IPC-T-50F_.pdf.pdf - 第86页

44. REINFORCEMENT/CONSTRAINING CORE/HEAT DISSIPATION MATERIALS Contains terms related to materials used as reinforcement in or added to external layers of organic substrate material, used to produce printed boards or int…

electronic, electromechanical and mechanical components

used in developing electronic assemblies.

31. DISCRETE & I/C THROUGH-HOLE COMPONENT

PACKAGES

Contains terms related to the performance and packaging

styles for axial leaded and radial leaded passive and active

components intended for through-hole mounting and cov-

ers any lead forming criteria necessary for proper assembly

or stress relief. Includes, but is not limited to, resistors,

capacitors, transistor, single- and dual-inline packages, pin

grid arrays, chokes, transformers, relays, connectors, con-

nector sockets, etc.

32. DISCRETE SURFACE MOUNT COMPONENT PACK-

AGES

Contains terms related to performance and package styles

for discrete (single function) components, both leaded and

leadless, intended for surface mounting. Includes, but is not

limited to, chip resistors/capacitors, tantalum capacitors,

metallized face components, small outline transistors,

diodes, coils, chokes, test points, connectors sockets, etc.

33. I/C PACKAGE TYPES FOR SURFACE MOUNTING

Contains terms related to performance and package styles

for components that provide integrated logic (multiple)

functions in a single semiconductor chip and encapsulated

to protect the chip from the environment so that the com-

pleted component is ready for surface mounting after lead

forming or other lead/termination preparation. Includes, but

is not limited to small outline I/C’s, ceramic ﬂat packs,

plastic quad packs, leaded and leadless chip carriers, thin

small outline packages, encapsulate TAB, special ﬁber

optic devices etc.

34. GRID ARRAY PACKAGES

Contains terms related to performance and package styles

for components that provide high lead count capability in

leads or terminations and are integrated logic (multiple)

functions in a single semiconductor encapsulated to protect

the chip from the environment ready for mounting.

Includes, but is not limited to ball, post and pad grid arrays.

35. BARE DIE AND CHIP SCALE COMPONENTS

Contains terms related to bare die or enhanced die (chip

scale) component descriptions covering performance

requirements and process details necessary to deﬁne bond-

ing site characteristics, and other metallizations involved in

the interconnecting methodology for the un-protected die.

36. COMPONENT AND COMPONENT LEAD/

TERMINATION MATERIAL PROPERTIES

Contains terms necessary to deﬁne materials used in the

manufacture of component packages. Includes, but is not

limited to, encapsulating or hermetically sealing materials,

metals used to form leads or terminations, plating materi-

als, plastics, conductive/non-conductive adhesives etc.

37. COMPONENTS FOR WIRING AND CABLING

Contains terms related to the electronic, and electrome-

chanical components ,wiring, wiring harnesses, and

cabling. Includes heat dissipation characteristics, power

consumption, tolerances and performance variation.

38. [RESERVED FOR FUTURE EXPANSION]

39. OTHER (COMPONENT DESCRIPTION ISSUES)

Contains terms related to unique physical, mechanical, and

electrical properties of electronic, electromechanical, and

mechanical components which are not easily identiﬁed by

assigned topics. Caution is suggested when using the topic

‘‘OTHER,’’ as terms contained in this topic should be

unique and have little bearing to one-another.

4. MATERIALS FOR ELECTRONIC PACKAGING

40. GENERAL (MATERIAL ISSUES)

Contains terms needed to describe materials, their charac-

teristics, storage and handling requirements which cross the

boundaries of those properties used as a part of the com-

pleted interconnecting structure or interconnecting struc-

ture assembly. Process consumable materials are not

included in this segment and their terms are covered in the

topic to which they apply.

41. RIGID PRINTED BOARD SUBSTRATE MATERIALS

(ORGANIC)

Contains terms related to laminated, clad and unclad, mate-

rials used in the manufacture of rigid printed boards.

Includes, but is not limited to, phenolic, epoxy (multifunc-

tional, tetrafunctional, BT resins), cyanate esters, PTFE

(teﬂon), polyimide etc., reinforced by paper, glass (matt,

ﬁber and woven cloth), etc. (see 44.).

42. FLEXIBLE PRINTED BOARD SUBSTRATE MATERI-

ALS (ORGANIC)

Contains terms related to, clad and unclad, materials used

in the manufacture of ﬂexible and rigid/ﬂex printed boards.

Includes, but is not limited to, polyimide ﬁlm (extruded

and cast), polyester ﬁlms, PTFE (unreinforced) etc. as well

as the acrylic, epoxy, and other adhesives.

