IPC-T-50F_.pdf.pdf - 第68页

Solder Spread Test 92.1819 The determination of a relative measure of solder ﬂux ef f i- ciency that is obtained by determining the area of spread of a speciﬁed weight of solder that has been placed on a spe- cially prep…

Slump 73.0951

The distance of a substance, e.g., adhesive, moves after it

has been applied and cured.

Smaller-the-Better Characteristic 91.1817

A parameter of quality that improves performance as its

value decreases. (See also ‘‘Larger-the-Better Characteris-

tic’’ and ‘‘Nominal-is-Best Characteristic’’).

Smear Removal 54.0953

see ‘‘Desmear.’’

Smeared Bond 74.0952

A bond impression that has been distorted or enlarged by

excess lateral movement of the bonding tool or holding

device ﬁxture.

Socket Contact 37.0954

A female connector contact.

Solarization 24.0955

A decrease in density with increased exposure.

Solder 46.0956

A metal alloy with a melting temperature that is below

427-deg.C (800-deg.F).

Solder Ball 75.0959

A small sphere of solder adhering to a laminate, resist, or

conductor surface. (This generally occurs after wave solder

or reﬂow soldering.)

Solder Bath 75.1767

A container or vessel of molten solder into which compo-

nent parts or assemblies are immersed.

Solder Bridging 75.0960

The unwanted formation of a conductive path of solder

between conductors.

Solder Bump 74.0961

A round ball of solder used to make interconnections

between a ﬂip-chip component and a base material during

controlled-collapse soldering.

Solder Coat 53.0962

A layer of solder that is applied directly from a molten sol-

der bath to a conductive pattern.

Solder Connection 75.0963

An electrical/mechanical connection that employs solder

for the joining of two or more metal surfaces. (See also

‘‘Cold Solder Connection,’’ ‘‘Disturbed Solder Connec-

tion,’’ ‘‘Excess Solder Connection,’’ ‘‘Insufficient Solder

Connection,’’ ‘‘Overheated Solder Connection,’’ ‘‘Preferred

Solder Connection,’’ ‘‘Rosin Solder Connection.’’

Solder Connection Pinhole 75.0964

A small hole that penetrates from the surface of a solder

connection to a void of indeterminate size within the sol-

der connection.

Solder Cream 46.0965

see ‘‘Solder Paste.’’

Solder Embrittlement 75.0966

The reduction in mechanical properties of a metal as a

result of local penetration of solder along grain boundaries.

Solder Fillet 75.0967

A normally concave surface of solder that is at the intersec-

tion of the metal surfaces of a solder connection.

Solder Levelling 53.1677

A solder coating process that causes redistribution and/or

partial removal of excess molted solder from a printed

board by applying sufficient heat and mechanical force.

Solder Mask 47.0973

see ‘‘Solder Resist.’’

Solder Meniscus 75.1766

The contour of a solder shape that is the result of the

surface-tension forces that take place during wetting.

Solder Paste 46.1818

Finely divided particles of solder, with additives to pro-

mote wetting and to control viscosity, tackiness, slumping,

drying rate, etc, that are suspended in a cream ﬂux.

Solder-Paste Flux 75.0957

Solder paste without the solder particles.

Solder Plug 75.0974

A core of solder in a plated-through hole.

Solder Projection 75.0975

An undesirable protrusion of solder from a solidiﬁed solder

joint or coating.

Solder Resist 47.1674

A heat-resisting coating material applied to selected areas

to prevent the deposition of solder upon those areas during

subsequent soldering.

Solder Resist Aperture 22.0977

An opening in a solder resist.

Solder Side 22.0978

The secondary side of a single-sided assembly.

June 1996 IPC-T-50F

Solder Spread Test 92.1819

The determination of a relative measure of solder ﬂux effi-

ciency that is obtained by determining the area of spread of

a speciﬁed weight of solder that has been placed on a spe-

cially prepared and ﬂuxed metallic surface.

Solder Sputter 75.0979

Extraneous fragments of solder with an irregular-shape.

Solder Terminal 37.0980

An electrical/mechanical connection device that is used to

terminate a discrete wire or wires by soldering. (See also

‘‘Bifurcated Solder Terminal,’’ ‘‘Cup Solder Terminal,’’

‘‘Hook Solder Terminal,’’ ‘‘Perforated (Pierced) Solder

Terminal,’’ and ‘‘Turret Solder Terminal.’’)

Solder Webbing 75.0981

A continuous ﬁlm or curtain of solder that is parallel to, but

not necessarily adhering to, a surface that should be free of

solder.

Solder Wicking 75.0982

The capillary movement of solder between metal surfaces,

such as strands of wire.

Solderability 75.0958

The ability of a metal to be wetted by molten solder.

Soldering 75.0968

The joining of metallic surfaces with solder and without

the melting of the base material.

Soldering Flux 75.0970

see ‘‘Flux.’’

Soldering Iron 75.1768

Common name for a tool which is used to heat components

and to reﬂow solder.

Soldering Iron Tip 75.0971

The portion of a soldering iron that is used for the applica-

tion of the the heat that melts the solder.

Soldering Oil (Blanket) 75.1529

Liquid formulations that are used in intermix wave solder-

ing and as coverings on static and wave soldering pots in

order to eliminate dross and to reduce surface tension dur-

ing the soldering operation.

