IPC-T-50F_.pdf.pdf - 第70页
Statistical Process Control (SPC) 91.1536 The use of statistical techniques to analyze a process or its output so as to be able to take appropriate action in order to achive and maintain a state of statistical control an…
Specification Drawings 26.1532
A document that shows the dimensional limits that are
applicable to any or all parts of a component and any other
information that is necessary to describe the product to be
fabricated.
Specification Limits 91.0996
The requirements for judging acceptability of a particular
characteristic.
Specimens 92.1769
Samples of a material, device or circuit, representative of
the production lot, which are selected for testing.
Splay 51.0998
The tendency of a rotating drill bit to make off-center, out-
of-round, holes that are not perpendicular to the drilling
surface.
Split (Fabric) 44.0999
An opening in a fabric that results from having either the
pick or end breaking in two.
Spotting Out 96.1000
The delayed appearance of spots and blemishes on plated
or finished surfaces.
Spread 73.1001
The distance of a substance, e.g., adhesive, moves after it
has been applied at ambient conditions.
Spread (Values) 91.1002
A general concept for the extent by which values in a dis-
tribution differ from one another.
Sprocket 74.1003
A perforation along the edge of a carrier tape that is used
to move and align the tape during the tape fabrication,
assembly, and testing operations.
Spur 24.1004
An undesirable clear projection from a clear photographic
pattern or a dark projection from a dark pattern photo-
graphic.
Spurious Metal 92.1005
see ‘‘Extraneous Metal.’’
Spurious Signal 21.1006
see ‘‘Crosstalk.’’
Sputtering 53.1007
The removal of atoms from a plasma source by energetic
ion bombardement and their subsequent deposition as a
thin film on a base material.
Stability 91.1008
The absence of special causes of variation.
Stabilization Period 57.1009
The period of time in the reflow profile after preheat and
before the reflow spike occurs where the temperature of the
metals being joined are allowed to equalize.
Stable Process 91.1010
A process that is in statistical control.
Stain Proofing 76.1011
The retardation of the oxidation of a metal surface.
Staking, Adhesive (v.) 73.1012
The bonding or attaching of components, or component
elements, to a surface or together by the application of
small quantities of adhesive material.
Staking, Mechanical 75.1533
The attaching of metallic devices, such as solder terminals
and eyelets, by the upsetting of the portion of the device
that protrudes through a hole in a base material.
Stamped Printed Wiring 60.1013
Wiring that is produced by die stamping and bonding a
metal foil to a base material.
Stand-Off 70.1770
A post or protrusion used to facilitate raising a surface
mounting device above the surface of the substrate.
Standard Deviation of a Population 91.1534
A measure of the distribution of a population about a mean
value that is equal to the square root of the variance of a
process output. (See also ‘‘Sigma.’’)
Standard (Electrode) Potential 76.1535
The reversible potential from an electrode process when all
products and reactants are at unit activity on a scale in
which the potential for a standard hydrogen half-cell is
zero.
Standoff Solder Terminal 37.1014
see ‘‘Turret Solder Terminal.’’
Statistical Control 91.1015
The condition of describing a process from which all spe-
cial causes of variation have been eliminated and, thereby,
only common causes remain.
Statistical Hypothesis 91.1016
An assumption that is made about a population being
sampled. (See also ‘‘Alternative Hypothesis’’ and ‘‘Null
Hypothesis.’’)
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Statistical Process Control (SPC) 91.1536
The use of statistical techniques to analyze a process or its
output so as to be able to take appropriate action in order
to achive and maintain a state of statistical control and to
improve process capability.
Statistical Quality Control (SQC) 91.1017
The use of statistical techniques to document and assure
end product compliance with requirements.
Step Scale 24.1537
A series of regularly-spaced tones that range from black,
through intermediate shades of gray, to white that is used
as a reference scale for exposure control in a photo-
fabrication process.
Step Soldering 75.1019
The making of solder connections by sequentially using
solder alloys with successively-lower melting tempera-
tures.
Step Wedge 24.1020
see ‘‘Step Scale.’’
Step-and-Repeat 24.1018
The successive exposure of a single image in order to pro-
duce a multiple-image production master.
Stitch Bond 74.1021
A bond made with a capillary-type bonding tool whereby
the wire is not formed into a ball prior to bonding.
Straight-Through Lead 72.1022
A component lead that extends through a hole and is termi-
nated without subsequent forming.
Strain Relief (Connector) 37.1023
A receptacle connector device that prevents the disturbance
of the contact and cable terminations.
Stress Corrosion Cracking 95.1024
Spontaneous cracking produced by the combined action of
corrosion and residual or applied static stress.
Stress Relief 36.1025
The portion of a component lead or wire lead that is
formed in such a way as to minimize mechanical stresses
after the lead is terminated.
Stringing 73.1026
The forming of a ‘‘tail’’ of adhesive as the dispensing tool
pin or needle is withdrawn from the deposited adhesive.
