DECAN_S2_Admin(Eng_Ver4.5).pdf - 第24页

Preface ix Do not touch the head assembly . Be careful of electric s hoc k. T urn of f the main switch before performing maintenance since fata l personnel injury may occur . Be car e ful of the residual current. Users o…

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Advanced Chip Shooter DECAN S2 Administrator’s Guide
viii
Internal Part of the Machine.
The following labels are attached on the rear part of this machine.
Figurei.3 Safety labels attached to the inside of the machine at the front
Figurei.4 Safety labels attached on the inside of the machine at the rear
Preface
ix
Do not touch the head assembly.
Be careful of electric shock.
Turn off the main switch before performing
maintenance since fatal personnel injury
may occur. Be careful of the residual
current.
Users of artificial cardiac pacemakers
must not approach the machine
If a failure occurs to an artificial cardiac
pacemaker due to the magnetic force of
linear motor inside the cover, the user may
be injured
or die. T
herefore, do not
approach the machine.
Danger of injury due to magnetic force.
If a metallic material or ornament sticks to
the machine due to the magnetic force of
linear motor inside the cover, a person may
be injured. Therefore, exercise caution.
Do not attach a magnet to the linear
scale.
Keep the linear scale clean by preventing
it from being contaminated by foreign
materials.
Advanced Chip Shooter DECAN S2 Administrator’s Guide
x
Specifications of Machine
Applicable component sizes
Vision recognition system
The sizes of components applicable to this machine are prescribed in the following table,
and is applicable to general components usage as well.
Tablei.1Configuration of the Head and Vision Recognition System
Hs Head
Flying vision
MEGA FOV 24
mm
Chips
0402 ~ □16 mm
IC, Connector
Less than □16 mm
Greater than Lead Pitch :
0.4 mm
BGA, CSP
Less than □16 mm
Greater than Ball Pitch : 0.4
mm
Maximum height
Flying vision 12 mm
FS Head
Flying vision
MEGA FOV 24
mm (Front /
Rear)
Chip 0402 ~□ 16 mm
IC, Connector
Less than □16 mm
Greater than Lead Pitch :
0.4 mm
BGA, CSP
Less than □16 mm
Greater than Ball Pitch : 0.4
mm
Upward vision
MEGA
FOV 35
mm (Rear)
IC, Connector
Less than □16 mm
Greater than Lead Pitch :
0.3 mm
Less than □32 mm
Greater than Lead Pitch :
0.4 mm
BGA, CSP
Less than □16 mm
Greater than Ball Pitch : 0.4
mm
Less than □32 mm
Greater than Ball Pitch : 0.5
mm