IPC-T-50F_.pdf.pdf - 第30页
Etchant 54.0450 A solution used to remove the unwanted portion of mate- rial from a printed board by a chemical reaction. Etchback 54.1389 The controlled removal by a chemical process, to a specific depth, of nonmetallic…
Elastomeric Connector 36.0424
A pliant strip of flexible material with insulating and con-
ductive elements intended for providing electrical intercon-
nections.
Electrical Characteristics 21.1742
The distinguishing electrical traits or properties of a com-
ponent or assembly.
Electrodeposited Foil 45.0425
A metal foil that is produced by electrodeposition of the
metal onto a material acting as a cathode.
Electrodeposition 53.0426
The deposition of a conductive material from a plating
solution by the application of electrical current.
Electroless Deposition 53.0427
The deposition of conductive material from an autocata-
lytic plating solution without the application of electrical
current.
Electroless Plating 53.0428
see ‘‘Electroless Deposition.’’
Electrolytic Cleaning 76.0429
Cleaning in which a current is passed through an alkaline
solution with the part to be cleaned being one of the elec-
trodes.
Electrolytic Deposition 53.0430
see ‘‘Electrodeposition.’’
Electromagnetic Interference (EMI) 21.0431
Unwanted radiated electromagnetic energy that couples
into electrical conductors.
Electron-Beam Bonding 74.0432
Terminations made by heating with a stream of electrons in
a vacuum.
Electroplating 53.0433
see ‘‘Electrodeposition.’’
Elementary Diagram 26.0434
A computer-generated schematic diagram with annotations.
Elongation 70.0435
The increase in length of a material that is caused by a ten-
sile load.
Embedded Component 30.0436
A discrete component that is fabricated as an integral part
of a printed board.
Emulsifying Agent 76.0437
A substance that increases the stability of an emulsion.
Emulsion 76.0439
A stable mixture of two or more immiscible liquids held in
suspension by small percentages of emulsifiers.
Encapsulant 76.0440
see ‘‘Potting Compound.’’
End Item 20.0441
see ‘‘End Product.’’
End Product 20.0443
An individual part or assembly in its final completed state.
End Missing 44.0442
A very small portion of the warp in a fabric that may have
been broken in the pick-out of waste material.
Engineering Drawing 26.0444
A document that discloses the physical and functional end-
product requirements of an item by means of pictorial
and/or textual presentations.
Epoxy Glass Substrate 41.1743
A two-part epoxy resin that polymerizes spontaneously
when the two components are mixed, combined with glass
fiber to form a substrate
Epoxy Novolac 41.0445
A multifunctional resin having epoxy groups attached to a
novolac group(s).
Epoxy Smear 51.0446
see ‘‘Resin Smear.’’
Equivalent Series Resistance (ERS) 21.0447
A loss parameter used to compare two capacitors of equal
value in order to determine their relative effectiveness as
filters.
Escape Rate 94.0448
The ratio of the number of defective items not detected to
the total number inspected, expressed as a percentage.
Escapes 94.0449
Critical defects that are missed by an inspection system.
Etch Factor 54.0452
The ratio of the depth of etch to the amount of lateral etch,
i.e., the ratio of conductor thickness to the amount of
undercut.
June 1996 IPC-T-50F
25
Etchant 54.0450
A solution used to remove the unwanted portion of mate-
rial from a printed board by a chemical reaction.
Etchback 54.1389
The controlled removal by a chemical process, to a specific
depth, of nonmetallic materials from the sidewalls of holes
in order to remove resin smear and to expose additional
internal conductor surfaces.
Etched Printed Boards 60.0451
A board having a conductive pattern that was formed by
the chemical removal of unwanted portions of a conductive
foil.
Etching 54.0453
The chemical, or chemical and electrolytic, removal of
unwanted portions of conductive or resistive material. (See
Figure E-1.)
Etching Indicator 54.1390
A wedge-shaped or other specified pattern that is affixed to
a conductive foil in order to indicate the quality of etching.
Ethanol 76.1744
A solvent used in cleaning electrical assemblies (Ethylalco-
hol).
Eutectic (n.) 75.1391
An alloy having the composition indicated by the eutectic
point on an equilibrium diagram or an alloy structure of
intermixed solid constituents formed by a eutectic reaction.
Eutectic (v.) 75.1392
An isothermal reversible reaction in which on cooling a
liquid solution is converted into two or more intimately-
mixed solids, with the number of solids formed being the
same as the number of components in the system.
Eutectic Die Attach 74.0454
The mounting of a semiconductor die to a base material
with a perform of a eutectic metal alloy that is brought to
its eutectic melting temperature.
Eutrophication 76.0455
The enrichment of either fresh or salt water by a chemical
element or compound.
