IPC-T-50F_.pdf.pdf - 第82页
—R— RAM Random Access Memory RFI Radio-Frequency Interference RFP Request for Proposal RFS Regardless of Feature Size RISC Reduced Instruction Set Computing RMS Root Mean Square ROM Read Only Memory RPM Revolutions Per M…
LCCC Leadless Ceramic Chip Carrier
LDA Logic Design Automation
LED Light-Emitting Diode
LIF Low Insertion Force
LMC Least Material Condition
LRU Lowest Replaceable Unit
LSI Large Scale Integration (Integrated Circuit)
—M—
MA Mechanical Advantage
MAC Maximum Allowable Concentration
MAP Manufacturing Automation Protocol
MATS Material Transport Segment
MCAD Mechanical Computer Aided Design
MCAE Mechanical Computer-Aided Engineering
MCM Multichip Module
MDA Methylenedianiline
MEK Methyl-Ethyl Ketone
MELF Metal Electrode Face (Discrete Leadless
Component)
MIBK Methyl-Isobutyl Ketone
MIR Moisture Insulation Resistance
MITI Ministry of International Trade and Industry
(Japan)
MLPWB Multilayer Printed Wiring Board
MMC Maximum Material Condition
MOS Metal-Oxide Semiconductor
MRP Material Requirement Planning
MRP II Manufacturing Resource Planning
MSI Medium Scale Integration (Integrated Circuit)
MTBF Mean Time Between Failures
MTTR Mean Time To Repair
—N—
NADCAP
National Aerospace and Defense Contractors
Accreditation Procedures
NASA National Aviation and Space Administration
NBR Nitrile Butadiene-Acrylonitrile Rubber
NBS National Bureau of Standards
NC Numerical Control
NDT Non-Destructive Testing
NECQ National Electronics Component Qualification
System
NEMA National Electrtical Manufacturers Association
NIST National Institute for Science and Technology
NMR Normal-Mode Rejection
NSA National Secutity Agency
—O—
OEM Original Equipment Manufacturer
OFHC Oxygen-Free High-Conductivity Copper
OLB Outer-Lead Bonding (TAB)
OSHA Occupational Safety Hazards Act
OSI Open Systems Interconnection
—P—
P&IA Packaging and Interconnecting Assembly
P&IS Packaging and Interconnecting Structure
PBX Private Branch Exchange
PC Personal Computer
PCB Printed Circuit Board
PDES Product Data Exchange Specification
PDL Page Description Language
PGA Pin Grid Array (Leaded Component Package)
PHIGS Programmer’s Hierarchical Interface Graphics
Standard
PLCC Plastic Leaded Chip Carrier
PLD Programmable Logic Device
PPM Parts Per Million
PPS Polyphenylene Sulfide (Plastic)
PRT Planar Resistor Technology
PSI Pounds Per Square Inch
PT Positional Tolerance
PTFE Polytetrafluoroethylene (Teflon)
PTH Plated-Through Hole
PVC Polyvinyl Chloride
PWA Printed Wiring Assembly
PWB Printed Wiring Board
—Q—
QML Qualified Manufacturers List
QPL Qualified Products List
QTA Quick Turn Around
June 1996 IPC-T-50F
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—R—
RAM Random Access Memory
RFI Radio-Frequency Interference
RFP Request for Proposal
RFS Regardless of Feature Size
RISC Reduced Instruction Set Computing
RMS Root Mean Square
ROM Read Only Memory
RPM Revolutions Per Minute
RwoH Reliability without Hermeticity
—S—
SAE Society of Automotive Engineers
SEM Scanning Electron Microscope
SEM Standard Electronic Module (Navy)
SIP Single Inline Package
SIR Surface Insulation Resistance
SMD Surface Mount Device
SMEMA Surface Mount Equipment Manufacturers
Association
SMOBC Solder Mask Over Bare Copper
SMT Surface Mounting Technology
SNA Systems Network Architecture
SOIC Small-Outline Integrated Circuit
SOS Silicon-on-Sapphire
SPC Statistical Process Control
SPICE Simulation Program, Integrated Circuit Empha-
sis
SQC Statistical Quality Control
SQL Structured Query Language
SSI Small-Scale Integration (Integrated Circuit)
STEP Standard for Exchange of Product Model Data
—T—
TAB Tape-Automated Bonding
TCE Thermal Coefficient of Expansion
TCR Temperature Coefficient of Resistance
TDR Time-Domain Reflectometry
TEM Transverse Electromagnetic Mode
TFA Tree-based Floorplanning Algorithm
TFE Tetrafluoroethylene (Teflon)
Tg Glass Transition Temperature
THT Through-Hole Technology
TIFF Tagged Image File Format
TO Transistor Outline
TOP Technical and Office Protocol
TP True Position
TTL Transistor-Transistor Logic
—U—
UHF Ultra-High Frequency
UL Underwriter’s Laboratories
ULSI Ultra-Large Scale Integration (Integrated Cir-
cuit)
—V—
VAR Value-Added Reseller
VHDL VHSIC Hardware Description Language
VHF Very-High Frequency
VHSIC Very-High Speed Integrated Circuits
VLSI Very-Large Scale Integration (Integrated Circuit)
VME Versa-Module Electronic
VSAG VHDL Standardization and Analysis Group
(IEEE)
—W—
WIP Work In Process
WSI Wafer-Scale Integration
WYSIWYG What You See Is What You Get
—Z—
ZAF Z-Axis Adhesive Film
ZIF Zero-Insertion Force
ZIP Zigzag Inline Package
IPC-T-50F June 1996
78
Appendix B
Principles and Use of the Classification Code
Definitions of Classification Code Descriptors for catego-
rizing of Terms and Definitions needed to describe Man-
agement, Design, Fabrication, Assembly and Testing issues
of electronic printed board assemblies.
