IPC-T-50F_.pdf.pdf - 第53页

Para-aramid 44.1464 The generic term that describes ﬁbers that are made from wholly- aromatic polyamide, amide polymers in which at least 85 % of the amide linkages are directly attached to two benzene rings at the para …

Overcoat 76.0815

A thin ﬁlm of insulating material that is applied over a

semiconductor die for the purposes of mechanical and con-

tamination protecticon.

Overhang 60.0816

The sum of outgrowth and undercut. (See Figure O-3.) (If

undercut does not occur, the overhang is the same as the

outgrowth.)

Overheated Solder Connection 75.0817

A solder connection that is characterized by solder surfaces

that are dull, chalky, grainy, and porous or pitted.

Overlap (Film) 67.0818

The contact area between a ﬁlm component and a ﬁlm

conductor.

Overlap (Drill) 51.1229

The amount of misalignment between the trailing edge of

the junction line between the primary and secondary drill-

point clearance angles when they are behind the drill cen-

terline. (See Figures B-4 and O-4.) (See also ‘‘Layback.’’)

Overplate 53.1673

Conformal metallic deposition on a previously formed con-

ductive pattern or part thereof.

Oxide Transfer 41.0819

see ‘‘Treatment Transfer.’’

Oxygen Concentration Cell 76.0820

A galvanic cell resulting primarily from differences in oxy-

gen concentration.

Package 30.1460

The container for a circuit component, or components, that

is used to protect its contents and to provide terminals for

making connections to the rest of the circuit.

Package Cap 30.0821

A cuplike package cover.

Package Cover 30.0053

The cover that encloses the contents in the cavity of a

package in the ﬁnal sealing operation.

Package Lid 30.0822

A ﬂat package cover.

Packaging and Interconnecting Assembly 60.0823

The general term for an assembly that has components

mounted on either or both sides of a packaging and inter-

connecting structure.

Packaging and Interconnection Structure 60.1461

The general term for a completely processed combination

of base materials, supporting planes or constraining cores,

and interconnection wiring that are used for the purpose of

mounting and interconnecting components.

Packaging Density 20.1462

The relative quantity of functions (components, intercon-

nection devices, mechanical devices, etc.) per unit volume.

(This is usually expressed by qualitative terms such as

high, medium, and low.)

Pad 20.0824

see ‘‘Land.’’

Panchromatic Emulsion 24.0825

A photographic emulsion that is spectrally sensitive to all

portions of the visible light spectrum.

Panel 41.1463

A rectangular sheet of base material or metal-clad material

of predetermined size that is used for the processing of one

or more printed boards and, when required, one or more

test coupons. (See also ‘‘Blank.’’)

Panel Drawing 26.0826

A document that shows the production master with related

manufacturing patterns and artifacts that relate to the fabri-

cation of printed boards.

Panel Plating 53.0827

The plating of an entire surface of a panel including holes.

IPC-I-001043

Figure O–3 Outgrowth, overhang, and undercut

CONDUCTOR WIDTH

PLATING

CONDUCTOR WIDTH AS ON

PRODUCTION MASTER

BASE MATERIAL

RESIST

METAL FOIL

OUTGROWTH

PLATING

IPC-I-002326

Figure O–4 Overlap

▼

Overlap

IPC-T-50F June 1996

Para-aramid 44.1464

The generic term that describes ﬁbers that are made from

wholly- aromatic polyamide, amide polymers in which at

least 85 % of the amide linkages are directly attached to

two benzene rings at the para position in the polymer

chain.

Parallel Pair 22.0828

Two conductors that are side-by-side at a controlled spac-

ing.

Parallel-Gap Soldering 75.1465

The passing of an electrical current through a high-

resistance space between two parallel electrodes in order to

provide the energy required to make a soldered termina-

tion.

Parallel-Gap Welding 75.1466

The passing of an electrical current through a high-

resistance space between two parallel electrodes in order to

provide the energy required to make a welded termination.

Parameter Record 25.0829

A record that deﬁnes the characteristics of a subsequent set

of records such as job identiﬁcation, electrical description,

tolerances, etc.

Pareto Analysis 94.0830

A problem-solving technique whereby all potential prob-

lem areas or sources of variation are ranked according to

their contribution to the end result.

Partial Lift 74.0831

A bonded lead that has been partial removed from the

bonding area.

Partially-Clinched Lead 72.1467

A component lead that is inserted through a hole in a

printed board and is then formed in order to retain the

component in place and but not necessarily in order to

make metal-to-metal contact with a land prior to soldering.

(See also ‘‘Clinched Lead.’’)

Passivation 57.0832

The formation of an insulating layer to protect a surface

from contaminants, moisture and particulate matter.

Passive Base Material 44.0834

Base material, that does not exhibit transistance, that serves

as the physical support and thermal sink for ﬁlm circuits.

