IPC-T-50F_.pdf.pdf - 第39页

Hydrophilic Matter 76.0623 see ‘ ‘Polar Matter .’ ’ Hydrophilic Solvent 76.0624 see ‘ ‘Polar Solvent.’ ’ Hydrophobic Matter 76.0625 see ‘ ‘Nonpolar Matter .’ ’ Hydrophobic Solvent 76.0626 see ‘ ‘Nonpolar Solvent.’ ’ Hydr…

Hole Breakout 60.1699

A condition in which a hole is not completely surrounded

by the land. (See Figure H-1.)

Hole Density 22.0610

The quantity of holes in a unit area of printed board.

Hole Location 22.0611

The dimensional position of the center of a hole.

Hole Pattern 22.1621

The arrangement of all the holes in a printed board or pro-

duction board.

Hole Pull Strength 53.0613

The load or pull force along the axis of a plated-through

hole that will rupture the hole.

Hole Void 53.0614

A void in the metallic deposit of a plated-through hole that

exposes the base material.

Homocyclic 76.0615

A ring compound containing only one kind of atom in its

ring structure.

Homologous Series 76.0616

A series of organic compounds in which each successive

member has one more CH

group in its molecule than the

preceding member.

Homopolymer 76.0617

A polymer derived from a single monomer with the aid of

initiators that act in the manner of catalysts.

Hook 51.0618

The rake condition in the ﬂute face of a drill. (See Figure

H-2.)

Hook Solder Terminal 37.0619

A solder terminal with a curved feature around which one

or more wires are wrapped prior to soldering. (See Figure

H-3.)

Horn 74.0620

A cone-shaped object that transmits ultrasonic energy from

a transducer to a bonding tool.

Hot Plate Reflow Soldering 75.1748

Reﬂow soldering using direct contact or close proximity to

a hot plate as the primary source of heat.

Hybrid Circuit 83.1417

An insulating base material with various combinations of

interconnected ﬁlm conductors, ﬁlm components, semicon-

ductor dice, passive components and bonding wire that

form an electronic circuit.

Hybrid Integrated Circuit 83.1418

An insulating base material with various combinations of

interconnected ﬁlm conductors, ﬁlm components, semicon-

ductor dice, passive components and bonding wire that per-

form the same function as a monolithic semiconductor inte-

grated circuit.

Hybrid Microcircuit 83.1419

An insulating base material with various combinations of

interconnected ﬁlm conductors, ﬁlm components, semicon-

ductor dice, passive components and bonding wire that

form an electronic microcircuit.

Hydrocarbon Tolerance 76.0621

see ‘‘Dilution Ratio.’’

Hydrolytic Stability 76.0622

The degree of resistance of a polymer to permanent prop-

erty changes from hydrolytical effects.

IPC-I-001031

Figure H–1 Hole breakout

IPC-I-000000

Figure H–2 Hook

IPC-0-000000

Figure H–3 Hook solder terminal

IPC-T-50F June 1996

Hydrophilic Matter 76.0623

see ‘‘Polar Matter.’’

Hydrophilic Solvent 76.0624

see ‘‘Polar Solvent.’’

Hydrophobic Matter 76.0625

see ‘‘Nonpolar Matter.’’

Hydrophobic Solvent 76.0626

see ‘‘Nonpolar Solvent.’’

Hydrotrope 76.0627

A chemical that can increase the aqueous solubility of

slightly-soluble organic chemicals.

Hydrotrophe 76.0628

see ‘‘Hydrotrope.’’

Hypersorption 76.0629

The process by which activated carbon selectively absorbs

less-volatile components from a gaseous mixture while the

more-volatile components are unaffected.

Hypotheses Test 91.0630

An objective method to determine and quantify, within

known levels of risk, whether or not a hypothesis is either

accepted or rejected.

Icicle 75.0631

see ‘‘Solder Projection.’’

Identical Processing 91.0632

Fabrication that is conducted under conditions that have

demonstrated the capability to produce measurable

attributes within a narrow band of variability.

Illuminance 24.0633

Luminous ﬂux striking a surface.

Illumination 24.0634

see ‘‘Illuminance.’’

Immersion Attitude 75.1749

The positioning of an object when immersed in a solder

bath.

Immersion Conditions 95.1750

Test conditions resulting when a surface mounting device

package leads are immersed into a solder bath to check

resistance to soldering temperatures.

Immersion Plating 53.0635

The chemical deposition of a thin metallic coating over

certain basis metals that is achieved by a partial displace-

ment of the basis metal.

Impedance 21.1801

The resistance to the ﬂow of current, represented by an

electrical network of combined resistance, capacitance and

inductance reaction, in a conductor as seen by an AC

source of varying time voltage. The unit of measure is

ohms.

