IPC-T-50F_.pdf.pdf - 第81页
LCCC Leadless Ceramic Chip Carrier LDA Logic Design Automation LED Light-Emitting Diode LIF Low Insertion Force LMC Least Material Condition LRU Lowest Replaceable Unit LSI Large Scale Integration (Integrated Circuit) —M…
DIM Data-Information Record
DIN Deutsches Institute for Normung
DIP Dual-Inline Package
DLA Defense Logistics Agency (DOD)
DMSA Defense Manufacturers and Suppliers Associa-
tion
DNC Distributed (or Direct) Numerical Control
DOD Department of Defense
DOD Dissolved Oxygen Demand
DOS Disc Operating System
DRC Design Rule Checking
DRM Drawing Requirements Manual
DVM Digital Voltmeter
DXF Data Exchange Format
—E—
ECAD Electronic Computer-Aided Design
ECCB Electronic Components Certification Board
ECL Emitter-Coupled Logic
ECM Electronic Countermeasures
ECN Engineering Change Notice
ECO Engineering Change Order
EDA Electronic Design Automation
EDIF Electronic Design Interchange Format
EDM Electro-Discharge Machining
EIA Electronic Industries Association
EIS Engineering Information System
EMC Electromagnetic Compatibility
EMF Electro-Motive Force
EMI Electromagnetic Interference
EMP Electromagnetic Pulse
EMPF Electronics Manufacturing Productivity Facility
EPR Ethylene-Propylene (Copolymer) Resin
EPT Ethylene-Propylene Terepolymer
ESD Electrostatic Discharge
ESR Equivalent Series Resistance
ETPC Electrolytic Tough-Pitch Copper
—F—
FAA Federal Aviation Administration
FAR Failure Analysis Report
FCC Federal Communications Commission
FCC Flat-Conductor Cable
FEA Finite-Element Analysis
FEM Finite-Element Modeling
FEP Fluorinated Ethylene-Propylene (Teflon)
FET Field-Effect Transistor
FPT Fine-Pitch Technology
FSCM Federal Stock Code for Manufacturers
—G—
GaAs Gallium Arsenide
GBIB General Purpose Interface Bus
GMA Gas Metal Arc (Welding)
GTA Gas Tungsten Arc (Welding)
—I—
I/O Input/Output (Terminations)
IC Integrated Circuit
ICAM Integrated Computer-Aided Manufacturing
IDC Insulation-Displacement Connection
IEC International Electrotechnical Commission
IECQ International Electronic Component Qualifica-
tion System
IEEE Institute of Electrical and Electronic Engineers
IEPS International Electronic Packaging Society
IGES Integrated Graphics Exchange System
ILB Inner-Lead Bonding (TAB)
IPC Institute for Interconnecting and Packaging
Electronic Circuits
IR Infrared
ISHM International Society for Hybrid Microelectron-
ics
ISO International Standards Organization
ITT Inter-Test Time
—J—
JEDEC Joint Electronic Device Engineering Council
JIT Just-in-Time (Manufacturing)
—K—
KGB Known Good Board
—L—
LAN Local Area Network
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LCCC Leadless Ceramic Chip Carrier
LDA Logic Design Automation
LED Light-Emitting Diode
LIF Low Insertion Force
LMC Least Material Condition
LRU Lowest Replaceable Unit
LSI Large Scale Integration (Integrated Circuit)
—M—
MA Mechanical Advantage
MAC Maximum Allowable Concentration
MAP Manufacturing Automation Protocol
MATS Material Transport Segment
MCAD Mechanical Computer Aided Design
MCAE Mechanical Computer-Aided Engineering
MCM Multichip Module
MDA Methylenedianiline
MEK Methyl-Ethyl Ketone
MELF Metal Electrode Face (Discrete Leadless
Component)
MIBK Methyl-Isobutyl Ketone
MIR Moisture Insulation Resistance
MITI Ministry of International Trade and Industry
(Japan)
MLPWB Multilayer Printed Wiring Board
MMC Maximum Material Condition
MOS Metal-Oxide Semiconductor
MRP Material Requirement Planning
MRP II Manufacturing Resource Planning
MSI Medium Scale Integration (Integrated Circuit)
