excising
73.0697 Lead Projection
73.1760 Pick-Up Force
73.1759 Pick-Up Tool
73.1761 Placement Force
73.0951 Slump
73.1001 Spread
73.1012 Staking,Adhesive (v.)
73.1026 Stringing
73.1035 Surface Mounting
73.1093 Tombstoned Component
73.1775 Vacuum Head
74 Bare Chip Placement and Attachment
74.0021 Adhesion Layer
74.0039 Angled Bond
74.0048 Area Array Tape Automated Bonding
74.0055 Aspect Ratio (Film)
74.0073 Back Bonding
74.0079 Back Mounting
74.0083 Ball Bond
74.0085 Barrier Metal
74.0120 Bond
74.0123 Bond Deformation
74.0126 Bond Envelope
74.0125 Bond Enhancement Treatment
74.0133 Bond Interface
74.0134 Bond Land
74.0135 Bond Lift-off
74.0136 Bond Schedule
74.0137 Bond Separation
74.0138 Bond Site
74.0141 Bond Surface
74.0121 Bond-to-Bond Distance
74.0122 Bond-to-Die Distance
74.1342 Bondability
74.0128 Bonding Area
74.0129 Bonding Island
74.0131 Bonding Tool
74.0132 Bonding Wire
74.0127 Bonding, Die
74.0155 Bugging Height
74.0159 Bump (Die)
74.0160 Bumped Die
74.0161 Bumped Tape
74.0162 Bumped Wafer
74.0167 Burn-Off
74.0175 Capillary
74.0189 Centerwire Break
74.1348 Chemisorption
74.0204 Chessman
74.0206 Chip-and-Wire
74.0210 Chisel
74.0212 Chopped Bond
74.1734 Circumferential Thermodes
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