IPC-T-50F_.pdf.pdf - 第32页

Fiducial Mark 22.0493 A printed board artwork feature (or features) that is created in the same process as the conductive pattern and that pro- vides a common measurable point for component mounting with respect to a lan…

F Ratio 93.0552

The ratio of one variance value to another.

Face Bonding 74.0469

Attaching a die to a base material with its circuitry facing

the base material.

Factorial Experiment 94.0470

An experimental design that evaluates every possible com-

bination of events.

False Alarm 92.0471

An anomaly identiﬁed by an inspection system that is not

a critical defect.

False Alarm Rate 92.0472

The ratio of the number of acceptable items detected to the

total number inspected, expressed as a percentage.

Far-End Crosstalk 21.0473

see ‘‘Forward Crosstalk.’’

Fatigue Life 96.0474

The number of cycles of stress that can be sustained prior

to failure for a stated test condition.

Fatigue Limit 96.0475

The maximum stress below which a material can presum-

ably endure an inﬁnite number of stress cycles.

Fatigue Strength 96.1394

The maximum strength that can be sustained for a speciﬁc

number of cycles without failure, with the stress being

completely reversed within each cycle unless otherwise

stated.

Fatigue-Strength Reduction Factor (Kf) 96.1395

The ratio of the fatigue strength of a member or specimen

with no stress concentration to the fatigue strength with

stress concentration.

Fatty Acid 76.0476

A carboxylic acid derived from, or contained in, an animal

or vegetable fat or oil.

Fatty Ester 76.0477

A fatty acid with the active hydrogen replaced by the alkyl

group of a monohydric alcohol.

Fault 90.0478

Any condition that causes a device or circuit to fail to

operate in a proper manner.

Fault Dictionary 90.0479

A list of elements in which each element consists of a fault

signature that can be used to detect a fault.

Fault Isolation 92.0480

The identiﬁcation process used to determine the location of

a fault to within a small number of replaceable compo-

nents.

Fault Localization 91.0481

The identiﬁcation process used to determine the location of

a fault to within a general area of a circuit.

Fault Masking 92.0482

A condition that occurs when one fault conceals the exist-

ence of another.

Fault Modes 92.0483

The various ways faults may occur.

Fault Resolution 92.0484

A measure of the capability of a test process to perform

failure isolation.

Fault Signature 92.0485

The characteristic, unique erroneous response produced by

a speciﬁc fault.

Fault Simulation 92.1396

A process that allows for the prediction or observation of a

system’s behaviour in the presence of a speciﬁc fault with

actually having that fault occur.

FCC System 37.0486

A complete ﬂat-conductor cabling system that is suitable

for installation under carpet squares. (See ‘‘Flat Cable.’’)

Feather Length 44.0487

The distance from the last warp end of a fabric to the end

of the pick.

Feature 22.0488

The general term that is applied to a physical portion of a

part, such as a surface, hole or slot.

Feature Window 74.0491

An opening in the insulation material of a carrier tape that

allows for the creation and bonding of separated leads.

Feature-Based Modeling 21.0489

A computer-based modeling method that is based on the

use of part features instead of geometric entities.

Feature-Location Record 25.0490

A type of record that deﬁnes lines, points, and annotations.

Fiber Exposure 91.0492

The exposure of reinforcing ﬁbers that are within

machined, abraded, or chemical-attacked areas of a base

material. (See also ‘‘Weave Exposure.’’)

June 1996 IPC-T-50F

Fiducial Mark 22.0493

A printed board artwork feature (or features) that is created

in the same process as the conductive pattern and that pro-

vides a common measurable point for component mounting

with respect to a land pattern or land patterns.

Field Trimming 77.0494

The adjusting of the value of a resistor in order to modify

a circuit output voltage or current.

Filiform Corrosion 76.0495

Corrosion that develops under organic coatings on metals

in the form of randomly distributed ﬁne hairlines that are

usually curved, wavy, or coiled.

Fill 44.0496

Yarns that are woven in a crosswise direction of a fabric.

Filler 44.0497

A substance that is added to a material to improve its solid-

ity, bulk, or other properties.

Fillet, Adhesive 75.0498

The portion of an adhesive that ﬁlls the corner, or the angle

formed, where two adherends are joined.

Fillet, Solder 75.0499

see ‘‘Solder Fillet.’’

Film 45.0500

Single or multiple layers of material used to form hybrid

circuit elements, interconnections, and crossovers. (See

also ‘‘Thin Film’’ and ‘‘Thick Film.’’)

Film Conductor 45.0501

A conductor formed in place on a base material by depos-

iting a conductive material using screening, plating or

evaporating techniques.

Film Network 53.0502

An electrical network composed of thin-ﬁlm and/or thick-

ﬁlm components on a base material.

Final Seal 76.1397

The manufacturing process that completes the enclosure of

a microcircuit so that further internal processing cannot be

performed without removing a lid or otherwise disassem-

bling the package.

Fine Leak 95.0504

A leak in a sealed package that is less than 0.00001 cubic

centimeters per second at one atmosphere of differential air

pressure.