Excess Solder Connection 75.1393
A solder connection that is characterized by the complete
obscuring of the surfaces of the connected metals and/or by
the presence of solder beyond the connection area.
Exchange Reaction 76.1317
A chemical reaction in which atoms of the same element in
two different molecules, or in two different positions in the
same molecule, transfer places.
Excising 73.0457
The cutting of the unterminated (outer) leads of an inner-
lead bonded die in order to separate it from the carrier tape
subsequent to further assembly processing.
Excitation Current 21.0458
The root-mean-square (RMS) current flowing in a selected
winding when the rated voltage and frequency is applied.
Exclusion Area 92.0459
A predetermined region where inspection is excluded.
Exfoliation 76.0460
Scaling from of a surface in flakes or layers as a result of
corrosion.
Experimental Error 93.0461
A variation that is due to a measurement error, a chance
occurence, and other factors.
External Layer 22.0462
A conductive pattern on the surface of a printed board.
Extraction, Liquid-Liquid 76.0463
see ‘‘Solvent Extraction.’’
Extraction Tool 77.0464
A device used for removing a contact from a connector
body or insert, a component from a socket, or a printed
board from its enclosure.
Extraneous Metal 91.0465
Unwanted metal, usually copper, that remains on a base
material after chemical processing.
Eyelet 37.0466
A short metallic tube, the ends of which can be formed
outward in order to fasten it within a hole in material such
as a printed board.
F
F (Fisher) Test 94.0468
A test that attempts to determine if two populations have
the same variance.
IPC-I-001030
Figure E–1 Etching indicator
OVERETCH
ACCEPTABLE
IPC-T-50F June 1996
26
F Ratio 93.0552
The ratio of one variance value to another.
Face Bonding 74.0469
Attaching a die to a base material with its circuitry facing
the base material.
Factorial Experiment 94.0470
An experimental design that evaluates every possible com-
bination of events.
False Alarm 92.0471
An anomaly identified by an inspection system that is not
a critical defect.
False Alarm Rate 92.0472
The ratio of the number of acceptable items detected to the
total number inspected, expressed as a percentage.
Far-End Crosstalk 21.0473
see ‘‘Forward Crosstalk.’’
Fatigue Life 96.0474
The number of cycles of stress that can be sustained prior
to failure for a stated test condition.
Fatigue Limit 96.0475
The maximum stress below which a material can presum-
ably endure an infinite number of stress cycles.
Fatigue Strength 96.1394
The maximum strength that can be sustained for a specific
number of cycles without failure, with the stress being
completely reversed within each cycle unless otherwise
stated.
Fatigue-Strength Reduction Factor (Kf) 96.1395
The ratio of the fatigue strength of a member or specimen
with no stress concentration to the fatigue strength with
stress concentration.
Fatty Acid 76.0476
A carboxylic acid derived from, or contained in, an animal
or vegetable fat or oil.
Fatty Ester 76.0477
A fatty acid with the active hydrogen replaced by the alkyl
group of a monohydric alcohol.
Fault 90.0478
Any condition that causes a device or circuit to fail to
operate in a proper manner.
Fault Dictionary 90.0479
A list of elements in which each element consists of a fault
signature that can be used to detect a fault.
Fault Isolation 92.0480
The identification process used to determine the location of
a fault to within a small number of replaceable compo-
nents.
Fault Localization 91.0481
The identification process used to determine the location of
a fault to within a general area of a circuit.
Fault Masking 92.0482
A condition that occurs when one fault conceals the exist-
ence of another.
Fault Modes 92.0483
The various ways faults may occur.
Fault Resolution 92.0484
A measure of the capability of a test process to perform
failure isolation.
Fault Signature 92.0485
The characteristic, unique erroneous response produced by
a specific fault.
Fault Simulation 92.1396
A process that allows for the prediction or observation of a
system’s behaviour in the presence of a specific fault with
actually having that fault occur.
FCC System 37.0486
A complete flat-conductor cabling system that is suitable
for installation under carpet squares. (See ‘‘Flat Cable.’’)
Feather Length 44.0487
The distance from the last warp end of a fabric to the end
of the pick.
Feature 22.0488
The general term that is applied to a physical portion of a
part, such as a surface, hole or slot.
Feature Window 74.0491
An opening in the insulation material of a carrier tape that
allows for the creation and bonding of separated leads.
Feature-Based Modeling 21.0489
A computer-based modeling method that is based on the
use of part features instead of geometric entities.
Feature-Location Record 25.0490
A type of record that defines lines, points, and annotations.
Fiber Exposure 91.0492
The exposure of reinforcing fibers that are within
machined, abraded, or chemical-attacked areas of a base
material. (See also ‘‘Weave Exposure.’’)
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