IPC-T-50F_.pdf.pdf - 第103页
91.0229 Common Cause 91.0290 Control Limits 91.1368 Control Chart 91.0307 Cpk Index (Cpk) 91.0321 Critical Operation 91.0333 Cusum Chart 91.0367 Detection 91.0465 Extraneous Metal 91.0481 Fault Localization 91.0492 Fiber…
76.1188 Nonpolar Matter
76.1454 Nonpolar Solvent
76.0802 Occluded Contaminant
76.0803 Occlusion
76.1196 Organic Contamination
76.0815 Overcoat
76.0820 Oxygen Concentration Cell
76.0833 Passive-Active Cell
76.0883 Polar Matter
76.1815 Polar Solvent
76.1480 Polymer Reversion
76.0885 Polymerized Rosin
76.1245 Residue
76.1253 Reverse Current Cleaning
76.1276 Saponifier
76.0985 Solvent
76.0986 Solvent Cleaning
76.1531 Solvent Extraction
76.0987 Solvent Pop
76.0988 Solvent Release
76.0989 Solvent Wash
76.1011 Stain Proofing
76.1535 Standard (Electrode) Potential
76.1774 Terpenes
76.1081 Thinner (Liquid)
76.1113 Tuberculation
76.1120 Ultrasonic Cleaning
76.1569 Wrinkles
77 Rework, Repair and Modification
77.0464 Extraction Tool
77.0494 Field Trimming
77.0667 Kerf
77.1433 L Cut
77.0682 Laser Trimming
77.0774 Modification
77.1502 Repair(ing)
77.1511 Rework
77.1293 Serpentine Cut
77.1108 Trimming
77.1109 Trimming Notch
79 Other (Assembly Process Issues)
79.1806 Capability Performance Index (Cp)
8 Types and Performance of Assemblies
80 General (Assembly Type and Performance Issues)
80.1327 Assembly
80.0057 Assembled Board
80.0401 Double-Sided Assembly
80.0503 Fine-Pitch Technology (FPT)
80.0775 Module
80.0787 Multilayer Printed Circuit Board Assembly
80.0789 Multilayer Printed Wiring Board Assembly
80.0911 Printed Board Assembly
80.0913 Printed Circuit Board Assembly
80.0917 Printed Wiring Board Assembly
80.0944 Single-sided Assembly
83 Inorganic (Ceramic, Metal Core etc.) Printed Board
Assemblies
83.1417 Hybrid Circuit
83.1418 Hybrid Integrated Circuit
83.1419 Hybrid Microcircuit
83.1073 Thick-Film Circuit
83.1074 Thick-Film Hybrid Circuit
83.1075 Thick-Film Network
83.1076 Thin-Film Hybrid Circuit
83.1077 Thin-Film Integrated Circuit
83.1078 Thin-Film Network
85 Backplanes
85.0080 Backpanel
85.1331 Backplane
85.0778 Mother Board
86 Multichip Modules
86.0207 Chip-on-Board (COB)
86.1446 Microcircuit Module
86.0782 Multichip Integrated Circuit
86.0783 Multichip Microcircuit
86.0784 Multichip Module (MCM)
9 Quality and Reliability, Fabrication and Assembly
90 General (Quality and Reliability Issues)
90.0003 Acceptable Quality Level (AQL)
90.0007 Accuracy
90.0018 Actual Size
90.0025 Aging
90.0308 Crack, Foil
90.0309 Crack, Plating
90.0310 Cracking
90.0348 Defect
90.0349 Defect Identification
90.0351 Degradation
90.0353 Dendritic Growth
90.0354 Dendritic Migration
90.0359 Dentrices
90.0478 Fault
90.0479 Fault Dictionary
90.0637 Inclusions
90.1501 Reliability
90.1526 Shelf Life
90.1029 Structurally-Similar Construction
90.1087 Through Migration
90.1140 Void
91 Process Control/SPC
91.0024 Advanced Statistical Method
91.0033 Alpha Error
91.0038 Analysis of Variance (ANOVA)
91.0059 Assignable Cause
91.1336 Basic Statistical Method
91.0104 Beta Error
