IPC-T-50F_.pdf.pdf - 第33页
Fissuring 56.0517 The cracking of a conductor or dielectric material caused by stresses occuring during firing. Fixed Contact 37.0518 A type of connector contact that is permanently retained within the connector body or i…
Fiducial Mark 22.0493
A printed board artwork feature (or features) that is created
in the same process as the conductive pattern and that pro-
vides a common measurable point for component mounting
with respect to a land pattern or land patterns.
Field Trimming 77.0494
The adjusting of the value of a resistor in order to modify
a circuit output voltage or current.
Filiform Corrosion 76.0495
Corrosion that develops under organic coatings on metals
in the form of randomly distributed fine hairlines that are
usually curved, wavy, or coiled.
Fill 44.0496
Yarns that are woven in a crosswise direction of a fabric.
Filler 44.0497
A substance that is added to a material to improve its solid-
ity, bulk, or other properties.
Fillet, Adhesive 75.0498
The portion of an adhesive that fills the corner, or the angle
formed, where two adherends are joined.
Fillet, Solder 75.0499
see ‘‘Solder Fillet.’’
Film 45.0500
Single or multiple layers of material used to form hybrid
circuit elements, interconnections, and crossovers. (See
also ‘‘Thin Film’’ and ‘‘Thick Film.’’)
Film Conductor 45.0501
A conductor formed in place on a base material by depos-
iting a conductive material using screening, plating or
evaporating techniques.
Film Network 53.0502
An electrical network composed of thin-film and/or thick-
film components on a base material.
Final Seal 76.1397
The manufacturing process that completes the enclosure of
a microcircuit so that further internal processing cannot be
performed without removing a lid or otherwise disassem-
bling the package.
Fine Leak 95.0504
A leak in a sealed package that is less than 0.00001 cubic
centimeters per second at one atmosphere of differential air
pressure.
Fine-Pitch Technology (FPT) 80.0503
A surface-mount assembly technology with component ter-
minations on less than 0.625-mm (0.025-inch) centers.
Fingers 22.0505
see ‘‘Edge-Board Contacts.’’
Finished Fabric 44.0506
A fabric that has been treated in order to aid its compatibil-
ity with resins.
Finite-Element Analysis (FEA) 21.1398
A computer-based analysis method that subdivides geomet-
ric entities into smaller elements and links a series of equa-
tions to each element so that they can then be analyzed
simultaneously.
Finite-Element Modeling (FEM) 21.0507
The use of a model to represent a problem that can be
evaluated by finite-element analysis.
Fire (v.) 56.0508
To heat a circuit so that its thick-film components are trans-
formed into their final form.
Firing Sensitivity 56.0509
The percentage change of film component characteristics
caused by a change in peak firing temperature, expressed as
percent per degree centigrade.
First Article 91.0511
A part or assembly that has been manufactured prior to the
start of a production run for the purpose of ascertaining
whether or not the manufacturing processes used to fabri-
cate it are capable of making items that will meet all appli-
cable end-product requirements.
First Bond 74.0512
The initial termination in a sequence of bonds made to
form a conductive path. (See also ‘‘Second Bond.’’)
First Radius 74.0513
The radius of the front edge of a bonding-tool foot.
First Search 74.0514
The moment at which the final adjustment is made in the
location of the bonding area under the bonding tool prior
to making the first bond.
First-Pass Yield 91.0510
The statistical average of the number of finished units in a
group that pass all tests without any rework, expressed in
percent.
Fish Eye 44.0516
A small area of a fabric that resists resin wetting that can
be caused by the resin system, fabric and treating.
Fishbone Diagram 91.0515
see ‘‘Cause-and-Effect Diagram.’’
IPC-T-50F June 1996
28
Fissuring 56.0517
The cracking of a conductor or dielectric material caused
by stresses occuring during firing.
Fixed Contact 37.0518
A type of connector contact that is permanently retained
within the connector body or insert.
Fixed-Effect Model 91.1399
A specific experimental treatment whereby the conclusions
reached apply only to the factor levels considered in the
analysis and the interferences are restricted to the experi-
mental levels. (See also ‘‘Random-Effects Model.’’)
Fixture, Test 92.0519
A device that interfaces between test equipment and the
unit under test.
Flag 74.0520
The support area on a die or lead frame.
Flame-Off 74.0521
The use of a flame to severe a wire and to form a ball for
the next ball-bonding termination.
Flare 51.1400
The undesirable enlarged and tapered area around a
punched hole that is on the side of the material through
which the punch exited during hole formation. (See Figure
F-1.)
Flash Distillation 76.1401
Distillation in which an appreciable proportion of liquid is
quickly converted to a vapor in such a way that the final
vapor is in equilibrium with the final liquid.
Flat Cable 37.0522
Two or more parallel, round or flat, conductors that are
contained in the same plane of a flat insulating base mate-
rial.
Flat Conductor 40.1800
A rectangular conductor that is wider than it is high.
Flat Pack 33.0523
A rectangular component package that has a row of leads
extending from each of the longer sides of its body that are
parallel to the base of its body.
