IPC-T-50F_.pdf.pdf - 第58页

Printed Component 52.0914 A part (such as an inductor , resistor, capacitor , or transmis- sion line) that is formed as part of the conductive pattern of a printed board. Printed Components, Conductive Inks 52.1600 Compo…

Pregelation Particle 92.0901

A white spot in a printed board that will not propagate as

the result of a thermal excursion.

Preheat (n.) 56.0902

A preliminary phase of a process during which the product

is heated at a predetermined rate from ambient temperature

to a desired elevated temperature.

Preheating (v.) 56.1483

The raising of the temperature of a material(s) above the

ambient temperature in order to reduce the thermal shock

and to inﬂuence the dwell time during subsequent elevated-

temperature processing.

Preimpregnated Bonding Sheet 41.0903

see ‘‘Prepreg.’’

Prepreg 41.0904

A sheet of material that has been impregnated with a resin

cured to an intermediate stage, i.e., B-staged resin.

Pressfit Contact 37.0905

An electrical contact that can be pressed into a hole in an

insulator or printed board with or without plated-through

holes.

Pretinning 53.0906

see ‘‘Tinning’’

Primary Flare 51.0907

A condition whereby the drill’s primary relief is wider at its

periphery than it is at its center. (See Figure P-2.)

Primary Stage of Manufacture 92.0909

That time during the manufacturing of a product when it is

ready for inspection prior to shipment.

Primary Relief 51.0908

The clearance angle at the outer corner of the cutting edge

of the cutting edge of a drill point.

Primary Side 22.1484

The side of a packaging and interconnecting structure that

is so deﬁned on the master drawing. (It is usually the side

that contains the most complex or the most number of

components.)

Primary Taper 51.0910

A condition whereby the primary relief is wider at the cen-

ter of a drill than it is at the periphery. (See Figure P-3.)

Printed Board (PB) 60.1485

The general term for completely processed printed circuit

and printed wiring conﬁgurations. (This includes single-

sided, double-sided and multilayer boards with rigid, ﬂex-

ible, and rigid-ﬂex base materials.)

Printed Board Assembly 80.0911

The generic term for an assembly that uses a printed board

for component mounting and interconnecting purposes.

Printed Board Assembly Drawing 26.1486

The document that shows a printed board, separately

manufactured components, and any information necessary

to describe the joining of them together in order to perform

a speciﬁc function.

Printed Circuit 60.0912

A conductive pattern that is composed of printed compo-

nents, printed wiring, discrete wiring, or a combination

thereof, that is formed in a predetermined arrangement on

a common base. (This is also a generic term that is used to

describe a printed board that is produced by any of a num-

ber of techniques.)

Printed Circuit Board 60.1487

Printed board that provides both point-to-point connections

and printed components in a predetermined arrangement on

a common base. (See also ‘‘Printed Wiring Board.’’)

Printed Circuit Board Assembly 80.0913

An assembly that uses a printed circuit board for compo-

nent mounting and interconnecting purposes.

IPC-I-002325

Figure P–2 Primary ﬂare

Primary Flare

▼

IPC-I-002324

Figure P–3 Primary taper

Primary Taper

▼

June 1996 IPC-T-50F

Printed Component 52.0914

A part (such as an inductor, resistor, capacitor, or transmis-

sion line) that is formed as part of the conductive pattern

of a printed board.

Printed Components, Conductive Inks 52.1600

Component (e.g. printed inductor, resistor, capacitor or

transmission line) forming part of the pattern of a printed

circuit.

Printed Contact 22.0915

A portion of a conductive pattern that serves as one part of

a contact system.

Printed Edge-Board Contact 22.0916

see ‘‘Edge-Board Contact.’’

Printed Wiring 60.1488

A conductive pattern that provides point-to-point connec-

tions but not printed components in a predetermined

arrangement on a common base. (See also ‘‘Printed Cir-

cuit.’’)

Printed Wiring Board 60.1489

A printed board that provides point-to-point connections

but not printed components in a predetermined arrange-

ment on a common base. (See also ‘‘Printed Circuit

Board.’’)

Printed Wiring Board Assembly 80.0917

An assembly that uses a printed wiring board for compo-

nent mounting and interconnecting purposes.

Printing 52.1592

Act of reproducing a pattern on a surface by any process.

Probe Point 92.0919

The predetermined location on a printed board where elec-

trical contact can be made to exposed circuitry for electri-

cal diagnostic purposes.

Probe, Test 92.0918

A spring-loaded metal device used to make electrical con-

tact between a test equipment and the unit under test.

Process Average 91.0920

The location of the distribution of measured values of a

particular process characteristic.

Process Indicator 91.0921

A detectable anomaly, other than a defect, that is reﬂective

of material, equipment, personnel, process and/or work-

manship variations.

Process Spread 91.0922

The extent to which the individual values of a process may

vary.

Processability 70.1763

Suitable and capable of being processed.

Producer’s Risk 93.0923

see ‘‘Alpha Error.’’

