IPC-T-50F_.pdf.pdf - 第90页
Terms in Classification Code Order 1 Administration 11 Data Processing 1 1.0849 Algorithm 1 1.0046 Architecture 1 1.0050 Artificial Intelligence 1 1.0058 Assembly Language 1 1.0094 Batch Processing 1 1.0102 Benchmark, Com…
91. PROCESS CONTROL/SPC
Contains terms related to techniques, methods, procedures,
and equipment used to insure that variations of the pro-
cesses used in manufacture, assembly, testing, etc. are kept
within acceptable bounds, and are continually monitored
for establishing control and capability as well as for con-
tinuous process improvement.
92. INSPECTION/TESTING
Contains terms related to techniques, methods, procedures,
and equipment used for verifying that materials and prod-
ucts received meet the intended use. Also includes terms
related to preconditioning (such as baking), testing, and
environmental and stress conditions during testing in order
to determine quality and reliability.
93. RELIABILITY FACTORS AND METHODOLOGY
Contains terms related to methods, principles and algo-
rithms used to determine and predict reliability expecta-
tions of materials, components, interconnecting structures
and assemblies/subassemblies.
94. QUALITY MANAGEMENT AND ASSURANCE
Contains terms related to methods, procedures, techniques,
systems and equipment used to assess the quality of manu-
facturers processes or their products. Includes, but not lim-
ited to, quality assurance inspections, in-process inspec-
tions, process control, ISO 9000 standards, etc.
95. COMPONENT QUALITY AND RELIABILITY
Contains terms related to techniques, methods, procedures,
and equipment intended to determine that electronic, elec-
tromechanical , or mechanical components are fit to sur-
vive the assembly , cleaning, and coating processes and
that when assembled will meet the reliability expectations
of the equipment used in its intended environment.
96. INTERCONNECTION STRUCTURE QUALITY AND
RELIABILITY
Contains terms related to techniques, methods, procedures,
and equipment intended to determine that unpopulated
interconnection structures are fit to survive the assembly,
cleaning, and coating processes and that when assembled
will meet the reliability expectations of the equipment used
in its intended environment.
97. ELECTRONIC ASSEMBLY/SUBASSEMBLY QUALITY
AND RELIABILITY
Contains terms related to techniques, methods, procedures
and equipment intended to determine that electronic assem-
blies or subassemblies (modules) are fit to survive any
equipment testing, and that the assembly will function in a
reliable fashion when the equipment is used in its intended
environment.
98. [RESERVED FOR FUTURE EXPANSION]
99. OTHER (QUALITY AND RELIABILITY ISSUES)
Contains terms related to unique quality or reliability issues
not easily identified by the assigned topics. Caution is sug-
gested when using the topic ‘‘OTHER’’ as terms contained
in this topic should be unique and have little bearing to
one-another.
June 1996 IPC-T-50F
85
Terms in Classification Code Order
1 Administration
11 Data Processing
11.0849 Algorithm
11.0046 Architecture
11.0050 Artificial Intelligence
11.0058 Assembly Language
11.0094 Batch Processing
11.0102 Benchmark, Computer
11.0232 Compiler
11.0244 Computer Numerical Control
11.0286 Control Console
11.0343 Data Logging
11.0341 Data File
11.0339 Database
11.1385 Download, Computer
11.0604 Hierarchical Database
11.0732 Machine Language
11.0800 Object-Oriented Database
11.1272 Runtime System
11.1277 Scalar Processing
11.1114 Turnkey System
14 Environmental
14.0026 Air Contamination
14.0027 Air Pollution
17 Customer/Vendor Relations
17.0095 Batch Size
17.0191 Certification
17.0285 Contract Services
17.1429 Just-in-Time (JIT)
2 Engineering and Design for Electronic Packaging
20 General (Engineering and Design Issues)
20.0158 Bulls-Eye
20.0238 Component Hole
20.1377 Design Automation
20.0441 End Item
20.0443 End Product
20.0581 Ground
20.1413 Ground Plane
20.0706 Library
20.0709 Limits of Size
20.0710 Line
20.0715 Local Fiducial
20.0028 Locating Edge
20.0717 Locating Edge Marker
20.0718 Locating Hole
20.0719 Locating Notch
20.0720 Locating Slot
20.1726 Location Hole
20.0738 Manufacturing Hole
20.0779 Mounting Hole
20.1192 Numerical Control (math.) (NC)
20.1462 Packaging Density
20.0824 Pad
20.0837 Path
