IPC-T-50F_.pdf.pdf - 第89页
91. PROCESS CONTROL/SPC Contains terms related to techniques, methods, procedures, and equipment used to insure that variations of the pro- cesses used in manufacture, assembly , testing, etc. are kept within acceptable …
(see 35.), to inorganic and organic interconnection struc-
tures. Includes, but is not limited to, hybrids, multichip
modules (MCM-L,-C, or -D), and chip-on-board.
75. JOINING TECHNIQUES
Contains terms related to the methodologies, techniques,
process consumable materials, and equipment used to
attach completely fabricated components to interconnecting
structures. Includes, but not limited to, reflow soldering,
machine soldering, electrical/metallurgical attachment
(welding, wire bonding), conductive adhesive attach etc.
76. CLEANING AND CONFORMAL COATING PRO-
CESSES
Contains terms related to the methods, process consumable
materials, disposal of spent materials, and equipment used
for cleaning the interconnecting substrate assembly, in pro-
cess or final, as well as the processes, materials, and equip-
ments used to conformally coat the assembly.
77. REWORK, REPAIR AND MODIFICATION
Contains terms related to the techniques, tools, materials
and equipment used to remove, replace, or add components
to an interconnecting structure, or to correct/change a cir-
cuit feature in the structure itself, and terms related to
restoring the assembly to its proper function.
78. [RESERVED FOR FUTURE EXPANSION]
79. OTHER (ASSEMBLY PROCESS ISSUES)
Contains terms related to unique assembly, cleaning or
coating processes which are not easily identified by
assigned topics. Caution is suggested when using the topic
‘‘OTHER’’ as terms contained in this topic should be
unique and have little bearing to one-another.
8. TYPES AND PERFORMANCE OF INTERCONNECTION
STRUCTURE ASSEMBLIES FOR ELECTRONIC PACKAG-
ING
80. GENERAL (ASSEMBLY TYPE AND PERFORMANCE
ISSUES
Contains terms needed to describe assembly types and their
performance requirements which cross the boundaries of
the electronic assembly type descriptions or correlate per-
formance requirements to a broad spectrum of product
defined in this segment.
81. RIGID PRINTED BOARD ASSEMBLY (ORGANIC SUB-
STRATES)
Contains terms related to performance requirements and
descriptions of completed rigid printed board assemblies
with electronic, electromechanical, or mechanical compo-
nents mounted on one or both sides of the structure.
82. FLEXIBLE / RIGID-FLEX PRINTED BOARD ASSEM-
BLIES (ORGANIC SUBSTRATES)
Contains terms related to performance requirements and
descriptions of completed flexible or rigid-flex printed
board assemblies whose function includes continuous flex-
ing, or flex- to-install, and have electronic, electromechani-
cal, or mechanical components mounted on one or both
sides of the structure.
83. INORGANIC (CERAMIC,METAL CORE etc.) PRINTED
BOARD ASSEMBLIES
Contains terms related to the performance requirements
and descriptions of completed printed board assemblies or
interconnecting structures made from inorganic materials
with components mounted on one or both sides of the
structure.
84. MOLDED OR THREE DIMENSIONAL PRINTED
BOARD ASSEMBLIES
Contains terms related to the performance requirements
and descriptions of molded planer or three dimensional
interconnecting structures with electronic, electromechani-
cal, or mechanical components mounted on any or all sides
of the structure.
85. BACKPLANES
Contains terms related to the performance requirements
and descriptions of completed backplane (mother-board)
assemblies, with connectors and/or other components on
one or both sides, which are intended to interconnect two
or more other printed board assemblies.
86. MULTICHIP MODULE
Contains terms related to the performance requirements
and descriptions of a subassembly that mounts bare die or
enhanced die (chip scale) on either or both sides, as well as
inside, the mounting and interconnecting structure. The
interconnecting structure may be made of organic materials
(MCM-L), ceramic/ ceramic-glass materials (MCM-C or
hybrids), or basically inorganic material with deposited
dielectric to separate the conductive layers (MCM-D).
87. [RESERVED FOR FUTURE EXPANSION]
88. [RESERVED FOR FUTURE EXPANSION]
89. OTHER (ASSEMBLY TYPE AND PERFORMANCE
ISSUES)
Contains terms related to unique assembly types or their
performance requirements which are not easily identified
by assigned topics. Caution is suggested when using the
topic ‘‘OTHER’’ as terms contained in this topic should be
unique and have little bearing to one-another.
9. QUALITY AND RELIABILITY FOR ELECTRONIC PACK-
AGING, FABRICATION AND ASSEMBLY
90. GENERAL (QUALITY AND RELIABILITY ISSUES)
Contains terms needed to describe quality and/or reliability
issues of functions that cross the boundaries of design, fab-
rication, assembly, testing or the management of the pro-
cesses and administration function.
IPC-T-50F June 1996
84
91. PROCESS CONTROL/SPC
Contains terms related to techniques, methods, procedures,
and equipment used to insure that variations of the pro-
cesses used in manufacture, assembly, testing, etc. are kept
within acceptable bounds, and are continually monitored
for establishing control and capability as well as for con-
tinuous process improvement.
92. INSPECTION/TESTING
Contains terms related to techniques, methods, procedures,
and equipment used for verifying that materials and prod-
ucts received meet the intended use. Also includes terms
related to preconditioning (such as baking), testing, and
environmental and stress conditions during testing in order
to determine quality and reliability.
