IPC-T-50F_.pdf.pdf - 第101页
75.0959 Solder Ball 75.1767 Solder Bath 75.0960 Solder Bridging 75.0963 Solder Connection 75.0964 Solder Connection Pinhole 75.0966 Solder Embrittlement 75.0967 Solder Fillet 75.1766 Solder Meniscus 75.0974 Solder Plug 7…
74.0235 Compliant Bond
74.0275 Contact Angle (Bonding)
74.0311 Cratering
74.0336 Cut-Off
74.0376 Die Bonding
74.0379 Diffusion Bond
74.0418 Edge Short
74.0432 Electron-Beam Bonding
74.0454 Eutectic Die Attach
74.0469 Face Bonding
74.0491 Feature Window
74.0512 First Bond
74.0513 First Radius
74.0514 First Search
74.0520 Flag
74.0521 Flame-Off
74.0530 Flip Chip
74.0529 Flip-Chip Mounting
74.0532 Floating-Annulus Tape-Automated Bonding
74.0547 Foot Length
74.0551 Frame Pitch
74.0562 Gang Bonding
74.0598 Heel, Bonding
74.0620 Horn
74.0646 Inner-Lead Bond (ILB)
74.0680 Lap Shear Strength
74.0692 Lead Frame
74.0756 Microbond
74.0770 Mislocated Bond
74.0793 Nailhead Bond
74.0796 Neckbreak
74.0804 Off Bond
74.1198 Outer-Lead Bond (OLB)
74.0831 Partial Lift
74.1312 Rebond
74.1275 Sagging
74.1280 Scrubbing
74.1281 Search Height
74.1283 Second Bond
74.1290 Semiconductor Carrier
74.0943 Single-Point Bonding
74.0952 Smeared Bond
74.0961 Solder Bump
74.0983 Solid-State Bond
74.1003 Sprocket
74.1021 Stitch Bond
74.1543 Thermocompression Bonding
74.1072 Thermosonic Bonding
74.1095 Torsional Strength
74.1100 Transfer-Bump Tape Automated Bonding
74.1119 Ultrasonic Bonding
74.1157 Wedge Bond
74.1158 Wedge Tool
74.1168 Wire Bonding
74.1169 Wire Sag
74.1172 Wobble Bond
75 Joining Techniques
75.1681 Condensation Soldering
75.1326 Contact Angle (Soldering)
75.0289 Controlled Collapse, Component Connection
75.0288 Controlled Collapse Soldering
75.1736 Convected Energy
75.0300 Corrosive Flux
75.1382 Dip Soldering
75.1386 Drag Soldering
75.0410 Dross
75.1391 Eutectic (n.)
75.1392 Eutectic (v.)
75.1393 Excess Solder Connection
75.0498 Fillet, Adhesive
75.0499 Fillet, Solder
75.0536 Flow Soldering
75.0538 Flux
75.0540 Flux Activation Temperature
75.0541 Flux Activity
75.1745 Fluxing
75.1746 Forced Gas Convention Soldering
75.1404 Foreign Material (Soldering)
75.0564 Gas Blanket
75.0585 Hand Soldering
75.0587 Hard Wiring
75.0592 Heat Column
75.1416 Heatsink Tool
75.1748 Hot Plate Reflow Soldering
75.0631 Icicle
75.1749 Immersion Attitude
75.1751 Infra-Red Reflow (IR)
75.0647 Inorganic Flux
75.1428 Intermetallic Compound, Solder
75.1753 Laser Soldering
75.0687 Leaching, Metalization (v.)
75.0691 Lead Extension
75.0737 Manual Soldering
75.1678 Mass Soldering
75.0749 Mechanical Wrap
75.0780 Muffle
75.1183 Nonactivated Flux
75.1189 Nonwetting (Solder)
75.1194 Open Time
75.0817 Overheated Solder Connection
75.1465 Parallel-Gap Soldering
75.1466 Parallel-Gap Welding
75.0836 Paste Flux
75.0835 Paste, Soldering
75.0886 Porosity (Solder)
75.0899 Preferred Solder Connection
75.0926 Pulse Soldering
75.1500 Reflow Soldering
75.1235 Reflow Spike
75.1247 Resin Flux
75.1248 Resistance Soldering
