IPC-T-50F_.pdf.pdf - 第15页

Bump (Die) 74.0159 A raised metal feature on a die land or tape carrier tape that facilitates inner-lead bonding. Bumped Die 74.0160 A semiconductor die with raised metal features that facili- tate inner-lead bonding. Bu…

Figure B–4 Drill Features

IPC-T-50F June 1996

Bump (Die) 74.0159

A raised metal feature on a die land or tape carrier tape that

facilitates inner-lead bonding.

Bumped Die 74.0160

A semiconductor die with raised metal features that facili-

tate inner-lead bonding.

Bumped Tape 74.0161

Carrier tape with raised metal features that facilitate inner-

lead bonding.

Bumped Wafer 74.0162

A semiconductor wafer with raised metal feature on its die

lands that facilitate inner-lead bonding.

Buried Via 22.0163

A via that does not extend to the surface of a printed board.

(See Figure B-3.)

Burn-In 95.0164

The process of electrically stressing a device at an elevated

temperature, for a sufficient amount of time to cause the

failure of marginal devices (Infant Mortality).

Burn-In, Dynamic 95.0165

Burn-in at high temperatures that simulates the effects of

actual or simulated operating conditions.

Burn-In, Static 95.0166

Burn-in at high temperatures with unvarying voltage, either

forward or reverse bias.

Burn-Off 74.0167

see ‘‘Flame-Off.’’

Bus 21.0168

One or more conductors used for transmitting data signals

or power.

Bus Bar 37.0169

A conduit, such as a component or conductor on a printed

board, that is used for distributing electrical energy. (See

also ‘‘Plating Bar.’’)

Butt Leads 36.1732

A SMT lead form. Leads extending horizontally from about

the center of a component body, formed down at a 90

degree angle and ending immediately below the component

body without additional bends.

Butter Coat 41.0170

An increased amount of resin on the outer surface of a base

material.

C-Staged Resin 41.0171

A resin in its ﬁnal state of cure. (See also ‘‘B-Staged

Resin.’’)

Camber 92.0172

The planar deﬂection of a ﬂat cable or ﬂexible laminate

from a straight line.

Cap Lamination 55.0176

A process for making multilayer printed boards with sur-

face layers of metal-clad laminate bonded in a single

operation. (See also ‘‘Foil Lamination.’’)

Capability Detail Specification (CapDS) 26.1780

A document that establishes the speciﬁc requirements,

noted in a detailed speciﬁcation, in order to establish the

level of capability that a manufacturer posesses when he

has demonstrated that he has met those requirements.

Capability Index (Cp) 91.0306

see ‘‘Capability Performance Index.’’

Capability Performance Index (Cp) 79.1806

The ratio of the measured performance of a process com-

pared to speciﬁed limits.

Capability Performance, Lower (Cpkl) 91.1367

A measure of the relationship between the performance of

a process and the lower speciﬁcation limit. (See also

‘‘Capability Performance, Upper.’’)

Capability Performance, Upper (Cpku) 91.1344

A measure of the relationship between the performance of

a process and the upper speciﬁcation limit. (See also

‘‘Capability Performance, Lower.’’)

Capability Test Board (CTB) 94.1784

A printed board speciﬁcally designed to act as a capability

qualifying component (CQC), or to be used by manufac-

turer to evaluate process variation, process control, or con-

tinuous improvement procedures.

IPC-I-001036

Figure B–5 Bow

BOW



June 1996 IPC-T-50F

Capability Test Segment (CTS) 94.1785

A segment or portion of a capability test board (CTB),

containing a set or group of individual test patterns (ITP),

intended to be used to demonstrate a speciﬁc level of

printed board complexity or manufacturing capability.

Capacitance 21.1794

A measure of the ability of two adjacent conductors sepa-

rated by an insulator to hold a charge when a voltage is

impressed between them.

Capacitance Density 21.0173

The amount of capacitance available per unit area.

Capacitive Coupling 21.0174

The electrical interaction between two conductors that is

caused by the capacitance between them.

Capillary 74.0175

A hollow bonding tool used to guide wire to the bonding

site and to be used to apply pressure during the bonding

cycle. (See also ‘‘Wedge Tool’’)

Card 60.0177

see ‘‘Printed Board.’’

Card-Edge Connector 22.0178

see ‘‘Edge-Board Connector.’’

Card-Insertion Connector 22.0179

see ‘‘Edge-Board Connector.’’

Carrier (Foil) 45.0180

A temporary support medium that facilitates the handling

of thin and soft-metal foils.

Carrier Tape 36.1345

The carrier for conductors used in tape-automated bonding.

(See also ‘‘Multilayer Carrier Tape,’’ ‘‘Single-Layer Carrier

Tape,’’ ‘‘Two-Layer Carrier Tape’’ and ‘‘Three-Layer Car-

rier Tape.’’)

Carry-Out 51.0181

The curved back portion of the ﬂute of a drill.

Castellation 33.0182

A recessed metalized feature on the edge of a leadless chip

carrier that is used to interconnect conducting surface or

planes within or on the chip carrier.

Catalyst (Resin) 40.0183

A chemical that is used to initiate the reaction or increase

the speed of the reaction between a resin and a curing

agent.

Catalyzing 53.0184

see ‘‘Activating.’’

Cathodic Cleaning 57.0185

Electrolytic cleaning in which the work is the cathode.

Cation Exchange 59.0186

see ‘‘Ion Exchange’’

Cationic Reagent 59.0187

Surface-active substances that have the active constituent

in the positive ion.

Cause-and-Effect Diagram 94.0188

A problem solving tool that uses a graphic description of

various process elements in order to analyze potential

sources of process variation.

Center-to-Center Spacing 22.1346

The nominal distance between the centers of adjacent fea-

tures on any single layer of a printed board. (See Figure

C-1.)(See also ‘‘Pitch.’’)

Centering Force 73.1733

The force required by the pick-up tooling to center a sur-

face mounting device in its proper location on a substrate.

Centerwire Break 74.0189

A failure mode in a wire pull test whereby the wire frac-

tures at approximately its midspan.

Central Line 91.0190

The line on a control chart that depicts the average or

median value of the items being plotted.

Certification 17.0191

The veriﬁcation that speciﬁed training or testing has been

performed and that required proﬁciency or parameter val-

ues have been atained.

Chain Dimensioning 26.0192

The maximum variation between two features that is equal

to the sum of the tolerances on the intermediate distances.

IPC-I-001035

Figure C–1 Center-to-center spacing (pitch)

Pitch

IPC-T-50F June 1996