93. RELIABILITY FACTORS AND METHODOLOGY
Contains terms related to methods, principles and algo-
rithms used to determine and predict reliability expecta-
tions of materials, components, interconnecting structures
and assemblies/subassemblies.
94. QUALITY MANAGEMENT AND ASSURANCE
Contains terms related to methods, procedures, techniques,
systems and equipment used to assess the quality of manu-
facturers processes or their products. Includes, but not lim-
ited to, quality assurance inspections, in-process inspec-
tions, process control, ISO 9000 standards, etc.
95. COMPONENT QUALITY AND RELIABILITY
Contains terms related to techniques, methods, procedures,
and equipment intended to determine that electronic, elec-
tromechanical , or mechanical components are fit to sur-
vive the assembly , cleaning, and coating processes and
that when assembled will meet the reliability expectations
of the equipment used in its intended environment.
96. INTERCONNECTION STRUCTURE QUALITY AND
RELIABILITY
Contains terms related to techniques, methods, procedures,
and equipment intended to determine that unpopulated
interconnection structures are fit to survive the assembly,
cleaning, and coating processes and that when assembled
will meet the reliability expectations of the equipment used
in its intended environment.
97. ELECTRONIC ASSEMBLY/SUBASSEMBLY QUALITY
AND RELIABILITY
Contains terms related to techniques, methods, procedures
and equipment intended to determine that electronic assem-
blies or subassemblies (modules) are fit to survive any
equipment testing, and that the assembly will function in a
reliable fashion when the equipment is used in its intended
environment.
98. [RESERVED FOR FUTURE EXPANSION]
99. OTHER (QUALITY AND RELIABILITY ISSUES)
Contains terms related to unique quality or reliability issues
not easily identified by the assigned topics. Caution is sug-
gested when using the topic ‘‘OTHER’’ as terms contained
in this topic should be unique and have little bearing to
one-another.
June 1996 IPC-T-50F
85
Terms in Classification Code Order
1 Administration
11 Data Processing
11.0849 Algorithm
11.0046 Architecture
11.0050 Artificial Intelligence
11.0058 Assembly Language
11.0094 Batch Processing
11.0102 Benchmark, Computer
11.0232 Compiler
11.0244 Computer Numerical Control
11.0286 Control Console
11.0343 Data Logging
11.0341 Data File
11.0339 Database
11.1385 Download, Computer
11.0604 Hierarchical Database
11.0732 Machine Language
11.0800 Object-Oriented Database
11.1272 Runtime System
11.1277 Scalar Processing
11.1114 Turnkey System
14 Environmental
14.0026 Air Contamination
14.0027 Air Pollution
17 Customer/Vendor Relations
17.0095 Batch Size
17.0191 Certification
17.0285 Contract Services
17.1429 Just-in-Time (JIT)
2 Engineering and Design for Electronic Packaging
20 General (Engineering and Design Issues)
20.0158 Bulls-Eye
20.0238 Component Hole
20.1377 Design Automation
20.0441 End Item
20.0443 End Product
20.0581 Ground
20.1413 Ground Plane
20.0706 Library
20.0709 Limits of Size
20.0710 Line
20.0715 Local Fiducial
20.0028 Locating Edge
20.0717 Locating Edge Marker
20.0718 Locating Hole
20.0719 Locating Notch
20.0720 Locating Slot
20.1726 Location Hole
20.0738 Manufacturing Hole
20.0779 Mounting Hole
20.1192 Numerical Control (math.) (NC)
20.1462 Packaging Density
20.0824 Pad
20.0837 Path
20.0838 Pattern
20.0839 Pattern Area
20.1066 Thermal Conductivity
20.1067 Thermal Expansion Mismatch
21 Engineering
21.0005 Access Protocol
21.1793 Alternating Current
21.0036 Amplitude, Voltage
21.0037 Analog Circuit
21.0060 Asymmetric Stripline
21.0061 Attenuation
21.0072 Back Annotation
21.1332 Backward Crosstalk
21.1333 Balanced Transmission Line
21.0168 Bus
21.1794 Capacitance
21.0173 Capacitance Density
21.0174 Capacitive Coupling
21.0194 Characteristic Impedance
21.0213 Circuit
21.0231 Compensation Circuit
21.1360 Computer-Aided Engineering (CAE)
21.0327 Crosstalk
21.1795 Current
21.1374 Current-Carrying Capacity
21.1375 Decoupling
21.1380 Dielectric Strength
21.0378 Dielectric Fluid
21.1379 Dielectric Constant
21.1378 Dielectric Breakdown
21.0380 Digital Circuit
21.1381 Dimensional Stability
21.0385 Dipole
21.1383 Dipole Moment
21.1796 Direct Current (DC)
21.0396 Dissipation Factor
21.1797 Dual Strip Line
21.0417 Edge Rate
21.1388 Edge-Transition Attenuation
21.1798 Effective Relative Dielectric Constant
21.0422 Effective Permittivity
21.1742 Electrical Characteristics
21.0431 Electromagnetic Interference (EMI)
21.0447 Equivalent Series Resistance (ERS)
21.0458 Excitation Current
21.0473 Far-End Crosstalk
21.0489 Feature-Based Modeling
21.1398 Finite-Element Analysis (FEA)
21.0507 Finite-Element Modeling (FEM)
21.1406 Forward Crosstalk
21.0553 From-To List
IPC-T-50F June 1996
86