75.1249 Resistance Welding
75.1515 Rosin Solder Connection
IPC-T-50F June 1996
96
75.0959 Solder Ball
75.1767 Solder Bath
75.0960 Solder Bridging
75.0963 Solder Connection
75.0964 Solder Connection Pinhole
75.0966 Solder Embrittlement
75.0967 Solder Fillet
75.1766 Solder Meniscus
75.0974 Solder Plug
75.0975 Solder Projection
75.0979 Solder Spatter
75.0981 Solder Webbing
75.0982 Solder Wicking
75.0957 Solder-Paste Flux
75.0958 Solderability
75.0968 Soldering
75.0970 Soldering Flux
75.1768 Soldering Iron
75.0971 Soldering Iron Tip
75.1529 Soldering Oil (Blanket)
75.0969 Soldering-Ability
75.1530 Solderless Wrap
75.0997 Specific Solderability
75.1533 Staking, Mechanical
75.1019 Step Soldering
75.1036 Surface Tension
75.1038 Synthetic Activated Flux
75.1039 Synthetic Resin
75.1041 TAB
75.1044 Tail Pull
75.1043 Tail, Bonding
75.1045 Tape
75.1046 Tape Automated Bonding
75.1048 Temperature Profile
75.1064 Tetrafunctional Resins
75.1070 Thermode
75.1101 Transfer Soldering
75.1121 Ultrasonic Soldering
75.1557 Vapor-Phase Soldering
75.1150 Water-Soluble Organic Flux
75.1152 Wave Soldering
75.1159 Wetting, Solder
75.1162 Wicking
75.1166 Wipe Soldering
75.1170 Wire Wrap
75.1568 Working Time
76 Cleaning and Conformal Coating Processes
76.0031 Aliphatic Solvents
76.0032 Alkaline Cleaner
76.0110 Biocide
76.0153 Bubble Effect
76.0154 Buffer Material
76.0197 Chelate Compound
76.0198 Chelating Agent
76.0224 Cold Hand Cleaning
76.0225 Cold Machine Cleaning
76.0233 Complex Ion
76.0263 Conformal Coating
76.0283 Contamination Host Material
76.0299 Corrosion (Chemical/Electrolytic)
76.0313 Crazing (Conformal Coating)
76.1371 Critical Humidity
76.0322 Critical Solution Temperature
76.0372 Dibasic Acid
76.1221 Dilution Ratio
76.0384 Diphase Cleaning
76.0386 Direct Cleaning
76.0387 Direct Current Cleaning
76.0429 Electrolytic Cleaning
76.0437 Emulsifying Agent
76.0438 Emulsifying Oil
76.0439 Emulsion
76.0440 Encapsulant
76.1744 Ethanol
76.0455 Eutrophication
76.1317 Exchange Reaction
76.0460 Exfoliation
76.0463 Extraction, Liquid-Liquid
76.0476 Fatty Acid
76.0477 Fatty Ester
76.0495 Filiform Corrosion
76.1397 Final Seal
76.1401 Flash Distillation
76.0534 Flocculant
76.0535 Flocculation
76.0542 Flux Characterization
76.0543 Flux Residue
76.1402 Flux-Spatter Test
76.1410 Galvanic Corrosion
76.0584 Halide Content
76.0603 Heterocyclic
76.0615 Homocyclic
76.0616 Homologous Series
76.0617 Homopolymer
76.0621 Hydrocarbon Tolerance
76.0622 Hydrolytic Stability
76.0623 Hydrophilic Matter
76.0624 Hydrophilic Solvent
76.0625 Hydrophobic Matter
76.0626 Hydrophobic Solvent
76.0627 Hydrotrope
76.0628 Hydrotrophe
76.0629 Hypersorption
76.0655 Intergranular Corrosion
76.0661 Ion Exchange
76.0663 Ionic Cleanliness
76.1222 Ionizable (Ionic) Contamination
76.0725 Loop Height
76.0724 Loop Wire
76.1225 Lyophilic
76.0730 Lyophobic
76.1814 Mealing
76.1758 Montreal Protocol
76.1187 Nonionic Contaminant
June 1996 IPC-T-50F
97
