IPC-T-50F_.pdf.pdf - 第17页
Chamfer (Drill) 51.0193 The angle at the end of a drill shank. Characteristic Curve 24.1347 A plot of photographic product optical-density data versus the logarithm of the exposure used to characterize the response of th…
Capability Test Segment (CTS) 94.1785
A segment or portion of a capability test board (CTB),
containing a set or group of individual test patterns (ITP),
intended to be used to demonstrate a specific level of
printed board complexity or manufacturing capability.
Capacitance 21.1794
A measure of the ability of two adjacent conductors sepa-
rated by an insulator to hold a charge when a voltage is
impressed between them.
Capacitance Density 21.0173
The amount of capacitance available per unit area.
Capacitive Coupling 21.0174
The electrical interaction between two conductors that is
caused by the capacitance between them.
Capillary 74.0175
A hollow bonding tool used to guide wire to the bonding
site and to be used to apply pressure during the bonding
cycle. (See also ‘‘Wedge Tool’’)
Card 60.0177
see ‘‘Printed Board.’’
Card-Edge Connector 22.0178
see ‘‘Edge-Board Connector.’’
Card-Insertion Connector 22.0179
see ‘‘Edge-Board Connector.’’
Carrier (Foil) 45.0180
A temporary support medium that facilitates the handling
of thin and soft-metal foils.
Carrier Tape 36.1345
The carrier for conductors used in tape-automated bonding.
(See also ‘‘Multilayer Carrier Tape,’’ ‘‘Single-Layer Carrier
Tape,’’ ‘‘Two-Layer Carrier Tape’’ and ‘‘Three-Layer Car-
rier Tape.’’)
Carry-Out 51.0181
The curved back portion of the flute of a drill.
Castellation 33.0182
A recessed metalized feature on the edge of a leadless chip
carrier that is used to interconnect conducting surface or
planes within or on the chip carrier.
Catalyst (Resin) 40.0183
A chemical that is used to initiate the reaction or increase
the speed of the reaction between a resin and a curing
agent.
Catalyzing 53.0184
see ‘‘Activating.’’
Cathodic Cleaning 57.0185
Electrolytic cleaning in which the work is the cathode.
Cation Exchange 59.0186
see ‘‘Ion Exchange’’
Cationic Reagent 59.0187
Surface-active substances that have the active constituent
in the positive ion.
Cause-and-Effect Diagram 94.0188
A problem solving tool that uses a graphic description of
various process elements in order to analyze potential
sources of process variation.
Center-to-Center Spacing 22.1346
The nominal distance between the centers of adjacent fea-
tures on any single layer of a printed board. (See Figure
C-1.)(See also ‘‘Pitch.’’)
Centering Force 73.1733
The force required by the pick-up tooling to center a sur-
face mounting device in its proper location on a substrate.
Centerwire Break 74.0189
A failure mode in a wire pull test whereby the wire frac-
tures at approximately its midspan.
Central Line 91.0190
The line on a control chart that depicts the average or
median value of the items being plotted.
Certification 17.0191
The verification that specified training or testing has been
performed and that required proficiency or parameter val-
ues have been atained.
Chain Dimensioning 26.0192
The maximum variation between two features that is equal
to the sum of the tolerances on the intermediate distances.
IPC-I-001035
Figure C–1 Center-to-center spacing (pitch)
Pitch
IPC-T-50F June 1996
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Chamfer (Drill) 51.0193
The angle at the end of a drill shank.
Characteristic Curve 24.1347
A plot of photographic product optical-density data versus
the logarithm of the exposure used to characterize the
response of the material to exposure and development. (See
Figure C-2.)
Characteristic Impedance 21.0194
The resistance of a parallel conductor structure to the flow
of alternating current (AC), usually applied to high speed
circuits, and normally consisting of a constant value over a
wide range of frequencies.
Check List 94.1219
A compilation of the specified criteria that may be evalu-
ated during an audit or inspection.
Check Plot 94.0195
An interim drawing used for graphical data verification.
Check Sheet 94.0196
A form that is used for data collection.
Chelate Compound 76.0197
A compound in which metal is contained as an integral part
of a ring structure.
Chelating Agent 76.0198
A compound capable of forming a chelate compound with
a metal ion.
Chemical Conversion Coating 57.0199
A protective coating produced by the chemical reaction of
a metal with a chemical solution.
Chemical Vapor Deposition 45.0202
The deposition of a film onto the surface of a substrate by
the chemical reduction of a vapor on contact with the base
material.
Chemical Wire Stripping 37.0203
The process of removing insulation from wire using chemi-
cal compounds.
