IPC-T-50F_.pdf.pdf - 第6页

Active Device 30.0016 An electronic component whose basic character changes while operating on an applied signal. (This includes diodes, transistors, thyristors and integrated circuits that are used for the rectiﬁcation,…

Terms and Definitions for Interconnecting

and Packaging Electronic Circuits

Abrasive Trimming 54.1318

Adjusting the value of a ﬁlm component by notching it

with a ﬁnely- adjusted stream of an abrasive material

against the resistor surface.

Absorption Coefficients 40.1727

The degree to which various materials absorb heat or radi-

ant energy when compared to each other.

Accelerated Aging 93.0001

The means whereby the deterioration encountered in natu-

ral aging is artiﬁcially reproduced and hastened.

Accelerator 53.0002

see ‘‘Catalyst.’’

Acceptance Quality Level (AQL) 90.0003

The maximum number of defectives likely to exist within

a population (lot) that can be considered to be contractually

tolerable; normally associated with statistically derived

sampling plans.

Acceptance Tests 92.0004

Those tests deemed necessary to determine the acceptabil-

ity of a product and as agreed to by both purchaser and

vendor.

Access Hole 60.1319

A series of holes in successive layers of a multilayer board,

each set having their centers on the same axis. These holes

provide access to the surface of the land on one of the lay-

ers of the board. (See Figure A-1.)

Access Protocol 21.0005

An agreed principle for establishing how nodes in a net-

work communicate electronically.

Accordion Contact 36.0006

A type of connector contact that consists of a ﬂat spring

formed into a ‘‘Z’’ shape in order to permit high deflection

without overstress.

Accuracy 90.0007

The deviation of the measured or observed value from the

accepted reference.

Acid Flux 46.0009

A solution of an acid and an inorganic, organic, or water

soluble organic ﬂux. (See also ‘‘Inorganic Flux,’’ ‘‘Organic

Flux,’’ and ‘‘Water Soluble Organic Flux.’’)

Acid Number 54.0010

The amount of potassium hydroxide in milligrams that is

required to neutralize one gram of an acid medium.

Acid Value 54.1217

see ‘‘Acid Number’’

Acid-Core Solder 46.0008

Wire solder with a self-contained acid ﬂux.

Actinic Radiation 52.0011

Light energy that reacts with a photosensitive material in

order to produce an image.

Activated Rosin Flux 46.0012

A mixture of rosin and small amounts of organic-halide or

organic-acid activators. (See also ‘‘Synthetic Activated

Flux.’’)

Activating 53.0013

A treatment that renders nonconductive material receptive

to electroless deposition.

Activating Layer 53.0014

A layer of material that renders a nonconductive material

receptive to electroless deposition.

Activator 46.0015

A substance that improves the ability of a ﬂux to remove

surface oxides from the surfaces being joined.

IPC-I-002309

Figure A–1 Access hole

Land

Access Hole

▼

June 1996 IPC-T-50F

Active Device 30.0016

An electronic component whose basic character changes

while operating on an applied signal. (This includes diodes,

transistors, thyristors and integrated circuits that are used

for the rectiﬁcation, ampliﬁcation, switching, etc., of ana-

log or digital circuits in either monolithic or hybrid form.)

Active Metal 36.0017

A metal that is very high in electromotive force.

Active Trimming 54.1321

Adjusting the value of a ﬁlm circuit element in order to

obtain a speciﬁed functional output from the circuit while

it is electrically activated.

Actual Size 90.0018

The measured size.

Additive Process 53.1322

A Process for obtaining conductive patterns by the selec-

tive deposition of conductive material on clad or unclad

base material. (See also ‘‘Semi-Additive Process’’ and

‘‘Fully-Additive Process.’’)

Add-On Component 30.0019

Discrete or integrated packaged or chip components that

are attached to a ﬁlm circuit in order to complete the cir-

cuit’s function.

Adhesive 46.1728

A substance such as glue or cement used to fasten objects

together. In surface mounting, an epoxy adhesive is used to

adhere SMD’s to the substrate.

Adhesion Failure 96.0020

The rupture of an adhesive bond such that the separation

appears to be at the adhesive-adherend interface.

Adhesion Layer 74.0021

The metal layer that adheres a barrier metal to a metal land

on the surface of an integrated circuit.

Adhesion Promotion 53.0022

The chemical process of preparing a surface to enhance its

ability to be bonded to another surface or to accept an

over-plate.

Adhesive-Coated Catalyzed Laminate 41.1320

A base material with a thin polymer coating, that contains

a plating catalyst, that is subsequently treated in order to

obtain a microporous surface.

Adhesive-Coated Uncatalyzed Laminate 41.1323

A base material with a thin polymer coating, that does not

contain a plating catalyst, that is subsequently treated in

order to obtain a microporous surface.

