IPC-T-50F_.pdf.pdf - 第95页
37.0329 Cup Solder T erminal 37.0405 Drain W ire 37.0412 Edge-Board Connector 37.0466 Eyelet 37.0486 FCC System 37.0518 Fixed Contact 37.0522 Flat Cable 37.0533 Floating Bushing 37.1405 Fork Contact 37.0583 Guide Pin 37.…
26.1303 Y Axis
26.1809 Z Axis
29 Other (Engineering and Design Issues)
29.0034 Ambient
3 Components for Electronic Packaging
30 General (Component Description Issues)
30.0016 Active Device
30.0019 Add-On Component
30.0236 Component
30.1356 Component Lead
30.0240 Component Pin
30.1735 Component Thermal Masses
30.1737 Cubic Components
30.1738 Cylindrical Components
30.1739 Date Code
30.0369 Device
30.0392 Discrete Component
30.0436 Embedded Component
30.0594 Heatsink
30.1426 Integrated Circuit
30.0681 Large-Scale Integration (LSI)
30.1754 Leadless Component
30.0757 Microcircuit
30.0758 Microcomponents
30.0759 Microelectronics
30.0777 Monolithic Integrated Circuit
30.1460 Package
30.0821 Package Cap
30.0053 Package Cover
30.0822 Package Lid
30.1468 Passive Component (Element)
30.0844 Perimeter Sealing Area
30.0872 Plastic Device
30.1289 Semiconductor
30.1520 Separable Component Part
30.1031 Stud-Mount Termination
30.1772 Surface Mounting Device (SMD)
30.1034 Surface-Mount Component (SMC)
30.1069 Thermal Shunt
30.1559 Very Large-Scale Integration (VLSI)
31 Discrete & IC Through-Hole Component Packages
31.0067 Axial Lead
31.1387 Dual-Inline Package
31.1224 Leaded Chip Carrier
31.1273 Sacrificial-Foil Laminate
31.0942 Single-Inline Package (SIP)
32 Discrete Surface Mount Component Packages
32.0984 Solid-Tantalum Chip Component
33 I/C Package Types for Surface Mounting
33.0100 Beam Lead
33.0098 Beam-Lead Device
33.0182 Castellation
33.0208 Chip Carrier
33.0295 Coplanar Leads
33.0523 Flat Pack
33.1435 Leaded Surface-Mount Component
33.1436 Leadless Chip Carrier
33.0694 Leadless Device
33.1437 Leadless Inverted Device
33.1438 Leadless Surface-Mount Component
33.0869 Planar-Mount Device
35 Bare Die
35.0151 Broken Pick
35.0205 Chip
35.0373 Dice
35.0375 Die
35.0400 Doping
35.0666 Junction Temperature
35.0949 Slice
35.1122 Uncased Device
35.1145 Wafer
36 Component and Lead/Termination Properties
36.0006 Accordion Contact
36.0017 Active Metal
36.0075 Backfill
36.1337 Bellows Contact
36.1810 Bifurcated Contact
36.1732 Butt Leads
36.1345 Carrier Tape
36.0243 Compression Seal
36.1741 Dissolution of Metalization
36.0424 Elastomeric Connector
36.1747 Gull Wing Leads
36.0590 Header (Module)
36.1752 J-Leads
36.0688 Lead
36.0696 Lead Pin
36.0698 Lead Wire
36.0785 Multilayer Carrier Tape
36.0807 Omnibus Ring
36.1764 Rectangular Leads
36.1528 Single-Layer Carrier Tape
36.1025 Stress Relief
36.1033 Support Ring
36.1546 Three-Layer Carrier Tape
36.1554 Two-Layer Carrier Tape
36.1164 Window (Carrier Tape)
37 Components for Wiring and Cabling
37.0106 Bifurcated Solder Terminal
37.1338 Birdcage
37.0145 Boss (Connector)
37.0169 Bus Bar
