IPC-T-50F_.pdf.pdf - 第69页
Specification Drawings 26.1532 A document that shows the dimensional limits that are applicable to any or all parts of a component and any other information that is necessary to describe the product to be fabricated. Spe…
Solder Spread Test 92.1819
The determination of a relative measure of solder flux effi-
ciency that is obtained by determining the area of spread of
a specified weight of solder that has been placed on a spe-
cially prepared and fluxed metallic surface.
Solder Sputter 75.0979
Extraneous fragments of solder with an irregular-shape.
Solder Terminal 37.0980
An electrical/mechanical connection device that is used to
terminate a discrete wire or wires by soldering. (See also
‘‘Bifurcated Solder Terminal,’’ ‘‘Cup Solder Terminal,’’
‘‘Hook Solder Terminal,’’ ‘‘Perforated (Pierced) Solder
Terminal,’’ and ‘‘Turret Solder Terminal.’’)
Solder Webbing 75.0981
A continuous film or curtain of solder that is parallel to, but
not necessarily adhering to, a surface that should be free of
solder.
Solder Wicking 75.0982
The capillary movement of solder between metal surfaces,
such as strands of wire.
Solderability 75.0958
The ability of a metal to be wetted by molten solder.
Soldering 75.0968
The joining of metallic surfaces with solder and without
the melting of the base material.
Soldering Flux 75.0970
see ‘‘Flux.’’
Soldering Iron 75.1768
Common name for a tool which is used to heat components
and to reflow solder.
Soldering Iron Tip 75.0971
The portion of a soldering iron that is used for the applica-
tion of the the heat that melts the solder.
Soldering Oil (Blanket) 75.1529
Liquid formulations that are used in intermix wave solder-
ing and as coverings on static and wave soldering pots in
order to eliminate dross and to reduce surface tension dur-
ing the soldering operation.
Soldering-Ability 75.0969
The ability of a specific combination of components to
facilitate the formation of a proper solder joint.
Solderless Wrap 75.1530
The connecting of a solid wire to a square, rectangular, or
V-shaped terminal by tightly wrapping a solid-conductor
wire around the terminal with a special tool.
Solid-State Bond 74.0983
see ‘‘Diffusion Bond.’’
Solid-Tantalum Chip Component 32.0984
A capacitor in a leadless package whose dielectric material
is solid tantalum.
Solvent 76.0985
A non-reactive liquid substance that is capable of dissolv-
ing another substance.
Solvent Cleaning 76.0986
The removal of organic and inorganic soils using a blend
of polar and nonpolar organic solvents.
Solvent Extraction 76.1531
The removal of one or more components from a liquid
mixture by intimate contact with a second liquid that is
nearly insoluble in the first liquid and which dissolves the
impurities and not the substance that is to be purified.
Solvent Pop 76.0987
Blistering caused by entrapped solvent.
Solvent Release 76.0988
The ability to permit solvents to evaporate.
Solvent Wash 76.0989
see ‘‘Solvent Cleaning.’’
Spacing 22.0990
see ‘‘Center-to-Center Spacing,’’ ‘‘Conductor Spacing,’’
‘‘Edge Spacing,’’ and ‘‘Pitch.’’
Spade Contact 37.0992
A type of male connector contact that consists of flat metal
that mates with a fork contact.
Spalling 97.0993
The chipping, fragmenting or separation of a surface coat-
ing, or the cracking, breaking or splintering of materials,
due to heat.
Span 22.0994
The distance from the reference edge of the first conductor
in a group of parallel conductors to the reference edge of
the last conductor in the group.
Special Cause 91.0995
A source of variation that is intermittent, unpredictable, or
unstable that affects only some of the individual values of
process output.
Specific Solderability 75.0997
The ease with which a metal or alloy can be wetted under
specific conditions.
IPC-T-50F June 1996
64
Specification Drawings 26.1532
A document that shows the dimensional limits that are
applicable to any or all parts of a component and any other
information that is necessary to describe the product to be
fabricated.
Specification Limits 91.0996
The requirements for judging acceptability of a particular
characteristic.
Specimens 92.1769
Samples of a material, device or circuit, representative of
the production lot, which are selected for testing.
Splay 51.0998
The tendency of a rotating drill bit to make off-center, out-
of-round, holes that are not perpendicular to the drilling
surface.
Split (Fabric) 44.0999
An opening in a fabric that results from having either the
pick or end breaking in two.
Spotting Out 96.1000
The delayed appearance of spots and blemishes on plated
or finished surfaces.
Spread 73.1001
The distance of a substance, e.g., adhesive, moves after it
has been applied at ambient conditions.
Spread (Values) 91.1002
A general concept for the extent by which values in a dis-
tribution differ from one another.
Sprocket 74.1003
A perforation along the edge of a carrier tape that is used
to move and align the tape during the tape fabrication,
assembly, and testing operations.
Spur 24.1004
An undesirable clear projection from a clear photographic
pattern or a dark projection from a dark pattern photo-
graphic.
Spurious Metal 92.1005
see ‘‘Extraneous Metal.’’
Spurious Signal 21.1006
see ‘‘Crosstalk.’’
