IPC-T-50F_.pdf.pdf - 第29页

Elastomeric Connector 36.0424 A pliant strip of ﬂexible material with insulating and con- ductive elements intended for providing electrical intercon- nections. Electrical Characteristics 21.1742 The distinguishing elect…

Download, Tester 92.0403

The ability of a test analyzer to provide failure analysis and

data logging information to a host computer.

Drafting Image 26.0404

An image that is part of a master drawing or layout.

Drag Soldering 75.1386

The making of soldered terminations by moving the solder

side of a supported printed board with through-hole

mounted components through the surface of a static pool of

molten solder. (see also ‘‘Dip Soldering.’’)

Drain Wire 37.0405

An uninsulated wire that is used for the electrical termina-

tion of a shield or ground plane.

Drawbridged Component 73.0406

see ‘‘Tombstoned Component.’’

Drill Body Length 51.0407

The distance from the drill point to the intersection of the

drill diameter and shoulder angle.

Drill Diameter 51.0408

The actual size of the drill body.

Drill Point Concentricity 51.0409

The total variation of the location of the chisel point of a

rotated drill shank.

Dross 75.0410

Oxide and other contaminants that form on the surface of

molten solder.

Dual Fixture 92.0411

A test ﬁxture with two separate bed-of-nails units.

Dual-Inline Package (DIP) 31.1387

A basically-rectangular component package that has a row

of leads extending from each of the longer side of its body

that are formed at right angles to a plane that is parallel to

the base of its body.

Dual-Strip Line 21.1797

A stripline signal conductor embedded between two ground

planes or between two ground conductors on the same

plane and is not necessarily centered between the ground

references.

E Glass 44.0423

A low alkali lime alumina borosilicate glass with good

electrical properties.

Edge Definition 92.0415

The reproduction ﬁdelity of a pattern’s edge relative to the

production master.

Edge Detection 92.0416

The ability to recognize (differentiate) the location of an

edge.

Edge Rate 21.0417

The rate of change in voltage with time of a logic signal

transition.

Edge Short 74.0418

An electrical short caused by carrier tape leads making

contact with the edge of a semiconductor die.

Edge Spacing 22.0419

The distance of a pattern or component body from the

edges of a printed board. (See also ‘‘Margin.’’)

Edge-Board Connector 37.0412

A connector that is used speciﬁcally for making nonperma-

nent interconnections with the edge-board contacts on a

printed board.

Edge-Board Contact(s) 22.0413

Printed contact(s) on or near any edge of a printed board,

that are used speciﬁcally for mating with edge-board con-

nectors.

Edge-to-Edge Spacing 22.0414

see ‘‘Conductor Spacing Line’’

Edge-Transition Attenuation 21.1388

The loss of a logic signal’s switching-edge sharpness that

has been caused by the absorption of the highest-frequency

components by the transmission line.

Effective Color Temperature 24.0420

A color temperature based on an approximation of an

equivalent continuous spectrum resultant source, expressed

in degrees Kelvin (K).

Effective Focal Length 24.0421

A measure of the distance from the principal point of a

magniﬁcation device’s optical system to the corresponding

focal point.

Effective Permittivity 21.0422

see ‘‘Dielectric Constant.’’

Effective Relative Dielectric Constant 21.1798

The value of the dielectric constant obtained when experi-

mentally determined in an application as opposed to mea-

sured values of sample material.

IPC-T-50F June 1996

Elastomeric Connector 36.0424

A pliant strip of ﬂexible material with insulating and con-

ductive elements intended for providing electrical intercon-

nections.

Electrical Characteristics 21.1742

The distinguishing electrical traits or properties of a com-

ponent or assembly.

Electrodeposited Foil 45.0425

A metal foil that is produced by electrodeposition of the

metal onto a material acting as a cathode.

Electrodeposition 53.0426

The deposition of a conductive material from a plating

solution by the application of electrical current.

Electroless Deposition 53.0427

The deposition of conductive material from an autocata-

lytic plating solution without the application of electrical

current.

Electroless Plating 53.0428

see ‘‘Electroless Deposition.’’

Electrolytic Cleaning 76.0429

Cleaning in which a current is passed through an alkaline

solution with the part to be cleaned being one of the elec-

trodes.

Electrolytic Deposition 53.0430

see ‘‘Electrodeposition.’’

Electromagnetic Interference (EMI) 21.0431

Unwanted radiated electromagnetic energy that couples

into electrical conductors.

Electron-Beam Bonding 74.0432

Terminations made by heating with a stream of electrons in

a vacuum.

Electroplating 53.0433

see ‘‘Electrodeposition.’’

Elementary Diagram 26.0434

A computer-generated schematic diagram with annotations.

Elongation 70.0435

The increase in length of a material that is caused by a ten-

sile load.