BACKGROUND
The Classification Code (CC) used in this Publication
builds on the principles of widely acknowledged concepts
that have been Internationally accepted. The CC allows for
the arrangement of terms according to various topics
related to the elements and practices needed to produce
electronic products.
Specifically intended to accommodate Interconnecting
Structure design, fabrication, assembly and test, the pri-
mary emphasis is on Printed Board and Printed Board
Assembly products used in Electronic Packaging disci-
plines. Also included are the terminology for the processes,
the materials, and component descriptions, along with busi-
ness administration issues, necessary to adequately define
the products and services being performed.
There are nine Segments to the classification code. These
are:
1. Administration
2. Engineering and Design for Electronic Packaging
3. Components for Electronic Packaging
4. Materials for Electronic Packaging
5. Fabrication Processes for Interconnecting Structures
6. Types and Performance of Interconnecting Structures
for Electronic Packaging
7. Assembly Processes for Interconnecting Structures
8. Types and Performance of Interconnecting Structure
Assemblies for Electronic Packaging
9. Quality and Reliability for Electronic Packaging,
Fabrication and Assembly
The first part of the Classification Code consists of three
digits which are available for categorizing terminology and
information related to the nine segments. The first digit
describes the classification code segment as outline above;
the second digit is for a particular topic within a segment,
and the third digit is not standardized and is optional for
users of the system or specification developers allowing for
more detailed apportionment of a topic. Thus, a Classifica-
tion Code of ‘‘44X’’ would signify:
4.. Segment (Materials for Electronic Packaging)
.4. Topic (Reinforcement/Constraining Core/Heat Dis-
sipation Materials)
..X Optional
The second part of the CC numbering scheme is a four
digit unique identification number that is assigned to a spe-
cific term and its definition. These numbers are assigned in
sequence of need, starting with the number 0001. Terms are
assigned to a Segment and Topic without duplication of the
unique identification number. If a general term is used in
the industry which can be applied to more than one Topic
or Segment, the definition shall be enhanced to make it
clear that the term belongs to only one Segment Topic.
An example is the term ‘‘void.’’ This term might have three
unique numbers and definitions. One is for a void in
printed board laminate, one is for a void in artwork emul-
sion, and one is for a void in a solder joint.
The number assigned to each term in IEC publication 194
shall be designated by the two digit Segment/Topic
descriptor, followed by a period (.), followed by a four
digit number that is assigned as the unique descriptor for
each term; i.e., 44.0173, 56.2574 etc.
Wherever possible, if a term is applicable in several areas
it is assigned to the two digit general topic designator (i.e.
20,30).
The system has the capability for identifying almost ten
thousand terms and their definitions. If the number is
exceeded at some time in the future, the four digit field will
be increased by one digit by adding a zero (0) at the front
of each existing number.
The following paragraphs describe the standardized Classi-
fication Codes:.
1. ADMINISTRATION
10. GENERAL (ADMINISTRATION ISSUES)
Contains general terms needed to describe administrative
functions that cross many boundaries in running a com-
pany, managing a product, or supervising a process.
11. DATA PROCESSING
Contains terms related to software and hardware used in
processing data that fall under administrative responsibility
and/or functions.
12. PERSONNEL
Contains terms dealing with personnel issues and includes
such items as industrial medicine, safety, benefits, care, etc.
13. FACILITIES
Contains terms related to the building or plant performing
electronic packaging functions. Included are the require-
ments for utilities such as light, temperature/humidity con-
trol, sprinklers, etc. and any office equipment necessary for
the administration of the site operation.
June 1996 IPC-T-50F
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