91.1344 Capability Performance, Upper (Cpku)
91.1367 Capability Performance, Lower (Cpkl)
91.0306 Capability Index (Cp)
91.0190 Central Line
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91.0229 Common Cause
91.0290 Control Limits
91.1368 Control Chart
91.0307 Cpk Index (Cpk)
91.0321 Critical Operation
91.0333 Cusum Chart
91.0367 Detection
91.0465 Extraneous Metal
91.0481 Fault Localization
91.0492 Fiber Exposure
91.0511 First Article
91.0510 First-Pass Yield
91.0515 Fishbone Diagram
91.1399 Fixed-Effect Model
91.0527 Flexural Failure
91.0550 Fractional-Factorial Experiment
91.0567 Generative Process Planning
91.0608 Histogram
91.0630 Hypotheses Test
91.0632 Identical Processing
91.0649 Inspection Overlay
91.0674 Laminate Void
91.1434 Larger-the-Better Characteristic
91.0722 Long-Term Capability
91.1442 Lot Size
91.0767 Minor Defect
91.0772 Mixed-Effects Model
91.0781 Multi-Vari
91.0790 Multilevel Experiment
91.0791 Multiple Indications
91.1182 Noise (Process Control)
91.1450 Nominal-Is-Best Characteristic
91.1455 Null Hypothesis
91.1458 Orthogonal-Array Experiment
91.1228 Output Vector
91.0842 Percent Contribution
91.1478 Poisson Distribution
91.0895 Power of Experiment
91.0920 Process Average
91.0921 Process Indicator
91.0922 Process Spread
91.0927 Pure Sum of Squares
91.1311 Random Sample
91.1497 Random-Effects Model
91.1309 Randomization
91.1310 Randomness
91.1314 Reciprocity Failure
91.1498 Reciprocity Law
91.1241 Regression Analysis
91.1503 Repeatability (Accept/Reject) Decisions
91.1251 Response Variable
91.1268 Run (n.)
91.1269 Run Chart
91.1519 Sensitivity Control
91.1302 Short-Term Capability
91.0933 Signal-to-Noise Ratio (Process Control)
91.1817 Smaller-the-Better Characteristic
91.0995 Special Cause
91.0996 Specification Limits
91.1002 Spread (Values)
91.1008 Stability
91.1010 Stable Process
91.1534 Standard Deviation of a Population
91.1015 Statistical Control
91.1016 Statistical Hypothesis
91.1536 Statistical Process Control (SPC)
91.1017 Statistical Quality Control (SQC)
91.0140 Subgroup
91.1210 Sum of Squares
91.1117 Type I Error
91.1132 User Inspection Lot (Material)
91.1134 Variables Data
91.1135 Variance
91.1558 Vendor Inspection Lot (Material)
91.1136 Verification Time
91.1138 Virtual Condition
92 Inspection/Testing
92.0066 AWG Equivalent
92.0004 Acceptance Tests
92.0043 Apparent Field-of-View Angle
92.0047 Arc Resistance
92.0064 Automatic Test Equipment
92.0065 Automatic Test Generation
92.0074 Backdriving
92.0089 Base Solderability
92.0097 Baume
92.0101 Bed-of-Nails Fixture
92.0103 Benchmark, Testing
92.0109 Biochemical Oxygen Demand
92.0157 Bulk Conductance
92.0172 Camber
92.0247 Conditioning
92.0284 Continuity
92.0294 Coordinatograph
92.0296 Copper-Mirror Test
92.0302 Coupon
92.1220 Coupon (Breakaway)
92.0314 Crease
92.0324 Cross-Sectioning
92.0389 Discrepant Material
92.0403 Download, Tester
92.0411 Dual Fixture
92.0415 Edge Definition
92.0416 Edge Detection
92.0459 Exclusion Area
92.0471 False Alarm
92.0472 False Alarm Rate
92.0480 Fault Isolation
