IPC-T-50F_.pdf.pdf - 第8页
Assembled Board 80.0057 see ‘ ‘Assembly .’ ’ Assembly 80.1327 A number of parts, subassemblies or combinations thereof joined together . (Note: This term can be used in conjunc- tion with other terms listed herein, e.g.,…
Alumina Substrate 43.1730
Aluminum oxide used as a ceramic substrate material.
Ambient 29.0034
The surrounding environment coming into contact with the
system or component in question.
Amorphous Polymer 40.0035
A polymer with a random and unstructured molecular con-
figuration.
Amplitude, Voltage 21.0036
The magnitude of a voltage as measured with respect to a
reference, such as a ground plane.
Analog Circuit 21.0037
An electrical circuit that provides a continuous relationship
between its input and output.
Analysis of Variance (ANOVA) 91.0038
The systematic method of statistically evaluating experi-
mental results in order to separate the sources of variation.
Anchoring Spur 22.1325
An extension of a land on a flexible printed board that
extends beneath the cover lay to assist in holding the land
to the base material. (See Figure A-2.)
Angled Bond 74.0039
The impression of the first and second bonds that are not
in a straight line.
Annotation 22.0040
Text, notes, or other identification, constructed by a
computer-aided system, intended to be inserted on a draw-
ing, map or diagram.
Annular Ring 60.0041
That portion of conductive material completely surround-
ing a hole.
Anodic Cleaning 57.0042
Electrolytic cleaning in which the work is the anode.
Apparent Field-of-View Angle 92.0043
The angular subtense of the field-of-view in the image
space of an optical system.
Aqueous Flux 46.0044
see ‘‘Water Soluble Organic Flux.’’
Aramid 44.0045
see ‘‘Para-aramid’’
Arc Resistance 92.0047
The resistance of a material to the effects of a high voltage,
low current arc (under prescribed conditions) passing
across the surface of the material. (The resistance is stated
as a measure of total elapsed time at that voltage required
to form a conductive path on the surface - material carbon-
ized by the arc).
Architecture 11.0046
The structure of a computer’s functional elements that
makes it possess specific maximum and minimum capabili-
ties.
Area Array Tape Automated Bonding 74.0048
Tape automated Bonding where some carrier tape termina-
tions are made to lands within the perimeter of the die.
Array 22.0049
A group of elements or circuits arranged in rows and col-
umns on a base material.
Artificial Intelligence 11.0050
The capacity of a machine to perform functions that are
normally associated with human intelligence, such as rea-
soning and learning.
Artwork 22.0051
An accurately-scaled configuration that is used to produce
the ‘‘Artwork Master’’ or ‘‘Production Master.’’ (See Fig-
ure A-3.)
Artwork Master 24.0052
An accurately-scaled, usually 1:1, pattern that is used to
produce the ‘‘Production Master.’’ (See Figure A-3.)
As-Fired 45.0054
The condition (values) of thick-film components or the
smoothness of ceramic base materials, after they have been
processed in a firing furnace and prior to trimming or pol-
ishing.
Aspect Ratio (Film) 74.0055
The ratio of the length of a film component to its width.
Aspect Ratio (Hole) 53.0056
The ratio of the length or depth of a hole to its preplated
diameter.
IPC-I-001023
Figure A–2 Lands with anchoring spurs
COVER LAY
ANCHORING
SPURS
June 1996 IPC-T-50F
3
Assembled Board 80.0057
see ‘‘Assembly.’’
Assembly 80.1327
A number of parts, subassemblies or combinations thereof
joined together. (Note: This term can be used in conjunc-
tion with other terms listed herein, e.g., ‘‘Printed Board
Assembly.’’)
Assembly Drawing 26.1328
A document that depicts the physical relationship of two or
more parts, a combination of parts and subordinate assem-
blies, or a group of assemblies required to form an assem-
bly of a higher order.
Assembly Language 11.0058
A computer language made up of brief expressions that an
assembler program can translate into a machine language.
Assignable Cause 91.0059
see ‘‘Special Cause.’’
Asymetric Stripline 21.0060
A stripline signal conductor that is embedded, but not cen-
tered, between two ground planes.