Passive Component (Element) 30.1468

A discrete electronic device whose basic character does not

change while it processes an applied signal. (This includes

components such as resistors, capacitors, and inductors.)

Passive-Active Cell 76.0833

A cell whose electromotive force is due to the potential

difference between a metal in an active state and the same

metal in a passive state.

Paste Flux 75.0836

A ﬂux formulated in the form of a paste to facilitate its

application. (See also ‘‘Solder Paste’’ and ‘‘Solder-Paste

Flux.’’)

Paste, Soldering 75.0835

A soldering method that uses a solder paste applied to the

land, device termination, or both.

Path 20.0837

see ‘‘Conductor.’’

Pattern 20.0838

The conﬁguration of conductive and nonconductive mate-

rials on a base material, and the circuit conﬁguration on

related tools, drawings and masters.

Pattern Area 20.0839

The section of a designated conﬁguration that includes the

pattern and background.

Pattern Plating 53.0840

The selective plating of a conductive pattern.

Peel Strength 92.0841

The force per unit width that is required to peel a conduc-

tor foil from a laminate perpendicular to the surface of the

substrate.

Percent Contribution 91.0842

The amount that a single factor contributes to a total varia-

tion, expressed as a percent.

Percent of the Field of View 92.0843

The speciﬁc part of interest of the minimum required ﬁeld

of view of a magniﬁcation device.

Perforated (Pierced) Solder Terminal 37.1469

A ﬂat-metal solder terminal with an opening through which

one or more wires are placed prior to soldering. (See Fig-

ure P-1.)

Perimeter Sealing Area 30.0844

The surface on the perimeter of the cavity of a package that

is used for attachment to the package cover.

Permanent Resist 52.0845

A resist that is not removed after processing, e.g., plating

resist that is used in a fully-additive process.

June 1996 IPC-T-50F

Permeability 21.1803

A general term used to express various relationships

between magnetic induction and magnetizing force.

Permittivity 21.0846

see ‘‘Dielectric Constant.’’

Personality Plate 92.0234

A translator ﬁxture plate drilled to match the product under

test.

Photographic Fog 24.1470

Any unwanted increase in density on a negative-working

photographic product or a loss of density on a positive-

working product that appears on exposed and processed

glass ﬁlm or paper that is not the result of image exposure.

Photographic Image 24.0456

An image in a photomask or in an emulsion that is on a

ﬁlm or plate.

Photographic Layer 52.0850

A light-sensitive layer of material that is capable of being

exposed and processed so that it yields a visible image.

Photographic Operation 24.0851

A procedure or technique that prepares a phototool for sub-

sequent processing.

Photographic Plate 24.0852

A ‘‘soda-lime-silica’’ sheet of glass with a photographic

layer.

Photographic-Reduction Dimension 53.0255

The dimensions on an artwork master, such as the distance

between lines or between two speciﬁed points, tha indicate

the extent to which the artwork master is to be photo-

graphically reduced. (The value of the dimension refers to

the 1-to-1 scale and must be speciﬁed.)

Photomaster 24.0853

see ‘‘Artwork Master.’’

Photometry 24.0854

The measurement of the effect of the intensity and energy

of visible light on the human eye.

Photoplotting 24.0855

A photographic process whereby an image is generated by

a controlled- light beam that directly exposes a light-

sensitive material.

Photoprint 52.0856

The process of forming a circuit pattern image by harden-

ing a photosensitive polymeric material by passing light

through a photographic ﬁlm.

Photoresist 52.1472

A material that is sensitive to portions of the light spectrum

and that, when properly exposed can mask portions of a

base metal with a high degree of integrity.

Photoresist Image 52.0857

An exposed and developed image in a coating on a base

material.

Phototool 24.0858

A photographic product that is used to produce a pattern on

a material. (see also ‘‘Artwork,’’ ‘‘Artwork Master,’’ ‘‘Pro-

duction Master,’’ ‘‘Working Master.’’)

Phototooling 24.0859

The entire group of photographic products that are used to

produce an pattern on a base material.

Phototooling Aid 24.0860

A photographic product that is used to assist in the inspec-

tion of, but not the transfer of, imaged patterns.

Pick 44.0861

Filling yarn that runs crosswise to the entire width of a

fabric.

Pick-Up Force 73.1760

The force required to pick up a surface mounting compo-

nent from its packaging medium for placement on a sub-

strate.

Pick-Up Tool 73.1759

A tool used to pick up surface mount components from a

packaging medium for placement on a substrate and which

may be hand activated or a part of a pick-and-place

machine.

Pilot Hole 22.0862

see ‘‘Tooling Hole.’’

Pinhole (Material) 92.0863

An imperfection in the form of a small hole that penetrates

entirely through a layer of material. (See also ‘‘Pit’’ and

‘‘Solder Connection Pinhole.’’)

IPC-I-001024

Figure P–1 Perforated (pierced) solder terminal

IPC-T-50F June 1996