92.0482 Fault Masking
92.0483 Fault Modes
92.0484 Fault Resolution
92.0485 Fault Signature
92.1396 Fault Simulation
92.0519 Fixture, Test
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92.0556 Functional Tester
92.0570 Go-No-Go Test
92.0571 Golden Assembly
92.0572 Golden Board
92.0573 Gouge
92.0576 Gray-Scale Processing
92.0582 Guarding
92.0607 Hipot Test
92.0636 In-Circuit Testing
92.1790 Individual Test Specimen (ITS)
92.0648 Input Vector
92.1421 Inspection Facility
92.1422 Inspection Lot
92.0650 Inspection Personnel
92.0651 Inspection Rate
92.0652 Inter-Test Time (ITT)
92.0670 Known Good Assembly (KGA)
92.0671 Known Good Board (KGB)
92.0700 Learn Time
92.0714 Load Time
92.0733 Magnification Power
92.0750 Meniscus
92.0760 Microprobe
92.1447 Microsectioning
92.0792 Nail
92.0799 Neighborhood Processing
92.0812 Open, Electrical (n.)
92.0841 Peel Strength
92.0843 Percent of the Field of View
92.0234 Personality Plate
92.0863 Pinhole (Material)
92.0866 Pit
92.1476 Plated-Through Hole Structure Test
92.0901 Pregelation Particle
92.0909 Primary Stage of Manufacture
92.0919 Probe Point
92.0918 Probe, Test
92.1492 Profile Factor
92.0924 Proportional Dimensions
92.0925 Pull Strength
92.1214 Qualitative Analysis
92.1495 Quality-Conformance Test Circuitry
92.1215 Quantitative Analysis
92.1244 Repeat Set-Up Time
92.1250 Resistor Drift
92.1271 Run Time
92.0755 Scan Rate
92.1278 Scan-Dead Time
92.0693 Scanner, Test
92.1203 Scratch
92.1287 Self Test
92.1522 Set-Up Time
92.1298 Shear Strength
92.1765 Shear Test
92.1524 Sheet Capacitance
92.1525 Sheet Resistance
92.1301 Short, Electrical (n.)
92.0938 Silver Migration
92.0939 Simulated Aging
92.0940 Simulated Datum
92.1819 Solder Spread Test
92.1769 Specimens
92.1005 Spurious Metal
92.1771 Substrate Bending Test
92.1538 Surface Insulation Resistance (SIR)
92.1683 Test Board
92.1820 Test Coupon
92.1057 Test Language
92.1058 Test Master
92.1059 Test Pattern
92.1060 Test Point
92.1061 Test Program
92.1062 Test Set
92.1063 Test Step
92.1056 Testing Personnel
92.1090 Titrometry
92.1097 Touch-Up
92.1548 Treatment Transfer
92.1123 Unconditional Test
92.1124 Undercut, After Fabrication
92.1125 Undercut, In Process
92.1128 Unload Time
92.1130 Upload (Test)
92.1137 Vesical
92.1560 Vesication
92.1561 Vesicativity Ratio
92.1139 Visual Examination
92.1144 Volumetric Analysis
92.1160 Wetting Balance
92.1161 Whisker
92.1566 White Spot
93 Reliability Factors and Methodology
93.0001 Accelerated Aging
93.1324 Alternative Hypothesis
93.0096 Bathtub Curve
93.0461 Experimental Error
93.0552 F Ratio
93.1403 Forced-Field Analysis
93.0923 Producer’s Risk
94 Quality Management and Assurance
94.0062 Attributes Data
94.0077 Background Variable
94.0108 Binomial Distribution
94.0116 Blocking Variables
94.0147 Brainstorming
94.1785 Capability Test Segment
94.1784 Capability Test Board (CTB)
94.0188 Cause-and-Effect Diagram
94.1219 Check List
94.0195 Check Plot
94.0196 Check Sheet
94.1365 Confidence Interval
94.0262 Confirmation Run
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