Sputtering 53.1007
The removal of atoms from a plasma source by energetic
ion bombardement and their subsequent deposition as a
thin film on a base material.
Stability 91.1008
The absence of special causes of variation.
Stabilization Period 57.1009
The period of time in the reflow profile after preheat and
before the reflow spike occurs where the temperature of the
metals being joined are allowed to equalize.
Stable Process 91.1010
A process that is in statistical control.
Stain Proofing 76.1011
The retardation of the oxidation of a metal surface.
Staking, Adhesive (v.) 73.1012
The bonding or attaching of components, or component
elements, to a surface or together by the application of
small quantities of adhesive material.
Staking, Mechanical 75.1533
The attaching of metallic devices, such as solder terminals
and eyelets, by the upsetting of the portion of the device
that protrudes through a hole in a base material.
Stamped Printed Wiring 60.1013
Wiring that is produced by die stamping and bonding a
metal foil to a base material.
Stand-Off 70.1770
A post or protrusion used to facilitate raising a surface
mounting device above the surface of the substrate.
Standard Deviation of a Population 91.1534
A measure of the distribution of a population about a mean
value that is equal to the square root of the variance of a
process output. (See also ‘‘Sigma.’’)
Standard (Electrode) Potential 76.1535
The reversible potential from an electrode process when all
products and reactants are at unit activity on a scale in
which the potential for a standard hydrogen half-cell is
zero.
Standoff Solder Terminal 37.1014
see ‘‘Turret Solder Terminal.’’
Statistical Control 91.1015
The condition of describing a process from which all spe-
cial causes of variation have been eliminated and, thereby,
only common causes remain.
Statistical Hypothesis 91.1016
An assumption that is made about a population being
sampled. (See also ‘‘Alternative Hypothesis’’ and ‘‘Null
Hypothesis.’’)
June 1996 IPC-T-50F
65
Statistical Process Control (SPC) 91.1536
The use of statistical techniques to analyze a process or its
output so as to be able to take appropriate action in order
to achive and maintain a state of statistical control and to
improve process capability.
Statistical Quality Control (SQC) 91.1017
The use of statistical techniques to document and assure
end product compliance with requirements.
Step Scale 24.1537
A series of regularly-spaced tones that range from black,
through intermediate shades of gray, to white that is used
as a reference scale for exposure control in a photo-
fabrication process.
Step Soldering 75.1019
The making of solder connections by sequentially using
solder alloys with successively-lower melting tempera-
tures.
Step Wedge 24.1020
see ‘‘Step Scale.’’
Step-and-Repeat 24.1018
The successive exposure of a single image in order to pro-
duce a multiple-image production master.
Stitch Bond 74.1021
A bond made with a capillary-type bonding tool whereby
the wire is not formed into a ball prior to bonding.
Straight-Through Lead 72.1022
A component lead that extends through a hole and is termi-
nated without subsequent forming.
Strain Relief (Connector) 37.1023
A receptacle connector device that prevents the disturbance
of the contact and cable terminations.
Stress Corrosion Cracking 95.1024
Spontaneous cracking produced by the combined action of
corrosion and residual or applied static stress.
Stress Relief 36.1025
The portion of a component lead or wire lead that is
formed in such a way as to minimize mechanical stresses
after the lead is terminated.
Stringing 73.1026
The forming of a ‘‘tail’’ of adhesive as the dispensing tool
pin or needle is withdrawn from the deposited adhesive.
Stripback 44.1027
Broken filaments along a yarn strand that are pushed back
and protrude above the fiber plane.
Stripline 21.1028
A transmission-line configuration that consists of a conduc-
tor that is positioned equidistant between, and parallel to,
ground planes with a dielectric among them.
Structurally-Similar Construction 90.1029
Material combinations and materials whose construction
details will not affect test results at the primary stage of
manufacture.
Stub 21.1030
A branch of the main signal line of a signal net that is usu-
ally used to reach a load that is not on the direct signal
path.
Stud-Mount Termination 30.1031
see ‘‘Straight-Through Lead.’’
Subgroup 91.0140
A subset of a population that is analyzed dependently in
order to eliminate assignable causes of variation.
Subnet 21.1206
A single source and a single target point that, together with
associated vias, lands, and preplaced items, are completely
connected by route segments within one net.
Substrate 41.1207
see ‘‘Base Material.’’
Substrate Bending Test 92.1771
A test applied to a substrate to determine its resistance to
bending and the effects of bending to the substrate and any
components mounted on the substrate.
Subsurface Corrosion 96.1208
Formation of isolated particles of corrosion products
beneath a metal surface.
Subtractive Process 50.1209
The fabricating of a conductive pattern by the selective
removal of unwanted portions of a conductive foil.
Sum of Squares 91.1210
The variation contributed by a factor. (See also ‘‘Pure Sum
of Squares.’’)
Support Ring 36.1033
Dielectric material that is used to hold beam leads in place
relative to one another outside of a packaged device.
Supported Hole 22.1211
A hole in a printed board that has its inside surfaces plated
or otherwise reinforced.
IPC-T-50F June 1996
66