Adsorbed Contaminant 96.0023

A contaminant attracted to the surface of a material that is

held captive in the form of a gas, vapor or condensate.

Advanced Statistical Method 91.0024

A statistical process analysis and control technique that is

more- sophisticated and less widely-applicable than basic

statistical methods.

Aging 90.0025

The change of a property, e.g., solderability, with time.

(See also ‘‘Accelerated Aging.’’)

Air Contamination 14.0026

see ‘‘Air Pollution’’

Air Pollution 14.0027

Contamination of the atmosphere with substances that are

toxic or otherwise harmful.

Algorithm 11.0849

A set of procedures for the solution of a problem in a series

of steps.

Alignment Mark 22.0030

A stylized pattern that is selectively positioned on a base

material to assist in alignment.

Aliphatic Solvents 76.0031

‘‘Straight chain’’ solvents, derived from petroleum, of low

solvent power.

Alkaline Cleaner 76.0032

A material blended from alkali hydroxides and alkaline

salts.

Alpha Error 91.0033

The size of a Type I error or the probability of rejecting a

hypothesis that is true.

Alphanumerical 25.1729

Pertaining to data that contain the letters of an alphabet, the

decimal digits, and may contain control characters, special

characters and the space character.

Alternating Current (ac) 21.1793

A current that varies with time, commonly applied to a

power source that switches polarity many times per second,

in the shape of a sinusoidal, square, or triangular wave.

Alternative Hypothesis 93.1324

The supposition that a signiﬁcant difference exists between

the desired results of two comparable populations. (See

also ‘‘Null Hypothesis’’ and ‘‘Statistical Hypothesis.’’)

IPC-T-50F June 1996

Alumina Substrate 43.1730

Aluminum oxide used as a ceramic substrate material.

Ambient 29.0034

The surrounding environment coming into contact with the

system or component in question.

Amorphous Polymer 40.0035

A polymer with a random and unstructured molecular con-

ﬁguration.

Amplitude, Voltage 21.0036

The magnitude of a voltage as measured with respect to a

reference, such as a ground plane.

Analog Circuit 21.0037

An electrical circuit that provides a continuous relationship

between its input and output.

Analysis of Variance (ANOVA) 91.0038

The systematic method of statistically evaluating experi-

mental results in order to separate the sources of variation.

Anchoring Spur 22.1325

An extension of a land on a ﬂexible printed board that

extends beneath the cover lay to assist in holding the land

to the base material. (See Figure A-2.)

Angled Bond 74.0039

The impression of the ﬁrst and second bonds that are not

in a straight line.

Annotation 22.0040

Text, notes, or other identiﬁcation, constructed by a

computer-aided system, intended to be inserted on a draw-

ing, map or diagram.

Annular Ring 60.0041

That portion of conductive material completely surround-

ing a hole.

Anodic Cleaning 57.0042

Electrolytic cleaning in which the work is the anode.

Apparent Field-of-View Angle 92.0043

The angular subtense of the ﬁeld-of-view in the image

space of an optical system.

Aqueous Flux 46.0044

see ‘‘Water Soluble Organic Flux.’’

Aramid 44.0045

see ‘‘Para-aramid’’

Arc Resistance 92.0047

The resistance of a material to the effects of a high voltage,

low current arc (under prescribed conditions) passing

across the surface of the material. (The resistance is stated

as a measure of total elapsed time at that voltage required

to form a conductive path on the surface - material carbon-

ized by the arc).

Architecture 11.0046

The structure of a computer’s functional elements that

makes it possess speciﬁc maximum and minimum capabili-

ties.

Area Array Tape Automated Bonding 74.0048

Tape automated Bonding where some carrier tape termina-

tions are made to lands within the perimeter of the die.

Array 22.0049

A group of elements or circuits arranged in rows and col-

umns on a base material.

Artificial Intelligence 11.0050

The capacity of a machine to perform functions that are

normally associated with human intelligence, such as rea-

soning and learning.

Artwork 22.0051

An accurately-scaled conﬁguration that is used to produce

the ‘‘Artwork Master’’ or ‘‘Production Master.’’ (See Fig-

ure A-3.)

Artwork Master 24.0052

An accurately-scaled, usually 1:1, pattern that is used to

produce the ‘‘Production Master.’’ (See Figure A-3.)

As-Fired 45.0054

The condition (values) of thick-ﬁlm components or the

smoothness of ceramic base materials, after they have been

processed in a ﬁring furnace and prior to trimming or pol-

ishing.

Aspect Ratio (Film) 74.0055

The ratio of the length of a ﬁlm component to its width.

Aspect Ratio (Hole) 53.0056

The ratio of the length or depth of a hole to its preplated

diameter.

IPC-I-001023

Figure A–2 Lands with anchoring spurs

COVER LAY

ANCHORING

SPURS

June 1996 IPC-T-50F