IPC-T-50F_.pdf.pdf - 第97页
51.021 1 Chisel-Edge Angle 51.0312 Crazing (Base Material) 51.0407 Drill Body Length 51.0408 Drill Diameter 51.0409 Drill Point Concentricity 51.0446 Epoxy Smear 51.1400 Flare 51.0544 Foil Burr 51.1415 Haloing 51.0597 He…
44.0146 Bow (Fabric)
44.0273 Constraining Core
44.0298 Coronizing
44.0315 Creel
44.0355 Denier
44.0423 E Glass
44.0442 End Missing
44.0487 Feather Length
44.0496 Fill
44.0497 Filler
44.0506 Finished Fabric
44.0516 Fish Eye
44.0528 Flexural Strength
44.0531 Float
44.0565 Gelation Particle
44.0569 Glass Binder
44.0575 Grading Frame
44.0578 Greige
44.0591 Heat Cleaning
44.0596 Heavy Mark (Fabric)
44.0702 Leno End Out
44.0708 Light Mark (Fabric)
44.0723 Loom Beam
44.0741 Mark (Fabric)
44.0769 Mis-Pick
44.1464 Para-aramid
44.0834 Passive Base Material
44.0861 Pick
44.0868 Plain Weave
44.0878 Plied Yarn
44.1202 Quill
44.1230 Reed
44.1266 Roving
44.1516 Satin Weave
44.1284 Section Beam
44.1288 Selvage
44.0930 Shuttle
44.0948 Sizing
44.0999 Split (Fabric)
44.1027 Stripback
44.1032 Supporting Plane
44.1047 Tear (Fabric)
44.1049 Tenter Frame
44.1112 Trumeter
44.1127 Unfil
44.1149 Warp Size
44.1148 Warper
44.1564 Waste (Fabric)
44.1153 Waviness
45 Conductive Materials (Foil, Film or Plating)
45.0054 As-Fired
45.0088 Base Metal
45.0092 Basis Metal
45.0180 Carrier (Foil)
45.0202 Chemical Vapor Deposition
45.0249 Conductive Foil
45.0358 Dent
45.0425 Electrodeposited Foil
45.0500 Film
45.0501 Film Conductor
45.0546 Foil Profile
45.0638 Indentation
45.1459 Outgrowth
45.1274 Sacrificial Protection
45.1545 Thick Film
45.1079 Thin Film
45.1080 Thin Foil
45.1174 Wrought Foil
46 Component Attachment Materials (Conductive/
Nonconductive)
