IPC-T-50F_.pdf.pdf - 第63页

Rigid Double-sided Printed Board 61.1577 Double-sided printed board, either printed circuit or printed wiring, using rigid base materials only . Rigid Multilayer Printed Board 61.1578 Multilayer printed board, either pri…

IPC-I-002768

Figure R–2 Printed board viewing orientations

Notes:

1. A precise definition of image tone and orientation necessitates that the orientation of the pattern and the legend be separately

identified. For example: Layer 1—Pos RR DN (Legend Corr. Read) or Layer 2—Pos RR UP (Legend Rev. Read) (There is no such

thing as wrong reading.)

2. By definition, all layer patterns are viewed from the same direction. (This view defines RR for the pattern appearance of all layers; this

is not the same as viewing the final board copper head on.)

3. Legend is usually correct reading when viewing the copper; therefore, on occasion alphanumerics must be reversed reading when

the pattern is right reading by definition.

4. Production master emulsion must be presented against the board copper in the stack up. Therefore, production master emulsion

orientation is opposite to individual copper layer orientation, i.e., if copper is RR UP by definition, corresponding production master

must be RR DN.

5. When specifying artwork tone and orientation, remember the board layup and the purpose of the artwork, i.e., file copy, artwork

master, or production master, etc.

6. In manual designs the artwork is usually prepared at an enlarged scale with tapes and other drafting aids. The artwork master is

produced from the artwork by photographic reduction.

7. In semi-automated designs, there may be no artwork by definition. Typically, an enlarged color-coded printed wiring layout on a

gridded format is prepared for subsequent digitizing and photoplotting. This procedure may yield intermediate phototools which can

be photographically processed into an artwork master or it may directly yield an artwork master, working master, or production

master.

8. In fully automated systems, there is usually no artwork or printed wiring layout prepared. A computerized procedure from a form of

the electrical schematic by total computerization or a combination of computer and interactive design procedures. This procedure

may yield intermediate phototools or the artwork master, working master, or production master directly.

Multilayer

Printed

Boards

Corresponding

Registered

Production

Master

L3 - RR

L4 - RR UP (Legend Rev. Read)

L4 - RR DN

(Legend Rev. Read)

Emulsion

L1 - RR UP

(Legend Corr. Read)

L1 - RR UP

(Legend 

Corr. 

Read)

Viewing Primary Side

Copper

Substrate Base Material

Substrate

Base Material

COPPER

EMULSION

▼ ▼

▼

L2 - RR UP

▼

L3 - RR DN

▼

Copper

▼

Viewing Component Side

▼

L2 - RR

IPC-T-50F June 1996

Rigid Double-sided Printed Board 61.1577

Double-sided printed board, either printed circuit or printed

wiring, using rigid base materials only.

Rigid Multilayer Printed Board 61.1578

Multilayer printed board, either printed circuit or printed

wiring, using rigid base materials only.

Rigid Printed Board 61.1571

A printed board using rigid base materials only.

Rigid Single-sided Printed Board 61.1576

Single-sided printed board, either printed circuit or printed

wiring, using rigid base materials only.

Rigid-flex Double-sided Printed Board 63.1584

Double-sided printed board, either printed circuit or printed

wiring, using combinations of rigid and ﬂexible base mate-

rials.

Rigid-Flex Printed Board 63.1258

A printed board with both rigid and ﬂexible base materials.

Rise Time 21.1259

The time required for a signal voltage to increase (switch)

from 10 to 90 % of its ﬁnal voltage level after a level

change has been initiated.

Risk Management Factor (RMF) 94.1777

The maximum tolerable percentage of possible defects

within a lot (group) of units, based on appoximately 95 %

conﬁdence level.

Roadmap 26.1260

A printed nonconductive pattern that delineates the compo-

nents and circuitry on a printed board in order to aid in

servicing and repairing the ﬁnal assembly.

Robber 53.1261

see ‘‘Plating Thief.’’

Rosin 46.1514

A hard, natural resin, consisting of abietic and primaric

acids and their isomers, some fatty acids and terpene

hydrocarbons, that is extracted from pine trees and subse-

quently reﬁned.

Rosin Flux 46.1262

Rosin in an organic solvent or rosin as a paste with activa-

tors.

Rosin Solder Connection 75.1515

A solder connection that has practically the same appear-

ance as does a cold solder connetion, but that also shows

evidence of entrapped rosin separating the surfaces to be

joined. (See also ‘‘Cold Solder Connection’’).

Rotational Error 25.1263

The angular misalignment of a functional pattern with

respect to the X and Y axes.

Router (CAD) 22.1264

A computer program that automatically determines paths

between points to be interconnected.

Routing Mark 25.1265

An artwork feature that is used to deﬁne the periphery of a

printed board.

