IPC-T-50F_.pdf.pdf - 第57页

Pregelation Particle 92.0901 A white spot in a printed board that will not propagate as the result of a thermal excursion. Preheat (n.) 56.0902 A preliminary phase of a process during which the product is heated at a pre…

Polar Solvent 76.1815

A liquid that is ionized to the extent that it is electrically

conductive, that can dissolve noppolar compounds (such as

hydrocarbons and resins), but cannot dissolve polar com-

pounds (such as inorganic salts).

Polarizing Slot 22.0882

A slot in the edge of a printed board that is used to assure

the proper insertion and location of the board in a mating

connector. (See also ‘‘Keying Slot.’’)

Polymer 40.1479

A compound of high molecular weight that is derived from

either the joining together of many small similar or dis-

similar molecules or by the condensation of many small

molecules by the elimination of water, alcohol, or some

other solvent.

Polymer Reversion 76.1480

The irreversible softening or liquifaction of a polymer as

the result of hydrolysis due to the bombardment of the

polymer with vapor molecules that contain an active

hydroxyl group.

Polymerize 40.0884

To form a polymer or polymeric compound.

Polymerized Rosin 76.0885

Rosin that has reacted with itself during the course of a

soldering operation.

Porosity (Solder) 75.0886

A solder coating with an uneven surface and a spongy

appearance that may contain a concentration of small pin-

holes and pits.

Positional Tolerance 22.0887

The amount that a feature is permitted to vary from its

true-position location.

Positive (n.) 24.0888

An artwork, artwork master, or production master in which

the pattern being fabricated is opaque to light and the other

areas are transparent.

Positive-Acting Resist 52.1481

A resist that is decomposed (softened) by light and which,

after exposure and development, is removed from those

areas of surface that were under the transparent areas of a

production master.

Post 37.0889

see ‘‘Terminal.’’

Post Curing 56.0890

Heat aging in order to stabilize material through stress

relieving.

Postprocessing 25.0891

Manipulating data after it has been generated or run

through a batch process.

Postprocessor 25.1482

A software procedure or program that interprets data and

formats it into data that is readable by a numerically-

controlled machine or by other computer programs.

Potting Compound 47.0892

A material, usually organic, that is used for the encapsula-

tion of components and wires.

Power of Source 24.0896

see ‘‘Radiant Intensity’’

Power Plane 22.0897

see ‘‘Voltage Plane.’’

Power Dissipation 21.0893

The energy used by an electronic device in the perfor-

mance of its function.

Power Factor 21.0894

The cosine of the angle of phase difference between current

and the voltage applied.

Power of Experiment 91.0895

The probability of rejecting the results of the null hypoth-

esis when it is false and of accepting the alternative

hypothesis when it is true.

Power Plane Inductance 21.1804

The ractive component inductance, in response to AC

noise, seen on a DC backplane system.

Preconditioning 71.1762

Preparation of a component or assembly for processing or

testing.

Preferred Solder Connection 75.0899

A solder connection that is smooth, bright, and feathered-

out to a thin edge in order to indicate proper solder ﬂow

and wetting action. Also no bare metal is exposed within

the solder connection and there are no sharp protrusions of

solder or the evidence of contamination, e.g., embedded

foreign material.

Pre-finish (n.) 55.0898

A coupling agent that is applied on a ﬁber in order to

improve compatibility with resins.

Preflow 55.0900

see ‘‘Stabilization Period.’’

IPC-T-50F June 1996

Pregelation Particle 92.0901

A white spot in a printed board that will not propagate as

the result of a thermal excursion.

Preheat (n.) 56.0902

A preliminary phase of a process during which the product

is heated at a predetermined rate from ambient temperature

to a desired elevated temperature.

Preheating (v.) 56.1483

The raising of the temperature of a material(s) above the

ambient temperature in order to reduce the thermal shock

and to inﬂuence the dwell time during subsequent elevated-

temperature processing.

Preimpregnated Bonding Sheet 41.0903

see ‘‘Prepreg.’’

Prepreg 41.0904

A sheet of material that has been impregnated with a resin

cured to an intermediate stage, i.e., B-staged resin.

Pressfit Contact 37.0905

An electrical contact that can be pressed into a hole in an

insulator or printed board with or without plated-through

holes.

Pretinning 53.0906

see ‘‘Tinning’’

Primary Flare 51.0907

A condition whereby the drill’s primary relief is wider at its

periphery than it is at its center. (See Figure P-2.)

Primary Stage of Manufacture 92.0909

That time during the manufacturing of a product when it is

ready for inspection prior to shipment.

Primary Relief 51.0908

The clearance angle at the outer corner of the cutting edge

of the cutting edge of a drill point.

Primary Side 22.1484

The side of a packaging and interconnecting structure that

is so deﬁned on the master drawing. (It is usually the side

that contains the most complex or the most number of

components.)