46.0009 Acid Flux
46.0008 Acid-Core Solder
46.0012 Activated Rosin Flux
46.0015 Activator
46.1728 Adhesive
46.0044 Aqueous Flux
46.0539 Flux-Cored Solder
46.1514 Rosin
46.1262 Rosin Flux
46.0956 Solder
46.0965 Solder Cream
46.1818 Solder Paste
47 Coating and Permanent Masting Materials
47.0107 Binder
47.0742 Mask
47.0892 Potting Compound
47.0973 Solder Mask
47.1674 Solder Resist
49 Other (Material Issues)
49.0068 Azeotrope
49.1330 Azeotrope Mixture (Azeotrope)
49.0847 Copolymerize
49.1082 Thixotropic Ratio
49.1083 Thixotropy
5 Fabrication Processes for Interconnection Structures
50 General (Interconnection Structure Fab Processes)
50.0201 Chemically-Deposited Printed Circuit
50.0200 Chemically-Deposited Printed Wiring
50.1788 Delivered Panel (DP)
50.0771 Misregistration
50.1646 Multiple Printed Panel
50.1786 Production Printed Board (PPB)
50.1787 Production Panel (PP)
50.1240 Registration
50.1209 Subtractive Process
50.1542 Thermal Zone
51 Mechanical Processes
51.0081 Back Taper(s)
51.1341 Body Land Clearance
51.0181 Carry-Out
51.0193 Chamfer (Drill)
51.0209 Chipped Point
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51.0211 Chisel-Edge Angle
51.0312 Crazing (Base Material)
51.0407 Drill Body Length
51.0408 Drill Diameter
51.0409 Drill Point Concentricity
51.0446 Epoxy Smear
51.1400 Flare
51.0544 Foil Burr
51.1415 Haloing
51.0597 Heel (Drill)
51.0601 Helix Angle
51.0618 Hook
51.0676 Land (Drill)
51.0679 Land Width (Drill)
51.1223 Land Width Angle (Drill)
51.0684 Layback
51.0712 Lip Height
51.0740 Margin Width (Drill)
51.0794 Nail Heading
51.1457 Open Point
51.1200 Overall Length
51.1229 Overlap (drill)
51.0881 Point Angle
51.0907 Primary Flare
51.0908 Primary Relief
51.0910 Primary Taper
51.1506 Resin Smear
51.1282 Secondary Relief
51.1295 Shank
51.1297 Shank Diameter
51.1296 Shank-to-Drill Body Concentricity
51.0929 Shoulder Angle
51.0998 Splay
51.1155 Web Taper
51.1156 Web Thickness
52 Imaging and Application of Resists and Inks
52.0011 Actinic Radiation
52.0113 Bleeding
52.1701 Definition
52.1448 Negative-Acting Resist
52.0845 Permanent Resist
52.0850 Photographic Layer
52.0856 Photoprint
52.1472 Photoresist
52.0857 Photoresist Image
52.1481 Positive-Acting Resist
52.0914 Printed Component
52.1600 Printed Components, Conductive Inks
52.1592 Printing
52.1508 Resist
52.1254 Reverse Image
52.1204 Screen Printing
52.0937 Silkscreening
52.0947 Skipping
52.1050 Tenting
52.1131 Usable Resolution
53 Metal Deposition Processes, including Plating
53.0002 Accelerator
53.0013 Activating
53.0014 Activating Layer
53.1322 Additive Process
53.0022 Adhesion Promotion
53.0056 Aspect Ratio (Hole)
53.0117 Blow Hole
53.0184 Catalyzing
53.0319 Critical Current Density
53.0426 Electrodeposition
53.0427 Electroless Deposition
53.0428 Electroless Plating
53.0430 Electrolytic Deposition
53.0433 Electroplating
53.0502 Film Network
53.1407 Fully Additive Process
53.0554 Fully-Electroless Process
53.0560 Galvanic Deposition
53.0561 Galvanic Displacement
53.0613 Hole Pull Strength
53.0614 Hole Void
53.0635 Immersion Plating
53.0645 Initiating
53.0656 Interlaminar Metalization
53.0753 Metalization (n.)
53.1199 Outgassing
53.1673 Overplate
53.0827 Panel Plating
53.0840 Pattern Plating
53.0255 Photographic-Reduction Dimension
53.0873 Plating (n.)
53.0874 Plating (v.)
53.0876 Plating Bar
53.1477 Plating Thief
53.0877 Plating Up
53.0875 Plating, Burned
53.0906 Pretinning
53.1261 Robber
53.1286 Seed Layer
53.1285 Seeding
53.1518 Semi-Additive Process
53.1291 Sensitizing
53.0962 Solder Coat
53.1677 Solder Levelling
53.1007 Sputtering
53.1540 Swell-and-Etch Process
53.1088 Tie Bar
53.1549 Treeing
53.1133 Vacuum Evaporation
54 Material Removal Processes, including Etching
54.1318 Abrasive Trimming
54.0010 Acid Number
54.1217 Acid Value
54.1321 Active Trimming
54.0245 Concentration Polarization
54.0248 Conducting Salt
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54.0452 Etch Factor
54.0450 Etchant
54.1389 Etchback
54.0453 Etching
54.1390 Etching Indicator
54.0574 Graded Wedge
54.0798 Negative Etchback
54.1294 Shadowing, Etchback
54.0953 Smear Removal
55 Lamination, Sequential Deposition, and Molding
Processes
55.0130 Bonding Layer
55.0176 Cap Lamination
55.1350 Clad (adj.)
55.1376 Delamination
55.0545 Foil Lamination
55.0566 Gel Time
55.1412 Glass Transition Temperature
55.0672 Laminate (n.)
55.1808 Laminate (v.)
55.0685 Layer-to-Layer Registration
55.1443 Mass Lamination
55.0748 Measling
55.1449 Nominal Cured Thickness
55.0865 Pink Ring
55.1474 Plate Finish, Laminating
55.0898 Pre-finish (n.)
55.0900 Preflow
55.1154 Weave Exposure
55.1565 Weave Texture
56 Thermal Cure/Firing Processes
56.0082 Bake Out
56.0093 Batch Oven
56.0219 Co-Firing
56.0330 Cure
56.0331 Cure Time
56.0332 Curing Agent
56.0508 Fire (v.)
56.0509 Firing Sensitivity
56.0517 Fissuring
56.0557 Fused Coating
56.1676 Fusing
56.0467 Fusing Fluid
56.1408 Fusing Flux
56.1409 Fusing Oil
56.0577 Green Strength
56.0586 Hardeners
56.0593 Heat of Fusion
56.0660 Intumescence
56.0703 Levelling
56.0704 Levelling Flux
56.0705 Levelling Oil
56.0890 Post Curing
56.0902 Preheat (v.)
56.1483 Preheating (v.)
56.1304 Radiant Flux
56.1305 Radiant Intensity
56.1306 Radiator, Focused
56.1307 Radiator, Nonfocused
57 Cleaning and Chemical Treatment Processes
57.0042 Anodic Cleaning
57.0185 Cathodic Cleaning
57.0199 Chemical Conversion Coating
57.0366 Desmear
57.0832 Passivation
57.1009 Stabilization Period
59 Other (Interconnecting Structure Fabrication
Processes)
59.0186 Cation Exchange
59.0187 Cationic Reagent
6 Type and Performance of Interconnecting Structures
60 General (Interconnecting Structure Type and
Performance)
60.1319 Access Hole
60.0041 Annular Ring
60.0084 Bare Board
60.0118 Board
60.0139 Bond Strength
60.1218 Bow (Sheet, Panel, or Printed Board)
60.0148 Breakout
60.0156 Bulge
60.0177 Card
60.0214 Circuit Card
60.0252 Conductor Base Spacing
60.0253 Conductor Base Width
60.1363 Conductor Spacing
60.1364 Conductor Width
60.0402 Double-Sided Printed Board
60.0451 Etched Printed Boards
60.1699 Hole Breakout
60.0707 Lifted Land
60.1227 Multilayer Printed Board
60.0786 Multilayer Printed Circuit Board
60.0788 Multilayer Printed Wiring Board
60.1179 Nick (n.)
60.1181 Nodule
60.0810 One-Sided Board
60.0816 Overhang
60.0823 Packaging and Interconnecting Assembly
60.1461 Packaging and Interconnection Structure
60.1487 Printed Circuit Board
60.1488 Printed Wiring
60.1489 Printed Wiring Board
60.0912 Printed Circuit
60.1485 Printed Board (PB)
60.1490 Production Board
60.1504 Resin Recession
60.0945 Single-Sided Printed Board
60.1013 Stamped Printed Wiring
60.1553 Twist
60.1116 Two-sided Board
60.1147 Warp
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