IPC-T-50F_.pdf.pdf - 第38页

Hole Breakout 60.1699 A condition in which a hole is not completely surrounded by the land. (See Figure H-1.) Hole Density 22.0610 The quantity of holes in a unit area of printed board. Hole Location 22.0611 The dimensio…

Halide Content 76.0584

The ratio of the mass of free halides to the mass of solids

in a ﬂux, expressed in mass percent of free chloride ion.

Haloing 51.1415

Mechanically-induced fracturing or delamination, on or

below the surface of a base material, that is usually exhib-

ited by a light area around holes or other machined fea-

tures.

Hand Soldering 75.0585

Soldering using a soldering iron or other hand-held,

operator- controllable apparatus.

Hard Wiring 75.0587

Electrical wiring that is inseparable from an assembly with-

out the use of special tools and processes.

Hardeners 56.0586

see ‘‘Curing Agent.’’

Haywire 37.0588

A discrete electrical connection that is added to a printed

board in order to modify the basic conductive pattern

formed on the board. (See also ‘‘Jumper Wire.’’)

Header (Connector) 37.0589

A pin ﬁeld that is positioned in a 3- or 4-sided plastic

housing that mounts directly onto a printed board.

Header (Module) 36.0590

The base of an electronic component package that contains

leads.

Heat Cleaning 44.0591

A process in which organic yarn binder (size) is removed

from a fabric. (See also ‘‘Sizing.’’)

Heat Column 75.0592

The heating element in a eutectic die bonder or wire

bonder that is used to bring the base material up to its

bonding temperature.

Heat of Fusion 56.0593

The quantity of heat required to convert a unit weight of

solid material to its liquid state.

Heatsink 30.0594

A mechanical device that is made of a high thermal-

conductivity and low speciﬁc-heat material that dissipates

heat generated by a component or assembly.

Heatsink Plane 22.0595

A continuous sheet of metal on or in a printed board that

functions to dissipate heat away from heat generating com-

ponents.

Heatsink Tool 75.1416

A heatsink that is temporarily attached to a heat-sensitive

component in order to minimize the transfer of heat from

the component lead to the component body during a solder-

ing operation.

Heavy Mark (Fabric) 44.0596

A ﬁlling defect that extends across the width of a fabric

containing in excess of two picks per inch from nominal.

Heel, Bonding 74.0598

The part of a lead adjacent to a termination that has been

deformed by the edge of the bonding tool.

Heel Break 97.0599

The rupture of a lead at the heel of a bond.

Heel Crack 97.0600

A crack across the width of a lead at the heel of a bond.

Heel (Drill) 51.0597

The trailing edge of a drill land

Helix Angle 51.0601

The angle of the spiral generated by the ﬂute of a drill with

respect to the axis of the drill.

Hermaphroditic Contact 37.0602

A type of connector contact that mates with a contact that

is identical to itself.

Heterocyclic 76.0603

A cyclic or ring structure, often in the shape of a pentagon,

in which one or more of the atoms in the ring is an element

other than carbon.

Hierarchical Database 11.0604

A database that is arranged in a tree-like structure of logic.

High-Impedance State 21.0605

see ‘‘Tri-State.’’

High-Voltage Wire 37.0606

Insulated wire, with an insulation thickness that is deter-

mined by corona-related factors, that is used for voltag es

over 240 Vac RMS or over 340 Vdc.

Hipot Test 92.0607

A method in which the unit under test is subjected to a high

alternating current (ac) voltage.

Histogram 91.0608

A graph that depicts values that were obtained by dividing

the range of a data set into equal intervals and that plots the

number of data points in each interval.

June 1996 IPC-T-50F

Hole Breakout 60.1699

A condition in which a hole is not completely surrounded

by the land. (See Figure H-1.)

Hole Density 22.0610

The quantity of holes in a unit area of printed board.

Hole Location 22.0611

The dimensional position of the center of a hole.

Hole Pattern 22.1621

The arrangement of all the holes in a printed board or pro-

duction board.

Hole Pull Strength 53.0613

The load or pull force along the axis of a plated-through

hole that will rupture the hole.

Hole Void 53.0614

A void in the metallic deposit of a plated-through hole that

exposes the base material.

Homocyclic 76.0615

A ring compound containing only one kind of atom in its

ring structure.

Homologous Series 76.0616

A series of organic compounds in which each successive

member has one more CH

group in its molecule than the

preceding member.

Homopolymer 76.0617

A polymer derived from a single monomer with the aid of

initiators that act in the manner of catalysts.

Hook 51.0618

The rake condition in the ﬂute face of a drill. (See Figure

H-2.)