Embedded Component 30.0436

A discrete component that is fabricated as an integral part

of a printed board.

Emulsifying Agent 76.0437

A substance that increases the stability of an emulsion.

Emulsion 76.0439

A stable mixture of two or more immiscible liquids held in

suspension by small percentages of emulsiﬁers.

Encapsulant 76.0440

see ‘‘Potting Compound.’’

End Item 20.0441

see ‘‘End Product.’’

End Product 20.0443

An individual part or assembly in its ﬁnal completed state.

End Missing 44.0442

A very small portion of the warp in a fabric that may have

been broken in the pick-out of waste material.

Engineering Drawing 26.0444

A document that discloses the physical and functional end-

product requirements of an item by means of pictorial

and/or textual presentations.

Epoxy Glass Substrate 41.1743

A two-part epoxy resin that polymerizes spontaneously

when the two components are mixed, combined with glass

ﬁber to form a substrate

Epoxy Novolac 41.0445

A multifunctional resin having epoxy groups attached to a

novolac group(s).

Epoxy Smear 51.0446

see ‘‘Resin Smear.’’

Equivalent Series Resistance (ERS) 21.0447

A loss parameter used to compare two capacitors of equal

value in order to determine their relative effectiveness as

ﬁlters.

Escape Rate 94.0448

The ratio of the number of defective items not detected to

the total number inspected, expressed as a percentage.

Escapes 94.0449

Critical defects that are missed by an inspection system.

Etch Factor 54.0452

The ratio of the depth of etch to the amount of lateral etch,

i.e., the ratio of conductor thickness to the amount of

undercut.

June 1996 IPC-T-50F

Etchant 54.0450

A solution used to remove the unwanted portion of mate-

rial from a printed board by a chemical reaction.

Etchback 54.1389

The controlled removal by a chemical process, to a specific

depth, of nonmetallic materials from the sidewalls of holes

in order to remove resin smear and to expose additional

internal conductor surfaces.

Etched Printed Boards 60.0451

A board having a conductive pattern that was formed by

the chemical removal of unwanted portions of a conductive

foil.

Etching 54.0453

The chemical, or chemical and electrolytic, removal of

unwanted portions of conductive or resistive material. (See

Figure E-1.)

Etching Indicator 54.1390

A wedge-shaped or other speciﬁed pattern that is affixed to

a conductive foil in order to indicate the quality of etching.

Ethanol 76.1744

A solvent used in cleaning electrical assemblies (Ethylalco-

hol).

Eutectic (n.) 75.1391

An alloy having the composition indicated by the eutectic

point on an equilibrium diagram or an alloy structure of

intermixed solid constituents formed by a eutectic reaction.

Eutectic (v.) 75.1392

An isothermal reversible reaction in which on cooling a

liquid solution is converted into two or more intimately-

mixed solids, with the number of solids formed being the

same as the number of components in the system.

Eutectic Die Attach 74.0454

The mounting of a semiconductor die to a base material

with a perform of a eutectic metal alloy that is brought to

its eutectic melting temperature.

Eutrophication 76.0455

The enrichment of either fresh or salt water by a chemical

element or compound.

Excess Solder Connection 75.1393

A solder connection that is characterized by the complete

obscuring of the surfaces of the connected metals and/or by

the presence of solder beyond the connection area.

Exchange Reaction 76.1317

A chemical reaction in which atoms of the same element in

two different molecules, or in two different positions in the

same molecule, transfer places.

Excising 73.0457

The cutting of the unterminated (outer) leads of an inner-

lead bonded die in order to separate it from the carrier tape

subsequent to further assembly processing.

Excitation Current 21.0458

The root-mean-square (RMS) current ﬂowing in a selected

winding when the rated voltage and frequency is applied.

Exclusion Area 92.0459

A predetermined region where inspection is excluded.

Exfoliation 76.0460

Scaling from of a surface in ﬂakes or layers as a result of

corrosion.

Experimental Error 93.0461

A variation that is due to a measurement error, a chance

occurence, and other factors.

External Layer 22.0462

A conductive pattern on the surface of a printed board.

Extraction, Liquid-Liquid 76.0463

see ‘‘Solvent Extraction.’’

Extraction Tool 77.0464

A device used for removing a contact from a connector

body or insert, a component from a socket, or a printed

board from its enclosure.

Extraneous Metal 91.0465

Unwanted metal, usually copper, that remains on a base

material after chemical processing.

Eyelet 37.0466

A short metallic tube, the ends of which can be formed

outward in order to fasten it within a hole in material such

as a printed board.

F (Fisher) Test 94.0468

A test that attempts to determine if two populations have

the same variance.

IPC-I-001030

Figure E–1 Etching indicator

OVERETCH

ACCEPTABLE

IPC-T-50F June 1996