Primary Taper 51.0910

A condition whereby the primary relief is wider at the cen-

ter of a drill than it is at the periphery. (See Figure P-3.)

Printed Board (PB) 60.1485

The general term for completely processed printed circuit

and printed wiring conﬁgurations. (This includes single-

sided, double-sided and multilayer boards with rigid, ﬂex-

ible, and rigid-ﬂex base materials.)

Printed Board Assembly 80.0911

The generic term for an assembly that uses a printed board

for component mounting and interconnecting purposes.

Printed Board Assembly Drawing 26.1486

The document that shows a printed board, separately

manufactured components, and any information necessary

to describe the joining of them together in order to perform

a speciﬁc function.

Printed Circuit 60.0912

A conductive pattern that is composed of printed compo-

nents, printed wiring, discrete wiring, or a combination

thereof, that is formed in a predetermined arrangement on

a common base. (This is also a generic term that is used to

describe a printed board that is produced by any of a num-

ber of techniques.)

Printed Circuit Board 60.1487

Printed board that provides both point-to-point connections

and printed components in a predetermined arrangement on

a common base. (See also ‘‘Printed Wiring Board.’’)

Printed Circuit Board Assembly 80.0913

An assembly that uses a printed circuit board for compo-

nent mounting and interconnecting purposes.

IPC-I-002325

Figure P–2 Primary ﬂare

Primary Flare

▼

IPC-I-002324

Figure P–3 Primary taper

Primary Taper

▼

June 1996 IPC-T-50F

Printed Component 52.0914

A part (such as an inductor, resistor, capacitor, or transmis-

sion line) that is formed as part of the conductive pattern

of a printed board.

Printed Components, Conductive Inks 52.1600

Component (e.g. printed inductor, resistor, capacitor or

transmission line) forming part of the pattern of a printed

circuit.

Printed Contact 22.0915

A portion of a conductive pattern that serves as one part of

a contact system.

Printed Edge-Board Contact 22.0916

see ‘‘Edge-Board Contact.’’

Printed Wiring 60.1488

A conductive pattern that provides point-to-point connec-

tions but not printed components in a predetermined

arrangement on a common base. (See also ‘‘Printed Cir-

cuit.’’)

Printed Wiring Board 60.1489

A printed board that provides point-to-point connections

but not printed components in a predetermined arrange-

ment on a common base. (See also ‘‘Printed Circuit

Board.’’)

Printed Wiring Board Assembly 80.0917

An assembly that uses a printed wiring board for compo-

nent mounting and interconnecting purposes.

Printing 52.1592

Act of reproducing a pattern on a surface by any process.

Probe Point 92.0919

The predetermined location on a printed board where elec-

trical contact can be made to exposed circuitry for electri-

cal diagnostic purposes.

Probe, Test 92.0918

A spring-loaded metal device used to make electrical con-

tact between a test equipment and the unit under test.

Process Average 91.0920

The location of the distribution of measured values of a

particular process characteristic.

Process Indicator 91.0921

A detectable anomaly, other than a defect, that is reﬂective

of material, equipment, personnel, process and/or work-

manship variations.

Process Spread 91.0922

The extent to which the individual values of a process may

vary.

Processability 70.1763

Suitable and capable of being processed.

Producer’s Risk 93.0923

see ‘‘Alpha Error.’’

Production Board 60.1490

A printed board or discrete-wiring board that has been

manufactured in accordance with the applicable detailed

drawings, speciﬁcations, and procurement requirements.

Production Master 24.1642

A 1 to-1 scale pattern that is used to produce rigid or ﬂex-

ible printed boards within the accuracy speciﬁed on the

master drawimg. (See also ‘‘Multiple-image Production

Master’’ and ‘‘Single Image Production Master’’).

Production Panel (PP) 50.1787

An arrangement of printed boards fabricated from laminate

or base materials as a group in a speciﬁc cluster to facili-

tate economic fabrication techniques using controlled and

documented chemical, mechanical and electrical processes.

Production Printed Board (PPB) 50.1786

A printed board fabricated from laminate or base materials

in an environment that consists of controlled and docu-

mented chemical, mechanical and electrical processes used

in combination to produce the features and characteristics

of the ﬁnal printed board product.

Profile Factor 92.1492

The amount by which the overall average thickness of a

metal exceeds the thickness that is calculated from the

established density of the metal and the area of the sample.

Propagation Delay 21.1493

The time required for an electronic signal to travel along a

transmission line, or the time required for a logic device to

perform its function and to present a signal at its output.

Proportional Dimensions 92.0924

The distortion of an optical system used in a magnification

device.

Pull Strength 92.0925

see ‘‘Bond Strength.’’

Pull-Out Strength 97.1816

The force, normal to the printed board, required to seperate

the metallic wall of a plated-through hole from the base

material.

Pulse, Electronic Signal 21.1494

A logic signal that switches from one digital state to the

other and back again in a short period of time, and that

remains in the original state for most of the time

IPC-T-50F June 1996