Attenuation 21.0061
The reduction in the amplitude of a signal due to losses in
the media through which it is transmitted. The unit of mea-
sure is decibles (dB).
Attributes Data 94.0062
Qualitative data that can be counted for recording and
analysis purposes.
Automated Component Insertion 72.0063
The act or operation of assembling discrete components to
printed boards by means of electronically-controlled equip-
ment.
Automatic Component Placement 22.0029
Software that automatically optimizes the layout of compo-
nents on a printed board.
Automatic Conductor Routing 22.0124
Software that automatically determines the placement of
interconnections on a printed board.
Automatic Dimensioning 25.1329
A computer-aided drafting function that automatically gen-
erates dimensions, leaders, arrowheads, etc., that make up
a complete set of documented dimensions.
Automatic Test Equipment 92.0064
Equipment that automatically analyzes functional or static
parameters in order to evaluate performance
Automatic Test Generation 92.0065
Computer generation of a test program based solely on cir-
cuit topology with little or no manual programming effort.
AWG Equivalent 92.0066
The American Wire Gauge (AWG) round-conductor num-
ber that is used to designate a flat conductor with an equal
cross-sectional area.
Axial Lead 31.0067
Lead wire extending from a component or module body
along its longitudinal axis.
Azeotrope 49.0068
see ‘‘Azeotropic Mixture’’
Azeotropic Mixture (Azeotrope) 49.1330
A liquid mixture of two or more substances that behaves
like a single substance. The vapor produced by partial
evaporization of the liquid has the same composition as the
liquid.
B
B-Stage 41.1343
An intermediate stage in the reaction of a thermosetting
resin in which the material softens when heated and swells,
but does not entirely fuse or dissolve, when it is in contact
with certain liquids. (See also ‘‘C- Staged Resin.’’)
B-Staged Material 41.0069
see ‘‘Prepreg.’’
B-Staged Resin 41.0070
A thermosetting resin that is in an intermediate state of
cure. (See also ‘‘C-Staged Resin.’’)
Back Annotation 21.0072
The process of extracting appropriate information from a
completed printed board design and inserting it on the
boards schematic diagram.
Back Bonding 74.0073
Attaching a die to a base material with its circuitry facing
away from the base material.
Back Mounting 74.0079
see ‘‘Back Bonding.’’
Back Taper(s) 51.0081
The constant decrease in diameter along the length of the
body of a drill.
Back-Bared Land 22.0071
A land in flexible printed wiring that has a portion of the
side normally bonded to the base dielectric material
exposed by a clearance hole.
IPC-T-50F June 1996
4
IPC-I-001025
Note:
The term ‘‘Original’’ may be used to preface any of the drafting and photographic-tooling terms used in this figure. The
‘‘Original’’ is not usually used in manufacturing processes. In the event a ‘‘Copy’’ is made, the copy must be of sufficient accuracy to
meet its intended purpose if it is to take on the name of any one of the terms used in this figure. Other adjectives may also be used
to help describe the kind of copy, i.e., ‘‘nonstable,’’ ‘‘first generation,’’ ‘‘record,’’ etc.
Figure A–3 Simplified flow chart of printed board design/fabrication sequence
PARTS LIST
SCHEMATIC DIAGRAM
LOGIC DIAGRAM
END PRODUCT
PERFORMANCE & TEST
REQUIREMENTS
MASTER
DRAWING
TEST/
PERFORMANCE
SPECIFICATION
PRINTED BOARD
ASSEMBLY
DRAWING
ARTWORK
MASTER
(See note.)
PRODUCTION
MASTER
(See note.)
MULTIPLE IMAGE
PRODUCTION MASTER
(See note.)
PANEL OR
PRINTED BOARD
(RIGID OR FLEXIBLE)
HOLES &
PROCESS
DATA
ARTWORK
(See note.)
ASSEMBLY
SEQUENCE/
PROCESS DATA
PRINTED
BOARD
ASSEMBLY
STANDARDS
MANUFACTURING
CAPABILITIES
Circuit Design
Packaging Design
Documentation
Manufacturing
Assembly
Test
FABRICATION
PROCESS
SPECIFICATION
PRINTED BOARD
LAYOUT
June 1996 IPC-T-50F
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