Soldering-Ability 75.0969

The ability of a speciﬁc combination of components to

facilitate the formation of a proper solder joint.

Solderless Wrap 75.1530

The connecting of a solid wire to a square, rectangular, or

V-shaped terminal by tightly wrapping a solid-conductor

wire around the terminal with a special tool.

Solid-State Bond 74.0983

see ‘‘Diffusion Bond.’’

Solid-Tantalum Chip Component 32.0984

A capacitor in a leadless package whose dielectric material

is solid tantalum.

Solvent 76.0985

A non-reactive liquid substance that is capable of dissolv-

ing another substance.

Solvent Cleaning 76.0986

The removal of organic and inorganic soils using a blend

of polar and nonpolar organic solvents.

Solvent Extraction 76.1531

The removal of one or more components from a liquid

mixture by intimate contact with a second liquid that is

nearly insoluble in the ﬁrst liquid and which dissolves the

impurities and not the substance that is to be puriﬁed.

Solvent Pop 76.0987

Blistering caused by entrapped solvent.

Solvent Release 76.0988

The ability to permit solvents to evaporate.

Solvent Wash 76.0989

see ‘‘Solvent Cleaning.’’

Spacing 22.0990

see ‘‘Center-to-Center Spacing,’’ ‘‘Conductor Spacing,’’

‘‘Edge Spacing,’’ and ‘‘Pitch.’’

Spade Contact 37.0992

A type of male connector contact that consists of ﬂat metal

that mates with a fork contact.

Spalling 97.0993

The chipping, fragmenting or separation of a surface coat-

ing, or the cracking, breaking or splintering of materials,

due to heat.

Span 22.0994

The distance from the reference edge of the ﬁrst conductor

in a group of parallel conductors to the reference edge of

the last conductor in the group.

Special Cause 91.0995

A source of variation that is intermittent, unpredictable, or

unstable that affects only some of the individual values of

process output.

Specific Solderability 75.0997

The ease with which a metal or alloy can be wetted under

speciﬁc conditions.

IPC-T-50F June 1996

Specification Drawings 26.1532

A document that shows the dimensional limits that are

applicable to any or all parts of a component and any other

information that is necessary to describe the product to be

fabricated.

Specification Limits 91.0996

The requirements for judging acceptability of a particular

characteristic.

Specimens 92.1769

Samples of a material, device or circuit, representative of

the production lot, which are selected for testing.

Splay 51.0998

The tendency of a rotating drill bit to make off-center, out-

of-round, holes that are not perpendicular to the drilling

surface.

Split (Fabric) 44.0999

An opening in a fabric that results from having either the

pick or end breaking in two.

Spotting Out 96.1000

The delayed appearance of spots and blemishes on plated

or ﬁnished surfaces.

Spread 73.1001

The distance of a substance, e.g., adhesive, moves after it

has been applied at ambient conditions.

Spread (Values) 91.1002

A general concept for the extent by which values in a dis-

tribution differ from one another.

Sprocket 74.1003

A perforation along the edge of a carrier tape that is used

to move and align the tape during the tape fabrication,

assembly, and testing operations.

Spur 24.1004

An undesirable clear projection from a clear photographic

pattern or a dark projection from a dark pattern photo-

graphic.

Spurious Metal 92.1005

see ‘‘Extraneous Metal.’’

Spurious Signal 21.1006

see ‘‘Crosstalk.’’

Sputtering 53.1007

The removal of atoms from a plasma source by energetic

ion bombardement and their subsequent deposition as a

thin ﬁlm on a base material.

Stability 91.1008

The absence of special causes of variation.

Stabilization Period 57.1009

The period of time in the reﬂow proﬁle after preheat and

before the reﬂow spike occurs where the temperature of the

metals being joined are allowed to equalize.

Stable Process 91.1010

A process that is in statistical control.

Stain Proofing 76.1011

The retardation of the oxidation of a metal surface.

Staking, Adhesive (v.) 73.1012

The bonding or attaching of components, or component

elements, to a surface or together by the application of

small quantities of adhesive material.

Staking, Mechanical 75.1533

The attaching of metallic devices, such as solder terminals

and eyelets, by the upsetting of the portion of the device

that protrudes through a hole in a base material.

Stamped Printed Wiring 60.1013

Wiring that is produced by die stamping and bonding a

metal foil to a base material.

Stand-Off 70.1770

A post or protrusion used to facilitate raising a surface

mounting device above the surface of the substrate.

Standard Deviation of a Population 91.1534

A measure of the distribution of a population about a mean

value that is equal to the square root of the variance of a

process output. (See also ‘‘Sigma.’’)

Standard (Electrode) Potential 76.1535

The reversible potential from an electrode process when all

products and reactants are at unit activity on a scale in

which the potential for a standard hydrogen half-cell is

zero.

Standoff Solder Terminal 37.1014

see ‘‘Turret Solder Terminal.’’

Statistical Control 91.1015

The condition of describing a process from which all spe-

cial causes of variation have been eliminated and, thereby,

only common causes remain.

Statistical Hypothesis 91.1016

An assumption that is made about a population being

sampled. (See also ‘‘Alternative Hypothesis’’ and ‘‘Null

Hypothesis.’’)

June 1996 IPC-T-50F