In-Circuit Testing 92.0636

The application of test signals directly to a device’s input

terminals and sensing the results directly from the device’s

output terminals.

Inclusions 90.0637

Foreign particles, metallic or nonmetallic, that may be

entrapped in an insulating material, conductive layer, plat-

ing, base material, or solder connection.

Indentation 45.0638

see ‘‘Dent.’’

Independent of Size 22.0639

The concept that requires the tolerance of form or position

to vary independent of, and without regard to, feature size.

Index Edge 22.0640

see ‘‘Locating Edge.’’

Index Edge Marker 22.0641

see ‘‘Locating Edge Marker.’’

Indexing Hole 22.0642

see ‘‘Tooling Hole.’’

Indexing Notch 22.0643

see ‘‘Locating Notch.’’

Indexing Slot 22.0644

see ‘‘Locating Slot.’’

Individual Test Pattern (ITP) 24.1791

A single test pattern designed and intended to serve a spe-

ciﬁc evaluation technique for determining a particular

aspect(s) of a manufacturer or manufacturing process capa-

bility.

Individual Test Specimen (ITS) 92.1790

A single test specimen that contains an individual test pat-

tern (ITP) and is used to determine a particular aspect(s) of

a manufacturer or manufacturing process capability.

June 1996 IPC-T-50F

Inductance 21.1802

The property of a conductor that allows it to store energy

in a magnetic ﬁeld induced by a current ﬂowing through it.

The unit to measure is henry.

Infrared Reflow (IR) 75.1751

Remelting of solder using infrared heating as the primary

source of energy.

Initiating 53.0645

see ‘‘Activating.’’

Inner-Lead Bond (ILB) 74.0646

The connection between a conductor on a bonding tape and

a bare die. (See also ‘‘Outer-Lead Bond.’’)

Innerlayer Connection 22.1427

A conductor that connects conductive patterns on internal

layers of a multilayer printed board, e.g. a plated-through

hole. (See also ‘‘Interfacial Connection.’’)

Inorganic Flux 75.0647

An aqueous ﬂux solution of inorganic acids and halides.

(See also ‘‘Acid Flux.’’)

Input Vector 92.0648

A set of logic values to be applied to the complete set of

input test points at any one point in time.

Insert (Connector) 37.1420

The element that holds connector contacts in their proper

arrangement and electrically insulates the contacts from

one another and from the connector shell.

Inspection Facility 92.1421

The combination of equipment, personnel, and procedure

resources that perform inspection measurements and evalu-

ations for the purpose of ascertaining the conformance of a

product to applicable speciﬁcations.

Inspection Lot 92.1422

A collection of units of product that are identiﬁed and

treated as a unique entity from which a sample is drawn

and inspected in order to determine conformance with

acceptability criteria.

Inspection Overlay 91.0649

A positive or negative transparency that is made from the

production master and that is used as an inspection aid.

Inspection Personnel 92.0650

Those individuals that inspect products for the purpose of

ascertaining the conformance of a product to applicable

speciﬁcations.

Inspection Rate 92.0651

The number of features per unit of time that can be evalu-

ated at speciﬁed false-alarm and escape-rate settings.

Instrument Bus 21.1423

Four common lines or channels to which any analog test

instrument can be connected via a multiplexer and any unit

under test circuit mode that can be connected via a scanner.

Insufficient Solder Connection 97.1424

A solder connection that is characterized by the incomplete

coverage of one or more of the surfaces of the connected

metals and/or by the presence of incomplete solder ﬁllets.

Insulation Resistance 21.1425

The electrical resistance of an insulating material that is

determined under speciﬁc conditions between any pair of

contacts, conductors, or grounding devices in various com-

binations.

Insulator 40.1813

A material with a high resistance to the ﬂow of electrical

current. (See also ‘‘Dielectric.’’)

Integrated Circuit 30.1426

A combination of inseparable associated circuit elements

that are formed in place and interconnected on or within a

single base material to perform a microcircuit function.

Inter-Test Time (ITT) 92.0652

The duration between two successive driver strobes.

Interface Resistance 37.0653

see ‘‘Contact Resistance.’’

Interfacial Connection 22.0654

A conductor that connects conductive patterns on both

sides of a printed board, e.g. a plated-through hole. (See

also ‘‘Interlayer Connection.’’)

Intergranular Corrosion 76.0655

Corrosion that occurs preferentially at grain boundaries.

Interlaminar Metallization 53.0656

Metal through-migration that is the result of metal deposi-

tion or migration along delaminated areas of the interior of

a laminate.

Interlayer Connection 22.1614

An electrical connection between two or more layers of

conductive patterns on or in a printed board.

IPC-T-50F June 1996