37.0203 Chemical Wire Stripping
37.0218 Closed-Entry Contact
37.0220 Coaxial Cable
37.0265 Connector
37.0271 Connector Housing
37.0272 Connector Tang
37.0268 Connector, Two-Part, Printed Board
37.0282 Contact Spring
37.0318 Crimp Contact
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37.0329 Cup Solder Terminal
37.0405 Drain Wire
37.0412 Edge-Board Connector
37.0466 Eyelet
37.0486 FCC System
37.0518 Fixed Contact
37.0522 Flat Cable
37.0533 Floating Bushing
37.1405 Fork Contact
37.0583 Guide Pin
37.0588 Haywire
37.0589 Header (Connector)
37.0602 Hermaphroditic Contact
37.0606 High-Voltage Wire
37.0619 Hook Solder Terminal
37.1420 Insert (Connector)
37.0653 Interface resistance
37.0665 Jumper Wire
37.0668 Key
37.1430 Keying (n.)
37.1431 Keying (v.)
37.0669 Keyway
37.0683 Latch (Connector)
37.0731 Machined Contact
37.0739 Margin (Flat Cable)
37.0809 One-Piece Connector
37.0813 Open-Entry Contact
37.1469 Perforated (Pierced) Solder Terminal
37.0880 Plug Connector
37.0889 Post
37.0905 Pressfit Contact
37.1313 Receptacle Connector
37.1242 Removable Contact
37.1255 Ribbon Cable
37.1256 Ribbon Interconnect (n.)
37.1239 Scoop-Proof Connectors
37.1299 Sheet-Metal Contact
37.0954 Socket Contact
37.0980 Solder Terminal
37.0992 Spade Contact
37.1014 Standoff Solder Terminal
37.1023 Strain Relief (connector)
37.1051 Terminal
37.1552 Turret Solder Terminal
37.1115 Two-Piece Contact
37.1167 Wiping Action
37.1567 Wire Stripping
4 Materials for Electronic Packaging
40 General (Material Issues)
40.0035 Amorphous Polymer
40.1727 Absorption Coefficients
40.1334 Base Material
40.0091 Basis Material
40.0183 Catalyst (Resin)
40.0221 Coefficient of Thermal Expansion
40.0250 Conductivity (Electrical)
40.0316 Creep
40.0326 Crosslink
40.0328 Crystalline Polymer
40.0377 Dielectric
40.0383 Dimorphism
40.1800 Flat Conductor
40.1813 Insulator
40.0870 Plastic
40.0871 Plastic Deformation
40.1479 Polymer
40.0884 Polymerize
40.1246 Resin
40.1071 Thermoplastic
40.1544 Thermoset
41 Rigid Printed Board Substrate Materials (Organic)
41.1320 Adhesive-Coated Catalyzed Laminate
41.1323 Adhesive-Coated Uncatalyzed Laminate
41.1343 B-Stage
41.0069 B-Staged Material
41.0070 B-Staged Resin
41.0111 Bismaleimide
41.0112 Bismaleimide Triazine
41.1339 Blank
41.0114 Blends
41.0152 Brominated Epoxy
41.0170 Butter Coat
41.0171 C-Staged Resin
41.0374 Dicyanidiamide
41.0393 Dispersant (Organosol)
41.0394 Disperse Phase (Suspension)
41.0395 Dispersing Agent
41.1743 Epoxy Glass Substrate
41.0445 Epoxy Novolac
41.0555 Functionality, Resin or Curing Agent
41.0673 Laminate Thickness
41.1609 Metal-Clad Base Material
41.0752 Metal-Clad Laminate
41.0819 Oxide Transfer
41.1463 Panel
41.0903 Preimpregnated Bonding Sheet
41.0904 Prepreg
41.1505 Resin-Rich Area
41.1507 Resin-Starved Area
41.1207 Substrate
41.1142 Volume Ratio (Composite)
42 Flexible Printed Board Substrate Materials (Org.)
42.0303 Cover Coat