Hook Solder Terminal 37.0619

A solder terminal with a curved feature around which one

or more wires are wrapped prior to soldering. (See Figure

H-3.)

Horn 74.0620

A cone-shaped object that transmits ultrasonic energy from

a transducer to a bonding tool.

Hot Plate Reflow Soldering 75.1748

Reﬂow soldering using direct contact or close proximity to

a hot plate as the primary source of heat.

Hybrid Circuit 83.1417

An insulating base material with various combinations of

interconnected ﬁlm conductors, ﬁlm components, semicon-

ductor dice, passive components and bonding wire that

form an electronic circuit.

Hybrid Integrated Circuit 83.1418

An insulating base material with various combinations of

interconnected ﬁlm conductors, ﬁlm components, semicon-

ductor dice, passive components and bonding wire that per-

form the same function as a monolithic semiconductor inte-

grated circuit.

Hybrid Microcircuit 83.1419

An insulating base material with various combinations of

interconnected ﬁlm conductors, ﬁlm components, semicon-

ductor dice, passive components and bonding wire that

form an electronic microcircuit.

Hydrocarbon Tolerance 76.0621

see ‘‘Dilution Ratio.’’

Hydrolytic Stability 76.0622

The degree of resistance of a polymer to permanent prop-

erty changes from hydrolytical effects.

IPC-I-001031

Figure H–1 Hole breakout

IPC-I-000000

Figure H–2 Hook

IPC-0-000000

Figure H–3 Hook solder terminal

IPC-T-50F June 1996

Hydrophilic Matter 76.0623

see ‘‘Polar Matter.’’

Hydrophilic Solvent 76.0624

see ‘‘Polar Solvent.’’

Hydrophobic Matter 76.0625

see ‘‘Nonpolar Matter.’’

Hydrophobic Solvent 76.0626

see ‘‘Nonpolar Solvent.’’

Hydrotrope 76.0627

A chemical that can increase the aqueous solubility of

slightly-soluble organic chemicals.

Hydrotrophe 76.0628

see ‘‘Hydrotrope.’’

Hypersorption 76.0629

The process by which activated carbon selectively absorbs

less-volatile components from a gaseous mixture while the

more-volatile components are unaffected.

Hypotheses Test 91.0630

An objective method to determine and quantify, within

known levels of risk, whether or not a hypothesis is either

accepted or rejected.

Icicle 75.0631

see ‘‘Solder Projection.’’

Identical Processing 91.0632

Fabrication that is conducted under conditions that have

demonstrated the capability to produce measurable

attributes within a narrow band of variability.

Illuminance 24.0633

Luminous ﬂux striking a surface.

Illumination 24.0634

see ‘‘Illuminance.’’

Immersion Attitude 75.1749

The positioning of an object when immersed in a solder

bath.

Immersion Conditions 95.1750

Test conditions resulting when a surface mounting device

package leads are immersed into a solder bath to check

resistance to soldering temperatures.

Immersion Plating 53.0635

The chemical deposition of a thin metallic coating over

certain basis metals that is achieved by a partial displace-

ment of the basis metal.

Impedance 21.1801

The resistance to the ﬂow of current, represented by an

electrical network of combined resistance, capacitance and

inductance reaction, in a conductor as seen by an AC

source of varying time voltage. The unit of measure is

ohms.

In-Circuit Testing 92.0636

The application of test signals directly to a device’s input

terminals and sensing the results directly from the device’s

output terminals.

Inclusions 90.0637

Foreign particles, metallic or nonmetallic, that may be

entrapped in an insulating material, conductive layer, plat-

ing, base material, or solder connection.

Indentation 45.0638

see ‘‘Dent.’’

Independent of Size 22.0639

The concept that requires the tolerance of form or position

to vary independent of, and without regard to, feature size.

Index Edge 22.0640

see ‘‘Locating Edge.’’

Index Edge Marker 22.0641

see ‘‘Locating Edge Marker.’’

Indexing Hole 22.0642

see ‘‘Tooling Hole.’’

Indexing Notch 22.0643

see ‘‘Locating Notch.’’

Indexing Slot 22.0644

see ‘‘Locating Slot.’’

Individual Test Pattern (ITP) 24.1791

A single test pattern designed and intended to serve a spe-

ciﬁc evaluation technique for determining a particular

aspect(s) of a manufacturer or manufacturing process capa-

bility.

Individual Test Specimen (ITS) 92.1790

A single test specimen that contains an individual test pat-

tern (ITP) and is used to determine a particular aspect(s) of

a manufacturer or manufacturing process capability.

June 1996 IPC-T-50F