43. INORGANIC SUBSTRATES USED FOR INTERCON-

NECTING STRUCTURES

Contains terms related to the substrate materials used for

designing and manufacturing printed boards and other

interconnecting structures that need the thermal or dimen-

sional stability properties of inorganic materials. Included,

but not limited to, Alumina, Beryllia, Glass, Porcelainized

invar, Copper molybdenum, etc.

June 1996 IPC-T-50F

44. REINFORCEMENT/CONSTRAINING CORE/HEAT

DISSIPATION MATERIALS

Contains terms related to materials used as reinforcement

in or added to external layers of organic substrate material,

used to produce printed boards or interconnecting struc-

tures. Includes, but is not limited to, paper matt, glass matt,

woven glass, random glass ﬁbers, composites, aramid fiber,

quartz, graphite, invar, etc.

45. CONDUCTIVE MATERIALS (FOIL,FILM OR PLATING)

Contains terms related to the metal cladding added to

organic and inorganic interconnecting structures during the

material or printed board fabrication processes. Also

includes terminology describing plated or screened metal

materials used to additively produce conductive surfaces,

planes, or features.

46. COMPONENT ATTACHMENT MATERIALS

(CONDUCTIVE/NONCONDUCTIVE)

Contains terms for materials used to attach electronic, elec-

tromechanical, or mechanical components to interconnect-

ing structures. Includes, but is not limited to, solder, solder

paste, conductive adhesive, non-conductive adhesive, fuzz

buttons, etc.

47. COATING AND PERMANENT MASKING MATERI-

ALS

Contains terms related permanent masking and coating mate-

rials intended to become a fixed part of the printed board,

interconnecting structures or their assembly. Includes, but is

not limited to, epoxy coatings, acrylics, dry-film and liquid sol-

dermask, polyurethane coatings, inks, etc.

48. [RESERVED FOR FUTURE EXPANSION]

49. OTHER (MATERIAL ISSUES)

Contains terms related to unique material properties, char-

acteristics, handling or storage issues which are not easily

identiﬁed by assigned topics. Caution is suggested when

using the topic ‘‘OTHER’’ as terms contained in this topic

should be unique and have little bearing to one-another.

5. FABRICATION PROCESSES FOR INTERCONNECTION

STRUCTURES

50. GENERAL (FABRICATION PROCESSES FOR INTER-

CONNECTION STRUCTURES)

Contains terms needed to describe interconnecting struc-

ture fabrication processes which cross the boundaries of

conductor forming, layering, conductive hole formation,

structure periphery, or other fabrication processes used to

manufacture the unpopulated mounting and interconnection

structure.

51. MECHANICAL PROCESSES

Contains terms dealing with the fabrication techniques,

process consumable materials and equipments used to per-

form mechanical fabrication of interconnecting structures.

Includes, but is not limited to, hole formation, routing,

piercing, shearing, etc.

52. IMAGING AND APPLICATION OF RESISTS AND INKS

Contains terms dealing with image transfer techniques

from phototools (see 25.), direct or indirect, to the intercon-

necting structure all circuit or circuit protection methods,

materials and equipment. In addition to covering different

types of resist (etching, plating, solder) this topic also

includes, but is not limited to, materials, methods, and

equipment used to transfer legend or characters.

53. METAL DEPOSITION PROCESSES, INCLUDING

PLATING

Contains terms related to the fabrication processes dealing

with the materials that stay with the interconnection sub-

strate (see 45.), process consumable materials, techniques

and equipment regarding metal deposition through dry or

liquid plating, electroless or electrolytic plating/deposition

methodologies. Includes, but not limited to, surface plating

and deposition and hole conductivity formation for

through-hole, blind vias, buried vias, etc.

54. MATERIAL REMOVAL PROCESSES, INCLUDING

ETCHING

Contains terms related to fabrication techniques, process

consumable materials, material disposal and reclamation,

and equipments involved in the conductive and nonconduc-

tive feature formation processes. Includes, but is not lim-

ited to, copper etching, smear removal, ( plasma etching,

sulfuric acid etc.) mechanical abrasion etc.

55. LAMINATION, SEQUENTIAL DEPOSITION, AND

MOLDING PROCESSES

Contains terms related to lamination and molding fabrica-

tion techniques, materials, and equipments used to combine

layers of conductive or nonconductive materials, separately

or in combination to produce printed boards or intercon-

necting structures.

56. THERMAL CURE/FIRING PROCESSES

Contains terms used in the fabrication of organic and inor-

ganic printed boards or interconnecting structures that

require special thermal, infra-red, or ﬁring processes which

are necessary to hardening or polymerize the features or

planes.