42.0304 Cover Lay (Flexible Circuit)
42.0305 Cover Layer
43 Inorganic Substrates for Interconnecting Structures
43.1730 Alumina Substrate
44 Reinforcement/Constraining Core/Heat Dissipation
Materials
44.0045 Aramid
44.0099 Beaming
44.0105 Bias (Fabric)
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44.0146 Bow (Fabric)
44.0273 Constraining Core
44.0298 Coronizing
44.0315 Creel
44.0355 Denier
44.0423 E Glass
44.0442 End Missing
44.0487 Feather Length
44.0496 Fill
44.0497 Filler
44.0506 Finished Fabric
44.0516 Fish Eye
44.0528 Flexural Strength
44.0531 Float
44.0565 Gelation Particle
44.0569 Glass Binder
44.0575 Grading Frame
44.0578 Greige
44.0591 Heat Cleaning
44.0596 Heavy Mark (Fabric)
44.0702 Leno End Out
44.0708 Light Mark (Fabric)
44.0723 Loom Beam
44.0741 Mark (Fabric)
44.0769 Mis-Pick
44.1464 Para-aramid
44.0834 Passive Base Material
44.0861 Pick
44.0868 Plain Weave
44.0878 Plied Yarn
44.1202 Quill
44.1230 Reed
44.1266 Roving
44.1516 Satin Weave
44.1284 Section Beam
44.1288 Selvage
44.0930 Shuttle
44.0948 Sizing
44.0999 Split (Fabric)
44.1027 Stripback
44.1032 Supporting Plane
44.1047 Tear (Fabric)
44.1049 Tenter Frame
44.1112 Trumeter
44.1127 Unfil
44.1149 Warp Size
44.1148 Warper
44.1564 Waste (Fabric)
44.1153 Waviness
45 Conductive Materials (Foil, Film or Plating)
45.0054 As-Fired
45.0088 Base Metal
45.0092 Basis Metal
45.0180 Carrier (Foil)
45.0202 Chemical Vapor Deposition
45.0249 Conductive Foil
45.0358 Dent
45.0425 Electrodeposited Foil
45.0500 Film
45.0501 Film Conductor
45.0546 Foil Profile
45.0638 Indentation
45.1459 Outgrowth
45.1274 Sacrificial Protection
45.1545 Thick Film
45.1079 Thin Film
45.1080 Thin Foil
45.1174 Wrought Foil
46 Component Attachment Materials (Conductive/
Nonconductive)
46.0009 Acid Flux
46.0008 Acid-Core Solder
46.0012 Activated Rosin Flux
46.0015 Activator
46.1728 Adhesive
46.0044 Aqueous Flux
46.0539 Flux-Cored Solder
46.1514 Rosin
46.1262 Rosin Flux
46.0956 Solder
46.0965 Solder Cream
46.1818 Solder Paste
47 Coating and Permanent Masting Materials
47.0107 Binder
47.0742 Mask
47.0892 Potting Compound
47.0973 Solder Mask
47.1674 Solder Resist
49 Other (Material Issues)
49.0068 Azeotrope
49.1330 Azeotrope Mixture (Azeotrope)
49.0847 Copolymerize
49.1082 Thixotropic Ratio
49.1083 Thixotropy
5 Fabrication Processes for Interconnection Structures
50 General (Interconnection Structure Fab Processes)
50.0201 Chemically-Deposited Printed Circuit
50.0200 Chemically-Deposited Printed Wiring
50.1788 Delivered Panel (DP)
50.0771 Misregistration
50.1646 Multiple Printed Panel
50.1786 Production Printed Board (PPB)
50.1787 Production Panel (PP)
50.1240 Registration
50.1209 Subtractive Process
50.1542 Thermal Zone
51 Mechanical Processes
51.0081 Back Taper(s)
51.1341 Body Land Clearance
51.0181 Carry-Out
51.0193 Chamfer (Drill)
51.0209 Chipped Point
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