MTBF Mean Time Between Failures
MTTR Mean Time To Repair
—N—
NADCAP
National Aerospace and Defense Contractors
Accreditation Procedures
NASA National Aviation and Space Administration
NBR Nitrile Butadiene-Acrylonitrile Rubber
NBS National Bureau of Standards
NC Numerical Control
NDT Non-Destructive Testing
NECQ National Electronics Component Qualification
System
NEMA National Electrtical Manufacturers Association
NIST National Institute for Science and Technology
NMR Normal-Mode Rejection
NSA National Secutity Agency
—O—
OEM Original Equipment Manufacturer
OFHC Oxygen-Free High-Conductivity Copper
OLB Outer-Lead Bonding (TAB)
OSHA Occupational Safety Hazards Act
OSI Open Systems Interconnection
—P—
P&IA Packaging and Interconnecting Assembly
P&IS Packaging and Interconnecting Structure
PBX Private Branch Exchange
PC Personal Computer
PCB Printed Circuit Board
PDES Product Data Exchange Specification
PDL Page Description Language
PGA Pin Grid Array (Leaded Component Package)
PHIGS Programmer’s Hierarchical Interface Graphics
Standard
PLCC Plastic Leaded Chip Carrier
PLD Programmable Logic Device
PPM Parts Per Million
PPS Polyphenylene Sulfide (Plastic)
PRT Planar Resistor Technology
PSI Pounds Per Square Inch
PT Positional Tolerance
PTFE Polytetrafluoroethylene (Teflon)
PTH Plated-Through Hole
PVC Polyvinyl Chloride
PWA Printed Wiring Assembly
PWB Printed Wiring Board
—Q—
QML Qualified Manufacturers List
QPL Qualified Products List
QTA Quick Turn Around
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—R—
RAM Random Access Memory
RFI Radio-Frequency Interference
RFP Request for Proposal
RFS Regardless of Feature Size
RISC Reduced Instruction Set Computing
RMS Root Mean Square
ROM Read Only Memory
RPM Revolutions Per Minute
RwoH Reliability without Hermeticity
—S—
SAE Society of Automotive Engineers
SEM Scanning Electron Microscope
SEM Standard Electronic Module (Navy)
SIP Single Inline Package
SIR Surface Insulation Resistance
SMD Surface Mount Device
SMEMA Surface Mount Equipment Manufacturers
Association
SMOBC Solder Mask Over Bare Copper
SMT Surface Mounting Technology
SNA Systems Network Architecture
SOIC Small-Outline Integrated Circuit
SOS Silicon-on-Sapphire
SPC Statistical Process Control
SPICE Simulation Program, Integrated Circuit Empha-
sis
SQC Statistical Quality Control
SQL Structured Query Language
SSI Small-Scale Integration (Integrated Circuit)
STEP Standard for Exchange of Product Model Data
—T—
TAB Tape-Automated Bonding
TCE Thermal Coefficient of Expansion
TCR Temperature Coefficient of Resistance
TDR Time-Domain Reflectometry
TEM Transverse Electromagnetic Mode
TFA Tree-based Floorplanning Algorithm
TFE Tetrafluoroethylene (Teflon)
Tg Glass Transition Temperature
THT Through-Hole Technology
TIFF Tagged Image File Format
TO Transistor Outline
TOP Technical and Office Protocol
TP True Position
TTL Transistor-Transistor Logic
—U—
UHF Ultra-High Frequency
UL Underwriter’s Laboratories
ULSI Ultra-Large Scale Integration (Integrated Cir-
cuit)
—V—
VAR Value-Added Reseller
VHDL VHSIC Hardware Description Language
VHF Very-High Frequency
VHSIC Very-High Speed Integrated Circuits
VLSI Very-Large Scale Integration (Integrated Circuit)
VME Versa-Module Electronic
VSAG VHDL Standardization and Analysis Group
(IEEE)
—W—
WIP Work In Process
WSI Wafer-Scale Integration
WYSIWYG What You See Is What You Get
—Z—
ZAF Z-Axis Adhesive Film
ZIF Zero-Insertion Force
ZIP Zigzag Inline Package
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