Production Board 60.1490

A printed board or discrete-wiring board that has been

manufactured in accordance with the applicable detailed

drawings, speciﬁcations, and procurement requirements.

Production Master 24.1642

A 1 to-1 scale pattern that is used to produce rigid or ﬂex-

ible printed boards within the accuracy speciﬁed on the

master drawimg. (See also ‘‘Multiple-image Production

Master’’ and ‘‘Single Image Production Master’’).

Production Panel (PP) 50.1787

An arrangement of printed boards fabricated from laminate

or base materials as a group in a speciﬁc cluster to facili-

tate economic fabrication techniques using controlled and

documented chemical, mechanical and electrical processes.

Production Printed Board (PPB) 50.1786

A printed board fabricated from laminate or base materials

in an environment that consists of controlled and docu-

mented chemical, mechanical and electrical processes used

in combination to produce the features and characteristics

of the ﬁnal printed board product.

Profile Factor 92.1492

The amount by which the overall average thickness of a

metal exceeds the thickness that is calculated from the

established density of the metal and the area of the sample.

Propagation Delay 21.1493

The time required for an electronic signal to travel along a

transmission line, or the time required for a logic device to

perform its function and to present a signal at its output.

Proportional Dimensions 92.0924

The distortion of an optical system used in a magnification

device.

Pull Strength 92.0925

see ‘‘Bond Strength.’’

Pull-Out Strength 97.1816

The force, normal to the printed board, required to seperate

the metallic wall of a plated-through hole from the base

material.

Pulse, Electronic Signal 21.1494

A logic signal that switches from one digital state to the

other and back again in a short period of time, and that

remains in the original state for most of the time

IPC-T-50F June 1996

Pulse Soldering 75.0926

Soldering by the heat generated by pulsing an electrical

current through a high resistance point of the joint area and

the solder.

Pure Sum of Squares 91.0927

The net or true average effect of a factor. (See also ‘‘Sum

of Squares.’’)

Push-Off Strength 97.0928

The force required to dislodge a leadless component by the

application of a force that is parallel to the surface upon

which it is mounted.

Qualification Agency 94.1212

The organization that is used to perform documentation

reviews and audits of an inspection or testing facility.

Qualification Testing 94.1213

The demonstration of the ability to meet all of the require-

ments speciﬁed for a product.

Qualitative Analysis 92.1214

The subdivision of chemistry concerned with the identiﬁ-

cation of materials.

Quality Conformance Testing 94.1496

Qualiﬁcation testing that is performed on a regularly-

scheduled basis in order to demonstrate the continued abil-

ity of a product to meet all of the quality requirements

speciﬁed.

Quality-Conformance Test Circuitry 92.1495

A portion of a printed board panel that contains a complete

set of test coupons that are used to determine the accept-

ability of the board(s) on the panel.

Quantitative Analysis 92.1215

The subdivision of chemistry concerned with the determi-

nation of the percentage composition of mixtures or the

constituents of a pure compound.

Quasi-Interfacial Connection 22.1216

see ‘‘Interfacial Connection.’’

Quasi-Interfacial Plated-Through Hole 22.1201

see ‘‘Nonfunctional Interfacial Connection.’’

Quill 44.1202

A bobbin onto which ﬁlling yarns are wound.

Radiant Flux 56.1304

The amount of power that is incident on a surface,

expressed in watts.

Radiant Intensity 56.1305

The amount of power from a point source that is generated

through a solid angle, measured in watts per steradian.

Radiator, Focused 56.1306

A reﬂector that is incorporated in the back of an emitter for

the purpose of concentrating energy to produce a point or

line of heat.

Radiator, Nonfocused 56.1307

A diffusing reﬂector that is incorporated in the back of an

emitter for the purpose of scattering energy over an area.

Radiometry 24.1308

The measurement of radiation in the optical spectrum.

(This includes infrared (IR), ultraviolet (UV), and visible.)

Random Sample 91.1311

A set of individuals that is taken from a population in such

a way that each possible individual in the population has an

equal chance of being selected.

Random-Effects Model 91.1497

A speciﬁc experimental treatment whereby a random

sample is taken from a large population of treatments in

such a manner that the conclusions reached can be

extended to the entire population and the inferences are not

restricted to the experimental levels.

Randomization 91.1309

The random selection of experimental runs in order to

minimize biases that are due to unknown or uncontrollable

factors in an experimental design.

Randomness 91.1310

A situation in which any individual event has the same

mathematical probability of occurring as does all of the

other events within the set of events.

Rebond 74.1312

A termination made at, on top of, or adjacent to, the loca-

tion of a prior bond.

Receptacle Connector 37.1313

The ﬁxed or stationary half of a two-piece connector pair

that mates with a plug connector.

Reciprocity Failure 91.1314

The deviation from the Reciprocity Law.

Reciprocity Law 91.1498

A general law that pertains to photo-chemical reactions that

states the mass of photoproduct from such a reaction is

determied simply by the total exposure involved.

June 1996 IPC-T-50F