20.0838 Pattern
20.0839 Pattern Area
20.1066 Thermal Conductivity
20.1067 Thermal Expansion Mismatch
21 Engineering
21.0005 Access Protocol
21.1793 Alternating Current
21.0036 Amplitude, Voltage
21.0037 Analog Circuit
21.0060 Asymmetric Stripline
21.0061 Attenuation
21.0072 Back Annotation
21.1332 Backward Crosstalk
21.1333 Balanced Transmission Line
21.0168 Bus
21.1794 Capacitance
21.0173 Capacitance Density
21.0174 Capacitive Coupling
21.0194 Characteristic Impedance
21.0213 Circuit
21.0231 Compensation Circuit
21.1360 Computer-Aided Engineering (CAE)
21.0327 Crosstalk
21.1795 Current
21.1374 Current-Carrying Capacity
21.1375 Decoupling
21.1380 Dielectric Strength
21.0378 Dielectric Fluid
21.1379 Dielectric Constant
21.1378 Dielectric Breakdown
21.0380 Digital Circuit
21.1381 Dimensional Stability
21.0385 Dipole
21.1383 Dipole Moment
21.1796 Direct Current (DC)
21.0396 Dissipation Factor
21.1797 Dual Strip Line
21.0417 Edge Rate
21.1388 Edge-Transition Attenuation
21.1798 Effective Relative Dielectric Constant
21.0422 Effective Permittivity
21.1742 Electrical Characteristics
21.0431 Electromagnetic Interference (EMI)
21.0447 Equivalent Series Resistance (ERS)
21.0458 Excitation Current
21.0473 Far-End Crosstalk
21.0489 Feature-Based Modeling
21.1398 Finite-Element Analysis (FEA)
21.0507 Finite-Element Modeling (FEM)
21.1406 Forward Crosstalk
21.0553 From-To List
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86
21.0605 High-Impedance State
21.1801 Impedance
21.1802 Inductance
21.1423 Instrument Bus
21.1425 Insulation Resistance
21.0699 Leakage Current
21.0711 Line Coupling
21.0713 Load Capacitance
21.0721 Logic
21.1440 Logic Diagram
21.1441 Logic Family
21.0726 Loss Tangent
21.0761 Microstrip
21.0762 Microwave Integrated Circuit
21.1451 Minimum Electrical Spacing
21.0795 Near-End Crosstalk
21.1177 Net
21.1178 Net List
21.1180 Node
21.1190 Normal-Mode Rejection (NMR)
21.0814 Open Circuit Potential
21.1803 Permeability
21.0846 Permittivity
21.0893 Power Dissipation
21.0894 Power Factor
21.1804 Power Plane Inductance
21.1493 Propagation Delay
21.1494 Pulse, Electronic Signal
21.1499 Reflection, Signal
21.1805 Resistance
21.1259 Rise Time
21.1300 Shield (n.)
21.1527 Shielding, Electronic
21.0932 Signal
21.0946 Skin Effect
21.1006 Spurious Signal
21.1028 Stripline
21.1030 Stub
21.1206 Subnet
21.1037 Surge
21.1065 Thermal Coefficient of Expansion (TCE)
21.1084 Threshold
21.1102 Transmission Cable
21.1103 Transmission Line
21.1105 Tri-State
21.1551 Truth-Table Testing
21.1556 Unbalanced Transmission Line
21.1143 Volume Resistivity
21.1776 Wave Length Spectrum
21.1151 Waveguide
21.1171 Wiring Elementary
22 Printed Board and Printed Board Assembly Design
22.0030 Alignment Mark
22.1325 Anchoring Spur
22.0040 Annotation
22.0049 Array
22.0051 Artwork
22.0029 Automatic Component Placement
22.0124 Automatic Conductor Routing
22.0071 Back-Bared Land
22.0076 Background (Artwork)
22.1604 Base Material Thickness
22.0115 Blind Via
22.0119 Board Thickness
22.0142 Border Area
22.0143 Border Data
22.0144 Boss
22.0163 Buried Via
22.0178 Card-Edge Connector
22.0179 Card-Insertion Connector
22.1346 Center-to-Center Spacing
22.0215 Circuitry Layer
22.1811 Clearance Hole
22.0223 Coined Lead
22.0227 Comb Pattern
22.0237 Component Density
22.1357 Component Mounting Orientation
22.0241 Component Side
22.1359 Computer-Aided Design (CAD)
22.1362 Conductive Pattern
22.0251 Conductor
22.0848 Conductor Layer
22.0256 Conductor Line
22.0257 Conductor Path
22.0258 Conductor Pattern
22.0259 Conductor Side
22.1707 Conductor Thickness
22.0261 Conductor Track
22.0269 Connector Area
22.0270 Connector Contact
22.0266 Connector, One-Part
22.0267 Connector, Two-Part
22.0276 Contact Area
22.0281 Contact Spacing
22.0287 Control Drawing
22.0297 Corner Marks
22.0323 Crop Marks
22.0325 Crosshatching
22.1372 Crossing Count
22.1373 Cumulative Tolerance
22.0344 Datum
22.0345 Datum Feature
22.0346 Datum Reference
22.0360 Dependent of Feature Size
22.0363 Design Rule
22.0362 Design-Rule Checking
22.0364 Design Spacing of Conductors
22.0365 Design Width of Conductors
22.0382 Dimensioned Hole
22.0388 Direct Dimensioning
22.0399 Don’t-Care Area
22.0419 Edge Spacing
22.0413 Edge-Board Contact(s)
22.0414 Edge-to-Edge Spacing
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