57. CLEANING AND CHEMICAL TREATMENT PRO-

CESSES

Contains terms used to deﬁne techniques, materials, regu-

lations, and equipments used in the cleaning processes

associated with unpopulated printed boards or intercon-

necting structures. Includes, but is not limited to, solvent

techniques, aqueous techniques, aqueous/solvent combina-

tions, in-line equipments, static soaks, vapor degreaser, and

ultra-sonics.

IPC-T-50F June 1996

58. [RESERVED FOR FUTURE EXPANSION]

59. OTHER (INTERCONNECTING STRUCTURE FABRICA-

TION PROCESSES)

Contains terms related to unique interconnecting structure

fabrication processes which are not easily identiﬁed by

assigned topics. Caution is suggested when using the topic

‘‘OTHER’’ as terms contained in this topic should be

unique and have little bearing to one-another.

6. TYPES AND PERFORMANCE OF INTERCONNECTING

STRUCTURE FOR ELECTRONIC PACKAGING

60. GENERAL (INTERCONNECTING STRUCTURE TYPE

AND PERFORMANCE)

Contains terms needed to describe interconnection struc-

ture types and their performance requirements which cross

the boundaries of the various type characterization or deal

with performance issues covering a broad spectrum of the

products described in this segment.

61. RIGID PRINTED BOARDS (ORGANIC SUB-

STRATES)

Contains terms related to single-sided, double-sided and mul-

tilayer printed boards made from rigid substrate materials (see

41.), with and without plated through-holes and/or vias.

62. FLEXIBLE PRINTED BOARDS (ORGANIC SUB-

STRATES)

Contains terms related to single-sided, double-sided, and

multilayer printed boards made from ﬂexible substrate

materials (see 42.), with and without plated through holes

and/or vias.

63. FLEX-RIGID PRINTED BOARDS (ORGANIC SUB-

STRATES)

Contains terms related to single-sided, double-sided and

multilayer printed boards made from combinations of rigid

and ﬂexible substrate materials (see 41. & 42.), with and

without plated through holes and/or vias.

64. DISCRETE WIRING BOARDS (ORGANIC SUB-

STRATES)

Contains terms related to printed boards that may be made

using the same techniques described in 61.,62.,or 63., but

are supplemented by other materials, and/or discrete wires

in order to complete the electrical or electronic intercon-

nection.

65. PRINTED BOARDS (INORGANIC SUBSTRATES)

Contains terms related to single-sided, double-sided, and

multilayer boards made from inorganic substrate materials,

with and without plated through holes and/or vias.

66. MOLDED STRUCTURES (THREE DIMENSIONAL)

Contains terms related to interconnecting structures that are

three dimensional in their characteristic or that are pro-

duced using organic resin materials (plastics) in a molding

process to produce the mounting and or interconnecting

structure.

67. HYBRID/MULTICHIP MODULE INTERCONNECTING

STRUCTURES

Contains terms related to single-sided, double-sided, or

multilayer hybrid (ceramic) circuits, or modules intended

to serve as a subassembly that interconnects more than one

bare or enhanced (chipscale package) semiconductor die.

(see 36.)

68. [RESERVED FOR FUTURE EXPANSION]

69. OTHER (INTERCONNECTION STRUCTURE TYPE

AND PERFORMANCE ISSUES)

Contains terms related to unique interconnection structure

types or their performance requirements which are not eas-

ily identiﬁed by assigned topics. Caution is suggested when

using the term ‘‘OTHER’’ as terms contained in this topic

should be unique and have little bearing to one-another.

7. ASSEMBLY PROCESSES FOR INTERCONNECTION

STRUCTURES

70. GENERAL (ASSEMBLY PROCESS ISSUES)

Contains terms needed to describe assembly processes

which cross the boundaries of component handling, place-

ment or attachment issues as well as cleaning and coating

process requirements.

71. COMPONENT HANDLING, STORAGE AND PREPARA-

TION

Contains terms related to the handling, storage and lead,ter-

mination,or component body preparation necessary to per-

form the assembly mounting and attachment process.

Includes, but is not limited to, baking, tinning, lead bend-

ing, climatic control, binning, inventory control, etc.

72. THROUGH-HOLE MOUNTING OF COMPONENTS

Contains terms related to the mounting of components

intended to be attached to an interconnecting structure by

leads which pass through the structure. Includes, but is not

limited to, the techniques, principles, data transfer, equip-

ment, etc., involved in the process.

73. SURFACE MOUNTING OF COMPONENTS

Contains terms related to the mounting of components

intended to be attached to a interconnecting structure by

leads or terminations that are bonded to the surface.

Includes, but not limited to, mounting techniques, prin-

ciples, data transfer, equipment, etc. involved in the pro-

cess.

74. BARE CHIP PLACEMENT AND ATTACHMENT

Contains terms related to the attachment and bonding of

bare or enhanced (chip scale package) semiconductor die

June 1996 IPC-T-50F