KE-2050_2060_使用说明书.pdf - 第21页
KE-2050/2060 Rev07 xiii 12- 11 -3 设置 ······························· 12-40 12- 11 -4 设置镀锡偏移校正参数 ······················· 12-41 12- 11 -5 设置镀锡示教初始值 ························ 12-42 12- 11 -6 手动控制 ····························…
KE-2050/2060 Rev07
第 11 章 自动校准
11-1 概要 ································· 11-1
11-2 设置组 ································ 11-3
11-2-1 XY 校正系数 ···························· 11-3
11-2-2 激光传感器高度 ·························· 11-5
11-2-3 吸嘴旋转中心 ··························· 11-7
11-2-4 贴片头偏差 ···························· 11-9
11-2-5 VCS 偏差(仅限于 KE-2060) ····················· 11-12
11-2-6 VCS2 值化阈值(仅限于 KE-2060) ··················· 11-14
11-2-7 真空校准 ····························· 11-17
第 12 章 选项元件的使用
12-1 送料器类的交换 ···························· 12-1
12-1-1 带式送料器的更换(8mm～72mm) ··················· 12-1
12-1-2 带式送料器的更换(32mm 黏附) ···················· 12-2
12-1-3 散件送料器的更换 ························· 12-3
12-1-4 杆式送料器的更换 ························· 12-4
12-2 矩阵·托盘支架的更换 ························· 12-5
12-3 矩阵·托盘更换器(MTC)的设置方法 ···················· 12-6
12-4 FPI(送料器位置指示器) ························· 12-10
12-5 坏板标记传感器 ···························· 12-11
12-6 HMS ·································· 12-12
12-7 统一更换台 ······························ 12-13
12-8 IC 回收带的操作 ···························· 12-15
12-9 夹持吸嘴 ······························· 12-18
12-10 共面性处理 ······························ 12-24
12-10-1 功能概要 ····························· 12-24
12-10-2 共面性检查内容 ·························· 12-25
12-10-3 规格概要 ····························· 12-28
12-10-4 机器设置 ····························· 12-30
12-10-5 操作选项 ····························· 12-32
12-10-6 数据编辑 ····························· 12-33
12-10-7 生产 ······························· 12-34
12-10-8 错误处理 ····························· 12-36
12-10-9 共面性检查动作概要 ························ 12-37
12-11 识别镀锡印刷补偿贴片位置的功能 ····················· 12-38
12-11-1 功能概要 ····························· 12-38
12-
11-2 规格 ······························· 12-38
xii
KE-2050/2060 Rev07
xiii
12-11-3 设置 ······························· 12-40
12-
11-4 设置镀锡偏移校正参数 ······················· 12-41
12-
11-5 设置镀锡示教初始值 ························ 12-42
12-
11-6 手动控制 ····························· 12-42
12-
11-7 镀锡校正设置流程 ························· 12-43
12-
11-8 编辑程序 ····························· 12-44
12-
11-9 生产 ······························· 12-53
12-
11-10 保存镀锡识别记录 ························· 12-54
12-
11-11 HLC 的运用方法 ·························· 12-57
12-
11-12 限制事项 ····························· 12-57
第 13 章 程序补充
13-1 元件尺寸图例 ····························· 13-1
13-2 单元代码库 ······························ 13-9
13-3 控制数据管理 ····························· 13-17
13-4 各用户组可使用的功能 ························· 13-26
13-5 生产程序的扩展名 ··························· 13-27
13-6 作为用户指定模板的可登录模式 ····················· 13-28
13-7 激光状态一览表 ···························· 13-29
13-8 开始生产时的检查 ··························· 13-31
13-9 生产时出错的详细内容 ························· 13-35
13-10 维护日志 ······························· 13-42
附录
用语集 ···································· A-1
索引
故障检修(附册)
1 操作上的故障检修
2 记录工具(Log Tool)
3 错误信息集
第 1 部 基本编
第1章 设备概要
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1-1
第2章 生产
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2-1
第3章 保养
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3-1
第 4 章 制作生产程序
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4-1
第5章 数据库
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5-1