IPC-T-50F_.pdf.pdf - 第88页

(see 35.), to inorganic and organic interconnection struc- tures. Includes, but is not limited to, hybrids, multichip modules (MCM-L,-C, or -D), and chip-on-board. 75. JOINING TECHNIQUES Contains terms related to the met…

58. [RESERVED FOR FUTURE EXPANSION]

59. OTHER (INTERCONNECTING STRUCTURE FABRICA-

TION PROCESSES)

Contains terms related to unique interconnecting structure

fabrication processes which are not easily identiﬁed by

assigned topics. Caution is suggested when using the topic

‘‘OTHER’’ as terms contained in this topic should be

unique and have little bearing to one-another.

6. TYPES AND PERFORMANCE OF INTERCONNECTING

STRUCTURE FOR ELECTRONIC PACKAGING

60. GENERAL (INTERCONNECTING STRUCTURE TYPE

AND PERFORMANCE)

Contains terms needed to describe interconnection struc-

ture types and their performance requirements which cross

the boundaries of the various type characterization or deal

with performance issues covering a broad spectrum of the

products described in this segment.

61. RIGID PRINTED BOARDS (ORGANIC SUB-

STRATES)

Contains terms related to single-sided, double-sided and mul-

tilayer printed boards made from rigid substrate materials (see

41.), with and without plated through-holes and/or vias.

62. FLEXIBLE PRINTED BOARDS (ORGANIC SUB-

STRATES)

Contains terms related to single-sided, double-sided, and

multilayer printed boards made from ﬂexible substrate

materials (see 42.), with and without plated through holes

and/or vias.

63. FLEX-RIGID PRINTED BOARDS (ORGANIC SUB-

STRATES)

Contains terms related to single-sided, double-sided and

multilayer printed boards made from combinations of rigid

and ﬂexible substrate materials (see 41. & 42.), with and

without plated through holes and/or vias.

64. DISCRETE WIRING BOARDS (ORGANIC SUB-

STRATES)

Contains terms related to printed boards that may be made

using the same techniques described in 61.,62.,or 63., but

are supplemented by other materials, and/or discrete wires

in order to complete the electrical or electronic intercon-

nection.

65. PRINTED BOARDS (INORGANIC SUBSTRATES)

Contains terms related to single-sided, double-sided, and

multilayer boards made from inorganic substrate materials,

with and without plated through holes and/or vias.

66. MOLDED STRUCTURES (THREE DIMENSIONAL)

Contains terms related to interconnecting structures that are

three dimensional in their characteristic or that are pro-

duced using organic resin materials (plastics) in a molding

process to produce the mounting and or interconnecting

structure.

67. HYBRID/MULTICHIP MODULE INTERCONNECTING

STRUCTURES

Contains terms related to single-sided, double-sided, or

multilayer hybrid (ceramic) circuits, or modules intended

to serve as a subassembly that interconnects more than one

bare or enhanced (chipscale package) semiconductor die.

(see 36.)

68. [RESERVED FOR FUTURE EXPANSION]

69. OTHER (INTERCONNECTION STRUCTURE TYPE

AND PERFORMANCE ISSUES)

Contains terms related to unique interconnection structure

types or their performance requirements which are not eas-

ily identiﬁed by assigned topics. Caution is suggested when

using the term ‘‘OTHER’’ as terms contained in this topic

should be unique and have little bearing to one-another.

7. ASSEMBLY PROCESSES FOR INTERCONNECTION

STRUCTURES

70. GENERAL (ASSEMBLY PROCESS ISSUES)

Contains terms needed to describe assembly processes

which cross the boundaries of component handling, place-

ment or attachment issues as well as cleaning and coating

process requirements.

71. COMPONENT HANDLING, STORAGE AND PREPARA-

TION

Contains terms related to the handling, storage and lead,ter-

mination,or component body preparation necessary to per-

form the assembly mounting and attachment process.

Includes, but is not limited to, baking, tinning, lead bend-

ing, climatic control, binning, inventory control, etc.