76.1188 Nonpolar Matter
76.1454 Nonpolar Solvent
76.0802 Occluded Contaminant
76.0803 Occlusion
76.1196 Organic Contamination
76.0815 Overcoat
76.0820 Oxygen Concentration Cell
76.0833 Passive-Active Cell
76.0883 Polar Matter
76.1815 Polar Solvent
76.1480 Polymer Reversion
76.0885 Polymerized Rosin
76.1245 Residue
76.1253 Reverse Current Cleaning
76.1276 Saponifier
76.0985 Solvent
76.0986 Solvent Cleaning
76.1531 Solvent Extraction
76.0987 Solvent Pop
76.0988 Solvent Release
76.0989 Solvent Wash
76.1011 Stain Proofing
76.1535 Standard (Electrode) Potential
76.1774 Terpenes
76.1081 Thinner (Liquid)
76.1113 Tuberculation
76.1120 Ultrasonic Cleaning
76.1569 Wrinkles
77 Rework, Repair and Modification
77.0464 Extraction Tool
77.0494 Field Trimming
77.0667 Kerf
77.1433 L Cut
77.0682 Laser Trimming
77.0774 Modification
77.1502 Repair(ing)
77.1511 Rework
77.1293 Serpentine Cut
77.1108 Trimming
77.1109 Trimming Notch
79 Other (Assembly Process Issues)
79.1806 Capability Performance Index (Cp)
8 Types and Performance of Assemblies
80 General (Assembly Type and Performance Issues)
80.1327 Assembly
80.0057 Assembled Board
80.0401 Double-Sided Assembly
80.0503 Fine-Pitch Technology (FPT)
80.0775 Module
80.0787 Multilayer Printed Circuit Board Assembly
80.0789 Multilayer Printed Wiring Board Assembly
80.0911 Printed Board Assembly
80.0913 Printed Circuit Board Assembly
80.0917 Printed Wiring Board Assembly
80.0944 Single-sided Assembly
83 Inorganic (Ceramic, Metal Core etc.) Printed Board
Assemblies
83.1417 Hybrid Circuit
83.1418 Hybrid Integrated Circuit
83.1419 Hybrid Microcircuit
83.1073 Thick-Film Circuit
83.1074 Thick-Film Hybrid Circuit
83.1075 Thick-Film Network
83.1076 Thin-Film Hybrid Circuit
83.1077 Thin-Film Integrated Circuit
83.1078 Thin-Film Network
85 Backplanes
85.0080 Backpanel
85.1331 Backplane
85.0778 Mother Board
86 Multichip Modules
86.0207 Chip-on-Board (COB)
86.1446 Microcircuit Module
86.0782 Multichip Integrated Circuit
86.0783 Multichip Microcircuit
86.0784 Multichip Module (MCM)
9 Quality and Reliability, Fabrication and Assembly
90 General (Quality and Reliability Issues)
90.0003 Acceptable Quality Level (AQL)
90.0007 Accuracy
90.0018 Actual Size
90.0025 Aging
90.0308 Crack, Foil
90.0309 Crack, Plating
90.0310 Cracking
90.0348 Defect
90.0349 Defect Identification
90.0351 Degradation
90.0353 Dendritic Growth
90.0354 Dendritic Migration
90.0359 Dentrices
90.0478 Fault
90.0479 Fault Dictionary
90.0637 Inclusions
90.1501 Reliability
90.1526 Shelf Life
90.1029 Structurally-Similar Construction
90.1087 Through Migration
90.1140 Void
91 Process Control/SPC
91.0024 Advanced Statistical Method
91.0033 Alpha Error
91.0038 Analysis of Variance (ANOVA)
91.0059 Assignable Cause
91.1336 Basic Statistical Method
91.0104 Beta Error
91.1344 Capability Performance, Upper (Cpku)
91.1367 Capability Performance, Lower (Cpkl)
91.0306 Capability Index (Cp)
91.0190 Central Line
IPC-T-50F June 1996
98