Fine-Pitch Technology (FPT) 80.0503

A surface-mount assembly technology with component ter-

minations on less than 0.625-mm (0.025-inch) centers.

Fingers 22.0505

see ‘‘Edge-Board Contacts.’’

Finished Fabric 44.0506

A fabric that has been treated in order to aid its compatibil-

ity with resins.

Finite-Element Analysis (FEA) 21.1398

A computer-based analysis method that subdivides geomet-

ric entities into smaller elements and links a series of equa-

tions to each element so that they can then be analyzed

simultaneously.

Finite-Element Modeling (FEM) 21.0507

The use of a model to represent a problem that can be

evaluated by ﬁnite-element analysis.

Fire (v.) 56.0508

To heat a circuit so that its thick-ﬁlm components are trans-

formed into their ﬁnal form.

Firing Sensitivity 56.0509

The percentage change of ﬁlm component characteristics

caused by a change in peak ﬁring temperature, expressed as

percent per degree centigrade.

First Article 91.0511

A part or assembly that has been manufactured prior to the

start of a production run for the purpose of ascertaining

whether or not the manufacturing processes used to fabri-

cate it are capable of making items that will meet all appli-

cable end-product requirements.

First Bond 74.0512

The initial termination in a sequence of bonds made to

form a conductive path. (See also ‘‘Second Bond.’’)

First Radius 74.0513

The radius of the front edge of a bonding-tool foot.

First Search 74.0514

The moment at which the ﬁnal adjustment is made in the

location of the bonding area under the bonding tool prior

to making the ﬁrst bond.

First-Pass Yield 91.0510

The statistical average of the number of ﬁnished units in a

group that pass all tests without any rework, expressed in

percent.

Fish Eye 44.0516

A small area of a fabric that resists resin wetting that can

be caused by the resin system, fabric and treating.

Fishbone Diagram 91.0515

see ‘‘Cause-and-Effect Diagram.’’

IPC-T-50F June 1996

Fissuring 56.0517

The cracking of a conductor or dielectric material caused

by stresses occuring during ﬁring.

Fixed Contact 37.0518

A type of connector contact that is permanently retained

within the connector body or insert.

Fixed-Effect Model 91.1399

A speciﬁc experimental treatment whereby the conclusions

reached apply only to the factor levels considered in the

analysis and the interferences are restricted to the experi-

mental levels. (See also ‘‘Random-Effects Model.’’)

Fixture, Test 92.0519

A device that interfaces between test equipment and the

unit under test.

Flag 74.0520

The support area on a die or lead frame.

Flame-Off 74.0521

The use of a ﬂame to severe a wire and to form a ball for

the next ball-bonding termination.

Flare 51.1400

The undesirable enlarged and tapered area around a

punched hole that is on the side of the material through

which the punch exited during hole formation. (See Figure

F-1.)

Flash Distillation 76.1401

Distillation in which an appreciable proportion of liquid is

quickly converted to a vapor in such a way that the ﬁnal

vapor is in equilibrium with the ﬁnal liquid.

Flat Cable 37.0522

Two or more parallel, round or ﬂat, conductors that are

contained in the same plane of a ﬂat insulating base mate-

rial.

Flat Conductor 40.1800

A rectangular conductor that is wider than it is high.

Flat Pack 33.0523

A rectangular component package that has a row of leads

extending from each of the longer sides of its body that are

parallel to the base of its body.

Flex-Rigid Double-Sided Printed Board 63.1570

See ‘‘Rigid-ﬂex Double-sided Printed Board’’

Flex-Rigid Printed Board 63.0524

see ‘‘Rigid-Flex Printed Board.’’

Flexible Double-Sided Printed Board 62.1581

Double-sided printed board, either printed circuit or printed

wiring, using a ﬂexible base material only.

Flexible Multilayer Printed Board 62.1582

Multilayer printed board, either printed circuit or printed

wiring, using ﬂexible base materials only. Different areas

of the ﬂexible multilayer printed board may have different

number of layers and thicknesses.

Flexible Printed Board 62.1579

A printed board using a ﬂexible base material only. May be

partially provided with electrically non-functional stiffen-

ers and/or cover lay.

Flexible Printed Circuit 62.0525

A patterned arrangement of printed circuitry and compo-

nents that utilizes ﬂexible base material with or without

ﬂexible cover lay.

Flexible Printed Wiring 62.0526

A patterned arrangement of printed wiring that utilizes

ﬂexible base material with or without ﬂexible cover lay.

Flexible Single-Sided Printed Board 62.1580

Single-sided printed board, either printed circuit or printed

wiring, using ﬂexible base materials only.

Flexural Failure 91.0527

A failure that is caused by the repeated ﬂexing of a mate-

rial.

Flexural Strength 44.0528

The tensile strength of the outermost ﬁber of a material that

is being bent.

Flip Chip 74.0530

A leadless monolithic, circuit element structure that electri-

cally and mechanically interconnects to a base material

through the use of conductive bumps.

Flip-Chip Mounting 74.0529

The mounting and interconnecting of a ﬂip chip component

to a base material.

IPC-I-001030

Figure F–1 Flare

Flare

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June 1996 IPC-T-50F