Flex-Rigid Double-Sided Printed Board 63.1570
See ‘‘Rigid-flex Double-sided Printed Board’’
Flex-Rigid Printed Board 63.0524
see ‘‘Rigid-Flex Printed Board.’’
Flexible Double-Sided Printed Board 62.1581
Double-sided printed board, either printed circuit or printed
wiring, using a flexible base material only.
Flexible Multilayer Printed Board 62.1582
Multilayer printed board, either printed circuit or printed
wiring, using flexible base materials only. Different areas
of the flexible multilayer printed board may have different
number of layers and thicknesses.
Flexible Printed Board 62.1579
A printed board using a flexible base material only. May be
partially provided with electrically non-functional stiffen-
ers and/or cover lay.
Flexible Printed Circuit 62.0525
A patterned arrangement of printed circuitry and compo-
nents that utilizes flexible base material with or without
flexible cover lay.
Flexible Printed Wiring 62.0526
A patterned arrangement of printed wiring that utilizes
flexible base material with or without flexible cover lay.
Flexible Single-Sided Printed Board 62.1580
Single-sided printed board, either printed circuit or printed
wiring, using flexible base materials only.
Flexural Failure 91.0527
A failure that is caused by the repeated flexing of a mate-
rial.
Flexural Strength 44.0528
The tensile strength of the outermost fiber of a material that
is being bent.
Flip Chip 74.0530
A leadless monolithic, circuit element structure that electri-
cally and mechanically interconnects to a base material
through the use of conductive bumps.
Flip-Chip Mounting 74.0529
The mounting and interconnecting of a flip chip component
to a base material.
IPC-I-001030
Figure F–1 Flare
Flare
▼
June 1996 IPC-T-50F
29
Float 44.0531
A warp or fill yarn that does not interlace with the next
designated yarn, but passes over or under two or more
adjacent yarns.
Floating Bushing 37.0533
A connector mounting device that allows for connector
body movement in order to facilitate its alignment with a
mating part or mating assembly.
Floating-Annulus Tape-Automated Bonding 74.0532
A carrier tape format that uses a free-floating annulus ring
to separate suspended leads.
Flocculant 76.0534
A substance that induces flocculation.
Flocculation 76.0535
The combination or aggregation of suspended solid par-
ticles in such a way that they form small clumps or tufts
that resemble wool.
Flow Soldering 75.0536
see ‘‘Wave Soldering.’’
Flush Conductor 22.0537
A conductor whose outer surface is in the same plane as is
the surface of the insulating material adjacent to the con-
ductor.
Flux 75.0538
A chemically- and physically active compound that, when
heated, promotes the wetting of a base metal surface by
molten solder by removing minor surface oxidation and
other surface films and by protecting the surfaces from
reoxidation during a soldering operation.
Flux Activation Temperature 75.0540
The temperature at which flux becomes active enough to
remove oxides from the metals being joined.
Flux Activity 75.0541
The degree or efficiency with which a flux promotes wet-
ting of a surface with molten solder. (See also ‘‘Solder-
Spread Test,’’ ‘‘Wetting Balance.’’)
Flux Characterization 76.0542
A series of tests that determines the basic corrosive and
conductive properties of fluxes and flux residues.
Flux Residue 76.0543
A flux-related contaminant that is present on or near the
surface of a solder connection.
Flux-Cored Solder 46.0539
A wire or ribbon of solder that contains one or more con-
tinuous flux-filled cavities along its length.
Flux-Spatter Test 76.1402
A semiquantitive test that characterizes the ability of flux
and flux residues, upon rapid heating of the flux, to remain
in one area rather than form a dispersion of fine droplets.
Fluxing 75.1745
The efficiency with which a flux promotes wetting of a
surface with molten solder.
Foil Burr 51.0544
A rough edge or area that remains on the surface of a foil
after it has been cut, pierced, or drilled.
Foil Lamination 55.0545
A process for making multilayer printed boards with sur-
face layer(s) of metal foil bonded in a single operation.
(See also ‘‘Cap Lamination.’’)
Foil Profile 45.0546
The roughness of a foil surface that results from the manu-
facture of the foil and/or from a bond-enhancement treat-
ment.
Foot Length 74.0547
The longer dimension of the bonding surface of a wedge-
type bonding tool.
Footprint 22.0548
see ‘‘Land Pattern.’’
Forced Gas Convention Soldering 75.1746
Reflow soldering using forced hot air or nitrogen gas as the
primary source of heat.
Forced-Field Analysis 93.1403
A technique that is used to help solve a problem by identi-
fying those forces that are preventing improvement
(restraints) and those forces that affect improvement
(drives).
Foreign Material (Soldering) 75.1404
A lumpy, irregular coating that has covered, or partially
covered, particles of material that are located on, but are
different than, the material or coating of the items to be
soldered.
Fork Contact 37.1405
A type of female connector contact that consists of flat
spring metal that has been formed into a two tine ‘‘fork-
like’’ shape so that it mates with a spade contact.
Form 22.0549
The shape of a feature.
IPC-T-50F June 1996
30