Roving 44.1266

A collection of parallel strands of ﬁlaments assembled with

or without an intentional twist.

Rubber Banding 22.1267

A technique for displaying a straight line with one endpoint

ﬁxed and the other end following the commands of a

manual data input device.

Run (n.) 91.1268

A consecutive number of points that consistently increase

or decrease, or that are consistently above or below the

central line of a SPC control chart.

Run Chart 91.1269

A graphic representation of plotted values of some statistic

gathered from a process characteristic and a central line

that can be analyzed for runs.

Run Time 92.1271

The time elapsed while a unit is in an inspection or testing

machine.

Runout 24.1270

The sum of the cumulative-pitch error across a number of

functional patterns on a step-and-repeat phototool.

Runtime System 11.1272

The collection of software programs required to perform

the actual testing and diagnosis of a unit under test.

Sacrificial Protection 45.1274

The preferential corrosion of a metal coating in order to

protect the substrate metal.

Sacrificial-Foil Laminate 31.1273

A base material with a treated-metal foil which is subse-

quently removed, for the purpose of impressing a

microporous topography on the surface of the base mate-

rial.

Sagging 74.1275

see ‘‘Wire Sag.’’

June 1996 IPC-T-50F

Saponifier 76.1276

An aqueous organic- or inorganic-base solution with addi-

tives that promote the removal of rosin and/or water-

soluble ﬂux.

Satin Weave 44.1516

A fabric conﬁguration where the surface is almost entirely

made up of warp ﬁlling adjacent yarns, thereby producing

a smooth surface. (The intersection points do not fall in a

straight diagonal, or twill, but in a patterned formation.)

Scalar Processing 11.1277

The use of a computer architecture in which single opera-

tions are performed on data elements.

Scan Rate 92.0755

The rate at which a machine scans the surface of the unit

being evaluated, expressed in surface area per unit of time

or time per unit area of surface.

Scan-Dead Time 92.1278

The time during a scanning process when data is not being

collected from the unit being evaluated.

Scanner, Test 92.0693

A program controlled relay matrix used for connecting any

unit-under-test circuit mode to the analog instrument bus.

Scatter Diagram 94.0991

A graph that depicts the relationships between an indepen-

dent variable and a dependent response variable.

Schematic Diagram 26.1107

A drawing that shows, by means of graphic symbols, the

electrical connections, components and functions of a spe-

ciﬁc circuit arrangement.

Scoop-Proof Connectors 37.1239

Connectors that incorporate features that prevent contact

damage during mating and unmating.

Scratch 92.1203

A narrow furrow or groove in a surface. (It is usually shal-

low and caused by the marking or rasping of the surface

with a pointed or sharp object.)

Screen Printing 52.1204

The transferring of an image to a surface by forcing a suit-

able media with a squeegee through an imaged-screen

mesh.

Scribe Coat 24.1205

A stable base material, such as glass or ﬁlm, with an

opaque coating.

Scribing 24.1279

The cutting of the opaque coating, but not the base mate-

rial, on a scribe-coat material.

Scrubbing 74.1280

The rubbing of the lead wire and bonding land in order to

break up oxide layers and to improve bondability.

Search Height 74.1281

The height of a bonding tool above the bonding area prior

to it being lowered to make the termination.

Second Bond 74.1283

The second termination in a sequence of bonds made to

form a conductive path. (See also ‘‘First Bond.’’)

Secondary Relief 51.1282

The clearance angle that is behind the primary relief of a

drill point.

Secondary Side 22.1517

That side of a packaging and interconnecting structure that

is opposite the primary side. (It is the same as the ‘‘solder

side’’ on through-hole mounting technology.)

Section Beam 44.1284

A ﬂanged cylinder onto which yarn is drawn and accumu-

lated from the yarn bobbins or packages.

Sectional Specification (SS) 26.1783

A document that describes the speciﬁc requirements per-

taining to a portion of a set, family, or group of products,

materials or, services.

Seed Layer 53.1286

see ‘‘Activating Layer.’’

Seeding 53.1285

see ‘‘Activating.’’

Self Test 92.1287

The ability of an analyzer to appraise itself prior to per-

forming a test procedure.

Selvage 44.1288

The edge of the fabric where the body of the fabric ends as

deﬁned by the last warp yarn.

Semi-Additive Process 53.1518

An additive process wherein the entire thickness of

electrically- isolated conductors is obtained by the com-

bined use of electroless metal deposition and electroplat-

ing, etching, or both. (See also ‘‘Fully- Additive Process.’’)

Semiconductor 30.1289

A solid material, such as silicon, that has a resistivity that

is midway between that of a conductor and of a resistor.

IPC-T-50F June 1996