Chemically-Deposited Printed Circuit 50.0201
see ‘‘Additive Process.’’
Chemically-Deposited Printed Wiring 50.0200
see ‘‘Additive Process.’’
Chemisorption 74.1348
The formation of bonds between the surface molecules of
a metal, or other material of high surface energy, and
another gas or liquid substance in contact with it.
Chessman 74.0204
A disk, knob or lever used to manually control the position
of a bonding tool with respect to land.
Chip 35.0205
see ‘‘Die.’’
Chip Carrier 33.0208
A low-profile, usually square, surface-mount component
semiconductor package whose die cavity or die mounting
area is as large fraction of the package size and whose
external connections are usually on all four sides of the
package. (It may be leaded or leadless.)
Chip-and-Wire 74.0206
An assembly method that uses discrete wires to intercon-
nect back-bonding die to lands, lead frames, etc.
Chip-on-Board (COB) 86.0207
A printed board assembly technology that places unpack-
aged semiconductor dice and interconnects them by wire
bonding or similar attachment techniques. Silicon area den-
sity is usually less than of the printed board.
Chipped Point 51.0209
A condition whereby the amount of chips on the leading
edge of a drill point exceeds an allowable value.
Chisel 74.0210
A tool used for wedge and ultrasonic bonding.
Chisel-Edge Angle 51.0211
The angle between the leading cutting edge and the inter-
section of the primary and secondary relief facets of a drill
point.
Chopped Bond 74.0212
A bond with excessive deformation such that the strength
of the bond is greatly reduced.
IPC-I-002331
Figure C–2 Typical Characteristic Curve
log E
30
D
20
10
f
1
D
Density
00 10 20 30 40
B
A
C
F
P
θ
June 1996 IPC-T-50F
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Circuit 21.0213
A number of electrical elements and devices that have been
interconnected to perform a desired electrical function.
Circuit Card 60.0214
see ‘‘Printed Board.’’
Circuitry Layer 22.0215
A layer of a printed board containing conductors, including
ground and voltage planes.
Circumferential Separation 96.1349
A crack or void in the plating extending around the entire
circumference of as plated through hole, a solder fillet
around lead wire or eyelet, or the interface between a sol-
der fillet and a land.
Circumferential Thermodes 74.1734
A contact tool used for inner-lead and outer-lead gang
bonding.
Clad (adj.) 55.1350
A condition of the base material to which a relatively-thin
layer or sheet of metal foil has been bonded to one or both
of its sides, e.g. ‘‘a metal-clad base material.’’
Clearance Hole 22.1811
A hole in a conductive pattern that is larger than, and
coaxial with a hole in the base material of a printed board.
(See Figure C-3.)
Clinched Lead 72.1351
A component lead that is inserted through a hole in a
printed board and is then formed in order to retain the
component in place and in order to make metal-to-metal
contact with a land prior to soldering. (See also ‘‘Partially-
Clinched Lead.’’)
Clinched-Wire Interfacial Connection 72.0217
see ‘‘Clinched-Wire Through Connection.’’
Clinched-Wire Through Connection 72.1352
A connection made by a bare wire that has been passed
through a hole in a printed board and subsequently formed
(clinched) and soldered to the conductive pattern on each
side of the board. (See Figure C-4.)
Closed-Entry Contact 37.0218
A type of female connector contact that prevents the entry
of an oversized mating part. (See also ‘‘Open-Entry Con-
tact.’’)
Co-Firing 56.0219
The simultaneous processing of thick-film circuit elements
during one firing cycle.
Coaxial Cable 37.0220
A cable in the form of a central wire surrounded by a con-
ductor tubing or sheathing that serves as a shield and
return.
Coefficient of Thermal Expansion (CTE) 40.0221
The linear dimensional change of a material per unit
change in temperature. (See also ‘‘Thermal Expansion Mis-
match.’’)
Cohesion Failure 96.0222
The rupture of an adhesive bond such that the separation
appears to be within the adhesive.
Coined Lead 22.0223
The end of a round lead that has been formed to have par-
allel surfaces that approximate the shape of a ribbon lead.
Cold Hand Cleaning 76.0224
Cleaning with a soft brush and rinsing in a small open tank
of chlorinated solvent or isopropanol. (Propan-2-01.)
Cold Machine Cleaning 76.0225
Cleaning with a chlorinated solvent and an inline brush or
wave cleaner.
IPC-I-001035
Figure C–3 Clearance hole
Conductive Pattern
Clearance Hole
IPC-I-001027
Figure C–4 Clinched-wire through connection
Solder
Lead
Conductive
Pattern
▼
▼
▼
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