Stripback 44.1027
Broken filaments along a yarn strand that are pushed back
and protrude above the fiber plane.
Stripline 21.1028
A transmission-line configuration that consists of a conduc-
tor that is positioned equidistant between, and parallel to,
ground planes with a dielectric among them.
Structurally-Similar Construction 90.1029
Material combinations and materials whose construction
details will not affect test results at the primary stage of
manufacture.
Stub 21.1030
A branch of the main signal line of a signal net that is usu-
ally used to reach a load that is not on the direct signal
path.
Stud-Mount Termination 30.1031
see ‘‘Straight-Through Lead.’’
Subgroup 91.0140
A subset of a population that is analyzed dependently in
order to eliminate assignable causes of variation.
Subnet 21.1206
A single source and a single target point that, together with
associated vias, lands, and preplaced items, are completely
connected by route segments within one net.
Substrate 41.1207
see ‘‘Base Material.’’
Substrate Bending Test 92.1771
A test applied to a substrate to determine its resistance to
bending and the effects of bending to the substrate and any
components mounted on the substrate.
Subsurface Corrosion 96.1208
Formation of isolated particles of corrosion products
beneath a metal surface.
Subtractive Process 50.1209
The fabricating of a conductive pattern by the selective
removal of unwanted portions of a conductive foil.
Sum of Squares 91.1210
The variation contributed by a factor. (See also ‘‘Pure Sum
of Squares.’’)
Support Ring 36.1033
Dielectric material that is used to hold beam leads in place
relative to one another outside of a packaged device.
Supported Hole 22.1211
A hole in a printed board that has its inside surfaces plated
or otherwise reinforced.
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Supporting Plane 44.1032
A planar structure that is a part of a packaging and inter-
connecting structure in order to provide mechanical sup-
port, thermo-mechanical constraint, thermal conduction
and/or electrical characteristics. (It may be either internal
or external to the packaging and interconnecting structure.)
(See also ‘‘Constraining Core.’’)
Surface Insulation Resistance (SIR) 92.1538
The electrical resistance of an insulating material between
a pair of contacts, conductors or grounding devices in vari-
ous combinations, that is determined under specified envi-
ronmental and electrical conditions.
Surface Mounting 73.1035
The electrical connection of components to the surface of a
conductive pattern that does not utilize component holes.
Surface Mount Device (SMD) 30.1772
See ‘‘Surface Mount Component (SMC)‘‘.
Surface Tension 75.1036
The natural, inward, molecular-attraction force that inhibits
the spread of a liquid at its interface with a solid material.
Surface-Mount Component (SMC) 30.1034
A leaded or leadless device (part) that is capable of being
attached to a printed board by surface mounting.
Surge 21.1037
A transient variation in the current and/or potential at a
point in a circuit.
Swaged Lead 72.1539
A component lead wire that extends through a hole in a
printed board and its lead extension is flattened (swaged) to
secure the component to the board during manufacturing
operations.
Swell-and-Etch Process 53.1540
The surface treatment of a base material in order to pro-
mote the adhesion of an electroless metal deposit by soft-
ening the surface with a solvent and then exposing the sur-
face to an oxidizing solution in order to create a
microporous surface.
Synthetic Activated Flux 75.1038
A highly-activated organic flux whose post-soldering resi-
dues are soluble in halogenated solvents.
Synthetic Resin 75.1039
A synthetic organic polymer or a chemically-treated natu-
ral resin.
System Effective Color Temperature 24.1040
The effective color temperature measured using an optical
system’s light source to illuminate the target area.
T
Tab 22.1042
see ‘‘Printed Contact.’’
TAB 75.1041
see ‘‘Tape Automated Bonding.’’
Tail, Bonding 75.1043
The free end of wire extending beyond the bond impres-
sion of a wire bond from the heel.
Tail Pull 75.1044
The removal of excess wire after a wedge or ultrasonic
bond is made.
Tape 75.1045
see ‘‘Carrier Tape.’’
Tape Automated Bonding 75.1046
A fine-pitch technology that provides interconnections
between die and base materials with conductors that are on
a carrier tape.
Taped Component 71.1541
A component that is attached to a continuous tape in order
to facilitate the use of automatic component incoming
inspection, lead forming, assembling and testing.
Tear (Fabric) 44.1047
A large rip in a fabric that is usually caused by excessive
tension being applied during processing or caused by a
weakness in the fabric.
Temperature Profile 75.1048
The depiction of the temperature that a selected point
traverses as it passes through the reflow process.
Tenter Frame 44.1049
A machine test maintains fabric width during drying by
means of clips running on two parallel endless chains.
Tenting 52.1050
The covering of holes in a printed board and the surround-
ing conductive pattern with a resist.
Terminal 37.1051
A metallic device that is used for making electrical connec-
tions. (See also ‘‘Solder Terminal.’’)
Terminal Area 22.1052
see ‘‘Land.’’
Terminal Clearance Hole 22.1053
see ‘‘Access Hole.’’
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