IPC-T-50F_.pdf.pdf - 第79页
Appendix A —A— AAGR Annual A verage Growth Rate ABS Acrylonitrile-Butadiene-Styrene (Plastic) AC Alternating Current AEC Architecture, Engineering and Construction AGV Automated Guided V ehicle AI Artifical Intelligence A…
Wiring Elementary 21.1171
see ‘‘Elementary Diagram.’’
Wobble Bond 74.1172
A thermocompression multicontact bond made by rocking
a bonding tool on a beam lead.
Working Master 24.1173
A 1-to-1 scale pattern that is used to reproduce the produc-
tion master.
Working Time 75.1568
The maximum period of time that an adhesive can be
exposed to ambient conditions with its chemical and physi-
cal properties remaining within satisfactory limits for
proper dispensing and bonding. (See also ‘‘Open Time.’’)
Wrinkles 76.1569
Ridges, creases or furrows in a coating or resist that are
formed after the material has adhered to a metal, such as
solder, that subsequently melts and resolidifies.
Wrought Foil 45.1174
A metal foil that is formed by the rolling of cast metal.
X
X Axis 26.1175
The horizontal or left-to-right direction in a two-
dimensional system of coordinates. (This axis is perpen-
dicular to the Y axis.)
Y
Y Axis 26.1303
The vertical or bottom-to-top direction in a two-
dimensional system of coordinates.
Z
Z Axis 26.1809
The Axis perpendicular to the plane formed by the X and
Y datum reference. This axis usually represents the thick-
ness of the boards.
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Appendix A
—A—
AAGR Annual Average Growth Rate
ABS Acrylonitrile-Butadiene-Styrene (Plastic)
AC Alternating Current
AEC Architecture, Engineering and Construction
AGV Automated Guided Vehicle
AI Artifical Intelligence
AIS Adhesive Interconnect System
ANOVA Analysis of Variance
ANSI American National Standards Institute
AOI Automated Optical Inspection
AOQ Average Outgoing Quality
APT Automatically Programmed Tools
AQL Acceptable Quality Level
ARINC Aeronautical Radio Incorporated
ASCII American Standard Code for Information
Interchange
ASIC Application Specific Integrated Circuit
ASTM American Society for Testing Materials
ATE Automatic Test Equipment
ATG Automatic Test Generation
ATR Air Transport Rack
AVT Accelerated Vesication Test
AWG American Wire Gauge
—B—
BDMA Benzyldimethylamine
BITE Built-In Test Equipment
BOD Biochemical Oxygen Demand
BOM Bill of Material
BT Bismaleimide Triazine
BTAB Bumped Tape-Automated Bonding
—C—
C3 Command, Control and Communicate
C4 Controlled Collapse Component Connection
CAD Computer-Aided Design
CAE Computer-Aided Engineering
CAFM Computer-Aided Facilities Management
CAGE Commercial and Government Entity
CALS Computer-Aided Acquisition and Logistic
Support (DOD)
CAM Computer-Aided Manufacturing
CAPP Computer-Aided Process Planning
CAR Computer-Aided Repair
CASE Computer-Aided Software Engineering
CAT Computer-Aided Testing
CCAPS Circuit Card Assembly and Processing System
CDA Copper Development Association
CFM Continuous Flow Manufacturing
CFM Cubic Feet per Minute
CIM Computer-Integrated Manufacturing
CISC Complex Instruction Set Computing
CITIS Contractor Integrated Technical Information
Services
CMOS Complimentary Metal-Oxide Semiconductor
CNC Computer Numerical Control
COB Chip-on-Board
COD Consumed Oxygen Demand
Cp Capability Performance
CPL Capability Performance, Lower
CPU Capability Performance, Upper
CPU Central Processing Unit (Computer)
CRT Cathode-Ray Tube
CSG Constructive Solids Geometry
CTE Coefficient of Thermal Expansion
—D—
DAB Designated Audit Body
DATC Design Automation Technical Committee (IEEE)
DBMS Database Management System
DC Direct Current
DCAS Defense Contract Administration Service
DCMA Defense Contract Management Agency
DCMC Defense Contract Management Command
DESC Defense Electronics Supply Center
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DIM Data-Information Record
DIN Deutsches Institute for Normung
DIP Dual-Inline Package
DLA Defense Logistics Agency (DOD)
DMSA Defense Manufacturers and Suppliers Associa-
tion
DNC Distributed (or Direct) Numerical Control
DOD Department of Defense
DOD Dissolved Oxygen Demand
DOS Disc Operating System
DRC Design Rule Checking
DRM Drawing Requirements Manual
DVM Digital Voltmeter
DXF Data Exchange Format
—E—
ECAD Electronic Computer-Aided Design
ECCB Electronic Components Certification Board
ECL Emitter-Coupled Logic
ECM Electronic Countermeasures
ECN Engineering Change Notice
ECO Engineering Change Order
EDA Electronic Design Automation
EDIF Electronic Design Interchange Format
EDM Electro-Discharge Machining
EIA Electronic Industries Association
EIS Engineering Information System
EMC Electromagnetic Compatibility
EMF Electro-Motive Force
EMI Electromagnetic Interference
EMP Electromagnetic Pulse
EMPF Electronics Manufacturing Productivity Facility
EPR Ethylene-Propylene (Copolymer) Resin
EPT Ethylene-Propylene Terepolymer
ESD Electrostatic Discharge
ESR Equivalent Series Resistance
ETPC Electrolytic Tough-Pitch Copper
—F—
FAA Federal Aviation Administration
FAR Failure Analysis Report
FCC Federal Communications Commission
FCC Flat-Conductor Cable
FEA Finite-Element Analysis
FEM Finite-Element Modeling
FEP Fluorinated Ethylene-Propylene (Teflon)
FET Field-Effect Transistor
FPT Fine-Pitch Technology
FSCM Federal Stock Code for Manufacturers
—G—
GaAs Gallium Arsenide
GBIB General Purpose Interface Bus
GMA Gas Metal Arc (Welding)
GTA Gas Tungsten Arc (Welding)
—I—
I/O Input/Output (Terminations)
IC Integrated Circuit
ICAM Integrated Computer-Aided Manufacturing
IDC Insulation-Displacement Connection
IEC International Electrotechnical Commission
IECQ International Electronic Component Qualifica-
tion System
IEEE Institute of Electrical and Electronic Engineers
IEPS International Electronic Packaging Society
IGES Integrated Graphics Exchange System
ILB Inner-Lead Bonding (TAB)
IPC Institute for Interconnecting and Packaging
Electronic Circuits
IR Infrared
ISHM International Society for Hybrid Microelectron-
ics
ISO International Standards Organization
ITT Inter-Test Time
—J—
JEDEC Joint Electronic Device Engineering Council
JIT Just-in-Time (Manufacturing)
—K—
KGB Known Good Board
—L—
LAN Local Area Network
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