72. THROUGH-HOLE MOUNTING OF COMPONENTS

Contains terms related to the mounting of components

intended to be attached to an interconnecting structure by

leads which pass through the structure. Includes, but is not

limited to, the techniques, principles, data transfer, equip-

ment, etc., involved in the process.

73. SURFACE MOUNTING OF COMPONENTS

Contains terms related to the mounting of components

intended to be attached to a interconnecting structure by

leads or terminations that are bonded to the surface.

Includes, but not limited to, mounting techniques, prin-

ciples, data transfer, equipment, etc. involved in the pro-

cess.

74. BARE CHIP PLACEMENT AND ATTACHMENT

Contains terms related to the attachment and bonding of

bare or enhanced (chip scale package) semiconductor die

June 1996 IPC-T-50F

(see 35.), to inorganic and organic interconnection struc-

tures. Includes, but is not limited to, hybrids, multichip

modules (MCM-L,-C, or -D), and chip-on-board.

75. JOINING TECHNIQUES

Contains terms related to the methodologies, techniques,

process consumable materials, and equipment used to

attach completely fabricated components to interconnecting

structures. Includes, but not limited to, reﬂow soldering,

machine soldering, electrical/metallurgical attachment

(welding, wire bonding), conductive adhesive attach etc.

76. CLEANING AND CONFORMAL COATING PRO-

CESSES

Contains terms related to the methods, process consumable

materials, disposal of spent materials, and equipment used

for cleaning the interconnecting substrate assembly, in pro-

cess or ﬁnal, as well as the processes, materials, and equip-

ments used to conformally coat the assembly.

77. REWORK, REPAIR AND MODIFICATION

Contains terms related to the techniques, tools, materials

and equipment used to remove, replace, or add components

to an interconnecting structure, or to correct/change a cir-

cuit feature in the structure itself, and terms related to

restoring the assembly to its proper function.

78. [RESERVED FOR FUTURE EXPANSION]

79. OTHER (ASSEMBLY PROCESS ISSUES)

Contains terms related to unique assembly, cleaning or

coating processes which are not easily identiﬁed by

assigned topics. Caution is suggested when using the topic

‘‘OTHER’’ as terms contained in this topic should be

unique and have little bearing to one-another.

8. TYPES AND PERFORMANCE OF INTERCONNECTION

STRUCTURE ASSEMBLIES FOR ELECTRONIC PACKAG-

ING

80. GENERAL (ASSEMBLY TYPE AND PERFORMANCE

ISSUES

Contains terms needed to describe assembly types and their

performance requirements which cross the boundaries of

the electronic assembly type descriptions or correlate per-

formance requirements to a broad spectrum of product

deﬁned in this segment.

81. RIGID PRINTED BOARD ASSEMBLY (ORGANIC SUB-

STRATES)

Contains terms related to performance requirements and

descriptions of completed rigid printed board assemblies

with electronic, electromechanical, or mechanical compo-

nents mounted on one or both sides of the structure.

82. FLEXIBLE / RIGID-FLEX PRINTED BOARD ASSEM-

BLIES (ORGANIC SUBSTRATES)

Contains terms related to performance requirements and

descriptions of completed ﬂexible or rigid-ﬂex printed

board assemblies whose function includes continuous ﬂex-

ing, or ﬂex- to-install, and have electronic, electromechani-

cal, or mechanical components mounted on one or both

sides of the structure.

83. INORGANIC (CERAMIC,METAL CORE etc.) PRINTED

BOARD ASSEMBLIES

Contains terms related to the performance requirements

and descriptions of completed printed board assemblies or

interconnecting structures made from inorganic materials

with components mounted on one or both sides of the

structure.

84. MOLDED OR THREE DIMENSIONAL PRINTED

BOARD ASSEMBLIES

Contains terms related to the performance requirements

and descriptions of molded planer or three dimensional

interconnecting structures with electronic, electromechani-

cal, or mechanical components mounted on any or all sides

of the structure.

85. BACKPLANES

Contains terms related to the performance requirements

and descriptions of completed backplane (mother-board)

assemblies, with connectors and/or other components on

one or both sides, which are intended to interconnect two

or more other printed board assemblies.

86. MULTICHIP MODULE

Contains terms related to the performance requirements

and descriptions of a subassembly that mounts bare die or

enhanced die (chip scale) on either or both sides, as well as

inside, the mounting and interconnecting structure. The

interconnecting structure may be made of organic materials

(MCM-L), ceramic/ ceramic-glass materials (MCM-C or

hybrids), or basically inorganic material with deposited

dielectric to separate the conductive layers (MCM-D).

87. [RESERVED FOR FUTURE EXPANSION]

88. [RESERVED FOR FUTURE EXPANSION]

89. OTHER (ASSEMBLY TYPE AND PERFORMANCE

ISSUES)

Contains terms related to unique assembly types or their

performance requirements which are not easily identiﬁed

by assigned topics. Caution is suggested when using the

topic ‘‘OTHER’’ as terms contained in this topic should be

unique and have little bearing to one-another.

9. QUALITY AND RELIABILITY FOR ELECTRONIC PACK-

AGING, FABRICATION AND ASSEMBLY

90. GENERAL (QUALITY AND RELIABILITY ISSUES)

Contains terms needed to describe quality and/or reliability

issues of functions that cross the boundaries of design, fab-

rication, assembly, testing or the management of the pro-

cesses and administration function.

IPC-T-50F June 1996

91. PROCESS CONTROL/SPC

Contains terms related to techniques, methods, procedures,

and equipment used to insure that variations of the pro-

cesses used in manufacture, assembly, testing, etc. are kept

within acceptable bounds, and are continually monitored

for establishing control and capability as well as for con-

tinuous process improvement.

92. INSPECTION/TESTING

Contains terms related to techniques, methods, procedures,

and equipment used for verifying that materials and prod-

ucts received meet the intended use. Also includes terms

related to preconditioning (such as baking), testing, and

environmental and stress conditions during testing in order

to determine quality and reliability.

93. RELIABILITY FACTORS AND METHODOLOGY

Contains terms related to methods, principles and algo-

rithms used to determine and predict reliability expecta-

tions of materials, components, interconnecting structures

and assemblies/subassemblies.

94. QUALITY MANAGEMENT AND ASSURANCE

Contains terms related to methods, procedures, techniques,

systems and equipment used to assess the quality of manu-

facturers processes or their products. Includes, but not lim-

ited to, quality assurance inspections, in-process inspec-

tions, process control, ISO 9000 standards, etc.

95. COMPONENT QUALITY AND RELIABILITY

Contains terms related to techniques, methods, procedures,

and equipment intended to determine that electronic, elec-

tromechanical , or mechanical components are ﬁt to sur-

vive the assembly , cleaning, and coating processes and

that when assembled will meet the reliability expectations

of the equipment used in its intended environment.

96. INTERCONNECTION STRUCTURE QUALITY AND

RELIABILITY

Contains terms related to techniques, methods, procedures,

and equipment intended to determine that unpopulated

interconnection structures are ﬁt to survive the assembly,

cleaning, and coating processes and that when assembled

will meet the reliability expectations of the equipment used

in its intended environment.

97. ELECTRONIC ASSEMBLY/SUBASSEMBLY QUALITY

AND RELIABILITY

Contains terms related to techniques, methods, procedures

and equipment intended to determine that electronic assem-

blies or subassemblies (modules) are ﬁt to survive any

equipment testing, and that the assembly will function in a

reliable fashion when the equipment is used in its intended

environment.

98. [RESERVED FOR FUTURE EXPANSION]

99. OTHER (QUALITY AND RELIABILITY ISSUES)

Contains terms related to unique quality or reliability issues

not easily identiﬁed by the assigned topics. Caution is sug-

gested when using the topic ‘‘OTHER’’ as terms contained

in this topic should be unique and have little bearing to

one-another.

June 1996 IPC-T-50F